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1. 发明专利

JP2001096455A POLISHING DEVICE 失效
公开(公告)号：JP2001096455A
公开(公告)日：2001-04-10
申请号：JP27425999
申请日：1999-09-28
申请人： EBARA CORP , TOSHIBA CORP
发明人： ONO KOJI , OGURI SHOZO , SASABE KENICHI , KURITA MASATO , KOJIMA YASUHISA , KEIGAWA TADANORI , SHIGETA KENICHI
IPC分类号： B24B37/00 , B24B37/04 , B24B37/30 , B24B49/10 , B24B49/16 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of restraining a polished substrate from being damaged because of being broken and/or jumping out by continuously controlling the polished substrate in its polishing process. SOLUTION: The device has a substrate holding fixture 4 capable of holding both a polishing tool 1 and a polished substrate W for pressing the polished surface of the polished substrate W against the polishing tool 1, and polishes the polished substrate W by relatively moving both the polishing tool 1 and the substrate holding fixture 4. The device is furnished with a sensor 10 set at the outer side of the substrate holding fixture 4 for measuring a distance to the surface of the polishing tool 1, and with a control means detecting any change in the measured distance up to the surface of the polishing tool 1 when the polished substrate W stands over the surface of the polishing tool 1 as abnormal polishing (including jumping out of the polished substrate W).

2. 发明专利

JP2005068561A Plating device 有权
标题翻译：电镀设备
公开(公告)号：JP2005068561A
公开(公告)日：2005-03-17
申请号：JP2004354478
申请日：2004-12-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SASABE KENICHI , HONGO AKIHISA , MISHIMA KOJI , SENDAI SATOSHI
IPC分类号： C25D7/12 , C25D17/00 , C25D17/06 , C25D21/12
摘要： PROBLEM TO BE SOLVED: To provide a plating device capable of forming a metal plating uniform in film thickness which is capable of reducing the depth of a plating bath, and preventing abnormal consumption of an additive in a plating solution through oxidizing decomposition, or generation of plating defects on a surface of a substrate to be plated or in small pores and grooves formed in the surface caused by the generated oxygen.
SOLUTION: In the plating device provided with a plating bath and to perform the metal plating by bringing a plating solution Q in contact with a surface to be plated of a substrate 13 to be plated in the plating bath, the substrate 13 to be plated is arranged in the plating bath with its plating surface downward, further, an anode electrode 28 is arranged oppositely thereto with a specified clearance therebelow, and cylindrical electric field correction rings 52 each having an inside diameter smaller than the effective size to be plated in the substrate 13 to be plated are arranged between the substrate 13 to be plated and the anode electrode 28 so that the upper ends of the electric field correction rings 52 are made to approach the substrate 13 to be plated, and also, the center of each electric field correction ring 52 and the center of the substrate 13 to be plated are located on almost the same axis.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够形成均匀的金属电镀的电镀装置，其能够降低电镀槽的深度，并且通过氧化分解防止电镀溶液中的添加剂的异常消耗，或在要被镀的基板的表面上或在由所生成的氧引起的表面形成的小孔和沟槽中产生电镀缺陷。解决方案：在具有电镀槽的电镀装置中，通过使电镀液Q与要镀在基板13的被镀表面接触的方式进行金属镀层，将基板13〜电镀在电镀槽中，其镀层表面向下，另外阳极电极28与其下方具有特定间隙相对设置，圆柱形电场校正环52的内径小于要镀覆的有效尺寸在要被电镀的基板13中，布置在要被电镀的基板13和阳极电极28之间，使得电场校正环52的上端接近要被电镀的基板13，每个电场校正环52和要被电镀的衬底13的中心位于几乎相同的轴上。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2000225552A GROOVING DEVICE BY WIRE SAW 失效
公开(公告)号：JP2000225552A
公开(公告)日：2000-08-15
申请号：JP3184699
申请日：1999-02-09
申请人： EBARA CORP
发明人： SASABE KENICHI
IPC分类号： B24B27/06
摘要： PROBLEM TO BE SOLVED: To provide a grooving device by a wire saw which can form a groove of uniform depth in a short time by a simple constitution. SOLUTION: In a grooving device by a wire saw forming a groove in a surface of a thin plate-shaped workpiece 10 by pressing it to running wires 11, this device is constituted by arranging a permanent magnet or electromagnet 12 on the side mutually opposed to the wires 11 by interposing the workpiece 10 there between, so as to press the wires 11 consisting of magnetic material to a surface of the workpiece 10 by magnetic force of the permanent magnet or electromagnet 12. In this way, pressing force to the surface of the workpiece 10 of the wires 11 can be uniformly generated in the center and both end parts, and the grooves of prescribed uniform depth can be formed in a short time in the surface of the workpiece 10.

4. 发明专利

JP2000233357A GROOVING DEVICE OF WORKPIECE BY WIRE SAW 失效
公开(公告)号：JP2000233357A
公开(公告)日：2000-08-29
申请号：JP3276699
申请日：1999-02-10
申请人： EBARA CORP
发明人： SASABE KENICHI , MORISAWA SHINYA
IPC分类号： B24B27/06 , B28D5/00 , B28D5/04
摘要： PROBLEM TO BE SOLVED: To provide a grooving device of a workpiece by a wire saw capable of grooving grooves having uniform depth with high precision in a short time without causing a crack in the workpiece by curving a surface of the workpiece like a thin plate made of a hard and fragile material such as a semiconductor wafer. SOLUTION: This grooving device of a workpiece by a wire saw forming a groove on a surface of the workpiece by applying the workpiece against a running wire is provided with a workpiece fixing mechanism 10 fixing the workpiece 1 by curving it in such a way that its central part protrudes on a side of the wire 2 from the surroundings and a workpiece pushing out mechanism (lifting mechanism 30, etc.), applying the curved and fixed workpiece 1 against the wire 2 to groove a groove on the surface of the workpiece 1. The workpiece fixing mechanism 10 is provided with a mechanism which forms the curved surface of the workpiece 1 into a curved face having curvature central axis crossing running direction of the wire 2 orthogonally and a function setting an arbitrary curve amount of the workpiece.

5. 发明专利

JPH11200096A PLATING JIG FOR WAFER 失效
公开(公告)号：JPH11200096A
公开(公告)日：1999-07-27
申请号：JP31236298
申请日：1998-11-02
申请人： EBARA CORP
发明人： YOSHIOKA JUNICHIRO , SAITO NOBUTOSHI , SASABE KENICHI
IPC分类号： C25D7/12 , C25D17/08
摘要： PROBLEM TO BE SOLVED: To provide a plating jig for a wafer which is capable of diminishing electric resistance, facilitate mounting work, allows easy change of the positions and number of pieces of energizing pins, does not require a space for housing, wiring, etc., and may be formed compact. SOLUTION: This plating jig includes a first holding member 10 and second holding member 40 holding the front and rear surfaces of the wafer 100. The second holding member 40 has an opening 41 to expose the surface to be electroplated of the wafer 100 and is provided with a seal packing 43 between the first holding member 10 and second holding member 40 on the circumference of the opening 41. The region B where the plating liquid does not infiltrate is formed by this seal packing 43. Further, an energizing 60-1 is mounted at the part of the region B. The energizing member 60-1 comprises an annular conducting part 61-1 mounted at the second holding member 40 side and the energizing pin 63-1 pressed to the wafer 100 by projecting from the conducting part 61-1 toward the first holding member 10 side.

6. 发明专利

JP2001049495A PLATING DEVICE, AND PLATING METHOD 失效
公开(公告)号：JP2001049495A
公开(公告)日：2001-02-20
申请号：JP22889899
申请日：1999-08-12
申请人： EBARA CORP
发明人： SASABE KENICHI , HONGO AKIHISA , SENDAI SATOSHI , TOMIOKA MASAYA , TSUDA KATSUMI , KUMEGAWA MASAYUKI
IPC分类号： C25D5/08 , C25D7/00 , C25D7/12 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a jet plating device which is free from any deposition of a plating solution on a cathode electrode pin, and capable of plating a whole surface to be plated of a substrate in an excellent condition without bubbles while preventing any metallic pollution of sides or a reverse surface of the substrate, and its plating method. SOLUTION: This plating device comprises a cylindrical plating tank 12 to maintain a plating solution 10, a plating solution ejection part 18 to form a jet of the plating solution 10 directed upward by the plating solution 10 to be fed from the outside of the plating tank 12, a substrate holding part 14 to hold a substrate W in an attachable/detacbable manner and horizontally arrange the substrate so that a lower surface to be plated of the substrate W is brought into contact with the jet of the plating solution 10, and a drive part 44 having a rotating mechanism 38 and an elevating/lowering mechanism 42 to rotate and elevate/lower the substrate holding part 14. At the position where the substrate holding part 14 is lowered by the elevating/ lowering mechanism 42, the lower surface to be plated of the substrate W can be plated. At the position where the substrate holding part 14 is elevated by the elevating/ lowering mechanism 42, the substrate W can be attached to the substrate holding part 14, or the substrate W can be detached from the substrate holding part 14.

7. 发明专利

JP2000319797A PLATING DEVICE 失效
公开(公告)号：JP2000319797A
公开(公告)日：2000-11-21
申请号：JP22530899
申请日：1999-08-09
申请人： EBARA CORP
发明人： SASABE KENICHI , HONGO AKIHISA , MISHIMA KOJI , SENDAI SATOSHI
IPC分类号： C23C18/38 , C25D7/12 , C25D17/00 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a plating device capable of forming a metal plating uniform in film thickness which is capable of reducing the depth of a plating tank, and preventing abnormal consumption of an additive in a plating solution through oxidizing decomposition, or generation of plating defects on a surface of a substrate to be plated or in small pores and grooves formed in the surface caused by the generated oxygen. SOLUTION: In the plating device provided with a plating bath and to execute the metal plating by bringing a plating solution in contact with a surface to be plated of a substrate to be plated in the plating bath, a plating bath 10 comprises a plating solution chamber 20 formed between a substrate 13 to be plated which is arranged with its plating surface downward and a porous plate 21 arranged oppositely thereto with a specified clearance therebelow, and a flat plating solution introducing chamber 22 formed below the porous plate 21, and the plating solution Q flows into a plating solution introducing chamber 22 in the horizontal direction, the flow of the plating solution Q which is perpendicular to the plating surface of the substrate 13 is formed through pores 21a in the porous plate 21, and guided to the plating solution chamber 20.

8. 发明专利

JP2000108012A WIRE SAW 失效
公开(公告)号：JP2000108012A
公开(公告)日：2000-04-18
申请号：JP28172598
申请日：1998-10-02
申请人： EBARA CORP
发明人： SASABE KENICHI
IPC分类号： B24B27/06 , H01L21/301 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a wire saw for maintaining the orthogonal abutting state of a wire to respective rollers as much as possible, and moreover facilitating the winding of the wire even increasing a working pitch. SOLUTION: A wire W is made travelable orthogonally to working rollers between the rollers 3a and 3b, and orthogonally to guide rollers between the rollers 4a and 4b, and the wire W traveling between the rollers 4a and 4b is made tiltedly travelable so as to be slipped by one pitch Pw part of wire guide grooves 5 provided on the rollers 3a and 3b from the wire W traveling between the rollers 3a and 3b.

9. 发明专利

JP2001049499A PLATING DEVICE 失效
公开(公告)号：JP2001049499A
公开(公告)日：2001-02-20
申请号：JP22889999
申请日：1999-08-12
申请人： EBARA CORP
发明人： SASABE KENICHI , HONGO AKIHISA , SENDAI SATOSHI , TOMIOKA MASAYA , TSUDA KATSUMI , KUMEGAWA MASAYUKI
IPC分类号： H01L21/768 , C25D7/12 , C25D17/00 , C25D21/10 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a plating device to set the uniform and sufficiently large relative speed between a surface to be plated of a substrate and a plating solution over a whole area of the surface to be plated of the substrate. SOLUTION: This plating device comprises a cylindrical plating tank 12 to maintain a plating solution 10, a substrate holding part 14 to hold a substrate W in an attachable/detachable manner and horizontally hold the substrate so that a lower surface to be plate of the substrate W is brought into contact with the plating solution 10 in the plating tank 12, a relative speed generating means 38 to generate the variable relative speed between the substrate W held by the substrate holding part 14 and the plating solution 10, and a control part 52a to control the relative speed generating means 38.

10. 发明专利

JP2001049489A PLATING DEVICE 失效
公开(公告)号：JP2001049489A
公开(公告)日：2001-02-20
申请号：JP22889799
申请日：1999-08-12
申请人： EBARA CORP
发明人： SASABE KENICHI , HONGO AKIHISA , SENDAI SATOSHI , TOMIOKA MASAYA , TSUDA KATSUMI , KUMEGAWA MASAYUKI
IPC分类号： C25D5/08 , C25D5/04 , C25D7/12 , C25D17/00 , C25D17/10 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a plating device to form a uniform plating film by smoothly feeding a jet of a plating solution ejected from a plating solution ejection pipe to a surface to be plated of a substrate, and implementing the uniform electrolysis on the surface to be plated. SOLUTION: This plating device comprises a cylindrical plating tank 12 to maintain a plating solution 10, a plating solution ejection pipe 18 which is connected to a center of a bottom part of the plating tank 12 to form a jet of the plating solution directed upward, a substrate holding part 14 to hold a substrate W in an attachable/detachable manner and to arrange the surface to be plated of a lower side of the substrate so as to be brought into contact with the jet of the plating solution 10, and an anode plate 16 arranged in the plating solution 10 in the plating tank 12. A flow straightening guide 32 which is expanded in a trumpet shape and extended upward along the streamline of the jet of the plating solution from an upper end of the plating solution ejection pipe 18 is arranged inside the plating tank 12.

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