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21. 发明专利

JP2003324082A Polishing equipment 有权
标题翻译：抛光设备
公开(公告)号：JP2003324082A
公开(公告)日：2003-11-14
申请号：JP2003152308
申请日：2003-05-29
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide polishing equipment which can be installed in a clean room which can prevent contamination effectively.
SOLUTION: The polishing equipment is provided with: an outer fence unit, a bulkhead 11 which partitions the inside of the outer fence into a first chamber 27 and a second chamber 26 and has an opening for passing a wafer 16; a load unload block 7 which delivers a cassette 13 for accommodating the wafers; a polishing block 6 which is arranged in the first chamber 27 and has a turn table 23 wherein an abrasive cloth is stuck on an upper surface and a top ring 22 for pressing the wafer 16 against the abrasive cloth; a cleaning block 9 which is arranged in the second chamber 26 and has a cleaning unit for cleaning the wafer 16 after polishing, while supplying cleaning liquid, and a drying unit for drying the wafer 16 after cleaning; an exhaust means for performing exhaust from the first chamber 27; and an exhaust means for performing exhaust from the second chamber 26.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供可以安装在洁净室中的可以有效防止污染的抛光设备。解决方案：抛光设备设有：外挡板单元，将外挡板内侧分隔成第一室27和第二室26的隔板11，并具有用于通过晶片16的开口; 负载卸载块7，其输送用于容纳晶片的盒13; 抛光块6布置在第一室27中，并且具有转台23，其中研磨布粘附在上表面上，顶环22用于将晶片16压靠在研磨布上; 清洁块9布置在第二室26中，并且具有用于在抛光之后清洁晶片16同时供应清洁液体的清洁单元和用于在清洁之后干燥晶片16的干燥单元; 用于从第一室27进行排气的排气装置; 以及用于从第二室26排气的排气装置。（C）2004，JPO

22. 发明专利

JP2002141318A METHOD AND DEVICE FOR POLISHING 审中-公开
公开(公告)号：JP2002141318A
公开(公告)日：2002-05-17
申请号：JP2001287909
申请日：2001-09-20
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , AOKI RIICHIRO , YAJIMA HIROMI , KODERA MASAKO , MISHIMA SHIRO , SHIGETA ATSUSHI , HIROSE MASAYOSHI , KIMURA NORIO , ISHIKAWA SEIJI
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device which can adopt a cluster structure, which integrates a plurality of functions, and has a means for handling a polishing object such as a clean semiconductor wafer and a means for handling a dirty polishing object separately, and to provide a polishing method. SOLUTION: In the polishing device after a polishing object S is carried in and polished, it is washed and a clean polishing object S is carried out. It has a load part 11 for mounting the polishing object S to be polished, at least one polishing part 13 for polishing the polishing object S carried from the load part 11, at least one washing part 15 for washing and drying the polished object S, an unload part 12 for mounting the clean and dried object S after being washed, and a carrying robot 10 for carrying the object S inside a device. The polishing part 13 has a plurality of turn tables, and polishing conditions differ in a plurality of turn tables.

23. 发明专利

JPH11207606A GRINDING DEVICE 失效
公开(公告)号：JPH11207606A
公开(公告)日：1999-08-03
申请号：JP2392498
申请日：1998-01-21
申请人： EBARA CORP , TOSHIBA CORP
发明人： TOGAWA TETSUJI , SAKURAI TAKESHI , TAKADA NOBUYUKI , KODAMA SHOICHI , YAJIMA HIROMI
IPC分类号： B24B37/00 , B24B55/03 , B24B57/02 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a grinding device capable of performing grinding by stably supplying grinding fluid irrespective of the state of a grinding fluid supply source. SOLUTION: In a grinding device P including a grinding part for pressing an article to be ground to a grinding tool 30 for grinding and a grinding fluid pipe 46 connected to an external grinding liquid supply device 36 for supplying grinding fluid to the grinding part, the grinding fluid pipe 46 has a grinding liquid suction means 48 provided to taking in the desired flow rate of grinding fluid from the grinding fluid supply device 36. This grinding fluid supply device 36 is provided with a stock fluid tank 62 for storing stock fluid, a diluted fluid tank 64 for storing diluted fluid used for diluting the stock fluid to a specified concentration, and a mixture tank 70 for merging raw materials supplied from the tanks 62 and 64 through pipes 66 and 68 and forming grinding fluid having a specified concentration.

24. 发明专利

JPH10286761A POLISHING DEVICE FOR SUBSTRATE 失效
公开(公告)号：JPH10286761A
公开(公告)日：1998-10-27
申请号：JP11015097
申请日：1997-04-11
申请人： EBARA CORP , TOSHIBA CORP
发明人： ITO KENYA , AIZAWA HIDEO , YAJIMA HIROMI , SHIGETA KENICHI , TATEYAMA YOSHIKUNI
IPC分类号： B23Q37/00 , B24B37/00 , B24B41/02
摘要： PROBLEM TO BE SOLVED: To form a polishing device compact to be installed in a narrow space, and improve convenience for transport and maintenance. SOLUTION: A first frame 10a on which a polishing table 16 having a polishing tool 48 on an upper surface is installed, and a second frame 10b on which a top ring device 12 having a rotatable top ring head 24 to hold a substrate while pressing a subject surface of the substrate to be polished to a polishing table 16 with a prescribed pressure is installed are composed as separate bodies. The first frame 10a and the second frame 10b are stacked on a base frame 10d in order to be assembled.

25. 发明专利

JPH08118231A POLISHING DEVICE 失效
公开(公告)号：JPH08118231A
公开(公告)日：1996-05-14
申请号：JP27985994
申请日：1994-10-19
申请人： EBARA CORP , TOSHIBA CORP
发明人： NISHI TOYOMI , TSUJIMURA MANABU , TAKAHASHI YOSHIMIZU , YAJIMA HIROMI , AOKI RIICHIRO , IMOTO YUKIO , KODAMA SHOICHI , HIUGA KAZUAKI , KONO YOSHISUKE , NISHIMURA TAKANOBU
IPC分类号： B24B37/20 , B24B37/24 , H01L21/304 , B24B37/00
摘要： PURPOSE: To provide a polishing device on which a cloth cartridge mountable on and demountable from a turntable is hardly deformed. CONSTITUTION: In this polishing device, a cloth cartridge 1 formed by sticking a cloth 3 on a pedestal 2 is installed to a turntable 4 allowable to mount and demount, a polishing liquid is dropped to the cloth 3 on the upper surface of the cloth cartridge 1 rotating together with the turntable 4, and a work is pressed on the upper surface of the cloth 3 so as to polish the contact surface between the work and the cloth 3. And in this polishing device, the cloth cartridge 1 is fixed to the turntable 4 both at the peripheral part and at the center.

26. 发明专利

JP2001096457A POLISHING DEVICE AND ADJUSTING METHOD FOR POLISHING DEVICE 失效
公开(公告)号：JP2001096457A
公开(公告)日：2001-04-10
申请号：JP27526299
申请日：1999-09-28
申请人： TOSHIBA MICRO ELECTRONICS , TOSHIBA CORP
发明人： YAJIMA HIROMI , SHIGETA KENICHI , KOJIMA YASUHISA , IGUCHI KOJI
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and its adjusting method, capable of facilitating the replacement of a cushioning material layer when the polishing device is to be adjusted, and of being high in operating performance, and in yield in wafer manufacture without generating polishing scraps by boring holes in the cushioning material layer. SOLUTION: In this invention, the wafer supporting part of a polishing device is furnished with a flat plate part 5 having back pressure gas introducing holes 7 and 8 introducing back pressure gas into a wafer 4, and with a cushioning material layer 6, and it is characteristic that the back pressure gas introducing hole 8 provided for the cushioning material layer 6 is greater in cross sectional area than the back pressure gas introducing hole 7 provided for the flat plate part 5.

27. 发明专利

JP2002110598A CMP APPARATUS 失效
公开(公告)号：JP2002110598A
公开(公告)日：2002-04-12
申请号：JP2000292653
申请日：2000-09-26
申请人： TOSHIBA CORP
发明人： YAJIMA HIROMI , SHIGETA KENICHI
IPC分类号： B24B37/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an apparatus which can hold a mix ratio of a polishing mixture solution always at a predetermined value, and can perform polishing operation with a good accuracy without using non-production wafer for confirmation of a processing rate to thereby improve a rate of operation in the apparatus and improve a productivity in a polishing step. SOLUTION: A processing solution dropping part, which has a plurality drop ports arranged dense from which a plurality of sorts of processing solutions are dropped on a platen, is formed at a tip end of a processing solution supply piping, so that the plurality of sorts of processing solutions drop from the drop ports into a platen rotation direction onto an upstream vicinity of a processing point of a wafer to be polished. Thereby since the processing solutions reach the processing point with a mixture ratio of the plurality of sorts of processing solutions held at a predetermined value, accurate polishing can be realized without using a non-production wafer for confirmation of a processing rate.

28. 发明专利

JP2000188319A CONVEYING APPARATUS 失效
公开(公告)号：JP2000188319A
公开(公告)日：2000-07-04
申请号：JP36512698
申请日：1998-12-22
申请人： TOSHIBA CORP
发明人： KODAMA SHOICHI , YAJIMA HIROMI
IPC分类号： H01L21/677 , B65G49/07 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a conveying apparatus which is improved in wafer conveying capability by decreasing the frequency of a track car travel over the whole conveyance path. SOLUTION: This conveying apparatus has an annular conveyance path 10, laid between semiconductor manufacturing apparatuses and a mechanism mounted with storage containers 21 and 22, capable of containing members used for the semiconductor manufacturing apparatuses and is equipped with track cars 11 and 12, which travel along the conveyance path as a track and a controller which controls setting and collecting operation for the storage containers 21 and 22 to and from the semiconductor manufacturing apparatuses as conveyance destinations. Also the track cars 11 and 12 are provided with coupling mechanisms 13 which couple the track cars for constituting a connected track car, which plural track cars made connectable by the coupling mechanism 13, and the controller uses a specific track car of the connected track car to collect the storage containers 21 and 22, and the rest track car is controlled for the setting of the storage containers 21 and 22.

29. 发明专利

JPH0817768A MANUFACTURE OF SEMICONDUCTOR DEVICE AND DEVICE FOR EFFECTING THE MANUFACTURE 失效
公开(公告)号：JPH0817768A
公开(公告)日：1996-01-19
申请号：JP15016194
申请日：1994-06-30
申请人： TOSHIBA CORP
发明人： KODERA MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , YAJIMA HIROMI , AOKI RIICHIRO
IPC分类号： H01L21/306 , B24B37/013 , H01L21/304
摘要： PURPOSE:To provide a method for manufacturing a semiconductor device and a device for effecting the method for properly flattening a film to be polished by measuring the film thickness of the film to be polished after polishing automatically and at the same time setting an optimum polishing time. CONSTITUTION:After a wafer 10 is polished, it is moved to a wafer folder 23 while the wafer 10 is sucked at the tipper portion of an optical sensor 31 and for example visible rays are applied to the film to be polished of the wafer 10 from the optical sensor 31 for measurement. The polishing time of the wafer to be polished next is set by a control part 40 based on the actually measured film thickness.

30. 发明专利

JPH0747201A VAPORIZATION SYSTEM 失效
公开(公告)号：JPH0747201A
公开(公告)日：1995-02-21
申请号：JP21501993
申请日：1993-08-06
申请人： TOSHIBA CORP , CKD CORP
发明人： NAGAMATSU TAKAHITO , YOSHIDA TAKAMITSU , YAJIMA HIROMI , AOKI RIICHIRO , SUDO YOSHIHISA , ITO MINORU
IPC分类号： B01D1/00 , B01J7/00 , B01J7/02 , C23C16/44 , C23C16/448 , H01L21/31
摘要： PURPOSE:To provide a vaporizer and a vaporization system by means of which a material being a liq, at ordinary temp. and ordinary pressure can be fed into a vapor phase reaction tank etc., by controlling precisely vaporization of the material. CONSTITUTION:This vaporization system is constituted of a quantitative pump 3, a check valve 2 and a vaporizer 1. The quantitative pump 3 feeds a specified amt. of TEOS to the check valve 2 by up and down movement of a rod 22 set through a bellows 23. At this time, a valve body 32 of the check valve 2 is separated from a valve seat 33 and TEOS is sent to the vaporizer. As a flat plate 11, etc., are heated by means of an electric heater 12 in the vaporizer 1, TEOS is surely vaporized and is mixed with an assist and it is fed as a mixed gas into a gas phase reaction tank, etc. Therefore, TEOS is stably vaporized without generating reliquefaction on the inner wall, etc., of the vaporizer 1 to contribute to a stable operation of the process and the yield by the process is also improved.

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