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    • 81. 发明专利
    • Surface-emitting laser
    • 表面发射激光
    • JP2011044447A
    • 2011-03-03
    • JP2009189712
    • 2009-08-19
    • Canon Incキヤノン株式会社
    • UCHIDA TAKESHI
    • H01S5/183
    • H01S5/18313B82Y20/00H01S5/0092H01S5/0207H01S5/0604H01S5/0683H01S5/105H01S5/18341H01S5/18388H01S5/34306
    • PROBLEM TO BE SOLVED: To provide a surface-emitting laser capable of monitoring a light quantity on a substrate side if a substrate serving as an absorption layer for an oscillation wavelength is used.
      SOLUTION: The surface-emitting laser includes a plurality of semiconductor layers including an active layer laminated on a substrate and emits output light vertically to the substrate. It has a wavelength conversion layer between the substrate and a laser light oscillation part constituted of the plurality of semiconductor layers including the active layer. The wavelength conversion layer is structured to be capable of converting a first wavelength of laser light emitted from the laser light oscillation part into a second wavelength transmitting through the substrate.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:如果使用用作振荡波长的吸收层的衬底,则提供能够监测衬底侧的光量的表面发射激光器。 解决方案:表面发射激光器包括多个半导体层,包括层叠在基板上的有源层,并且垂直于衬底发射输出光。 在基板和由包括活性层的多个半导体层构成的激光振荡部分之间具有波长转换层。 波长转换层被构造成能够将从激光振荡部发射的激光的第一波长转换为透过基板的第二波长。 版权所有(C)2011,JPO&INPIT
    • 83. 发明专利
    • Method of manufacturing semiconductor light-emitting element
    • 制造半导体发光元件的方法
    • JP2010109015A
    • 2010-05-13
    • JP2008277315
    • 2008-10-28
    • Panasonic CorpPanasonic Electric Works Co Ltdパナソニック株式会社パナソニック電工株式会社
    • YAMAE KAZUYUKIFUKUSHIMA HIROSHIYASUDA MASAHARUIWAHASHI TOMOYAKAMEI HIDENORIMAEDA SHUSAKU
    • H01L33/32
    • H01S5/0207H01L33/0079H01L33/0095H01L33/32H01S5/0201H01S5/0202H01S5/0213H01S5/0216H01S5/0217H01S5/0224H01S5/02492H01S5/32341
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light-emitting element for suppressing occurrence of microcracks in a multilayer nitride semiconductor layer and improving junction reliability between the multilayer nitride semiconductor layer and a support substrate. SOLUTION: After performing crystal growth of the multilayer nitride semiconductor layer 2 having a lamination structure of a buffer layer 21, an n-type nitride semiconductor layer 22, a luminous layer 23, and a p-type nitride semiconductor layer 24 to one surface side of a transparent crystal wafer 1 made of a sapphire substrate, the multilayer nitride semiconductor layer 2 is joined to one surface side of a support wafer 30 that becomes the foundation of a support substrate 3. Then, a cutoff groove 6 is formed to reach at least the multilayer nitride semiconductor layer 2 from the other surface side of the transparent crystal wafer 1. After that, light is applied from the other surface side of the transparent crystal wafer 1 to separate the transparent crystal wafer 1 from the multilayer nitride semiconductor wafer 2 before dicing along the cutoff groove 6. COPYRIGHT: (C)2010,JPO&INPIT
    • 解决的问题:提供一种制造用于抑制多层氮化物半导体层中的微裂纹发生的半导体发光元件的方法,并提高多层氮化物半导体层与支撑衬底之间的结可靠性。 解决方案:在具有缓冲层21,n型氮化物半导体层22,发光层23和p型氮化物半导体层24的叠层结构的多层氮化物半导体层2进行晶体生长之后, 由蓝宝石衬底制成的透明晶片1的一个表面侧,将多层氮化物半导体层2接合到作为支撑衬底3的基础的支撑晶片30的一个表面侧。然后形成切断槽6 从透明晶体晶片1的另一个表面侧至少到达多层氮化物半导体层2.然后,从透明晶体晶片1的另一个表面侧施加光,以将透明晶片1与多层氮化物 半导体晶片2在切割槽6之前切割。版权所有(C)2010,JPO&INPIT