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1. 发明专利

JP2004235664A Polishing apparatus 有权
公开(公告)号：JP2004235664A
公开(公告)日：2004-08-19
申请号：JP2004116866
申请日：2004-04-12
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , IMOTO YUKIO , KODAMA SHOICHI , AOKI RIICHIRO
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus, which complies with the blocking of the apparatus, and is excellent in productivity, expandability, maintenance property, and adaptability to users. SOLUTION: The polishing apparatus, which polishes a wafer, wherein the polishing apparatus comprises a load/unload block 5, which loads a cassette housing the wafer 1, a polishing block 7, which polishes the wafer 1, a cleaning block 8, which cleans the wafer 1, a robot 15, which transfers the wafer 1 and a control block 9, which stores a relative position between the cassette of the load/unload block 5 and the robot 15 and a relative position between the cleaning block 8 and the robot 15 by teaching, each block is independently disposed and the layouts can be changed. COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2009272655A Polishing apparatus 有权
标题翻译：抛光装置
公开(公告)号：JP2009272655A
公开(公告)日：2009-11-19
申请号：JP2009190599
申请日：2009-08-20
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To provide a polishing apparatus which can be installed in a clean room capable of efficiently preventing contaminations. SOLUTION: The polishing apparatus is provided with a polishing block 6 for polishing a target to be polished, a cleaning block 9 for cleaning and drying the target after polishing, a transporter 8 for transporting the polished target from the polishing block 6 to the cleaning block 9, a first chamber 27 wherein the polishing block 6 is disposed, and a second chamber 26 wherein the transporter 8 and the cleaning block 9 are disposed. The polishing block 6 has a cleaner which includes a turnable 23 and a top ring 22 for supporting the target on the turnable 23 and roughly cleans the polished target on the top ring 22. After being roughly cleaned, the target is removed from the top ring 22 and then is transported to the cleaning block 9 by the transporter 8 and is cleaned and dried in the cleaning block 9. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以安装在能够有效防止污染的洁净室中的抛光装置。解决方案：抛光装置设置有用于抛光抛光对象物的抛光块6，抛光后清理和干燥靶材的清洁块9，用于将抛光对象从抛光块6传送到清洁块9，其中设置有抛光块6的第一室27和其中设置有运送器8和清洁块9的第二室26。抛光块6具有清洁器，其包括可转动23和用于将目标物支撑在可转动件23上的顶环22，并大致清洁顶环22上的抛光目标。在粗略清洁之后，将靶从顶环 22，然后通过运送器8运送到清洁块9，并在清洁块9中进行清洁和干燥。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2002184735A SEMICONDUCTOR WAFER-POLISHING DEVICE AND METHOD THEREFOR 审中-公开
公开(公告)号：JP2002184735A
公开(公告)日：2002-06-28
申请号：JP2001363793
申请日：2001-11-29
申请人： EBARA CORP , TOSHIBA CORP
发明人： SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , KODERA MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer-polishing device that can be installed in a clean room, and can be unloaded to a next process by a wafer carrier that is used in a normal clean room after cleaning and drying the semiconductor wafer after polishing without causing the clean room to be contaminated, and to provide a method for polishing the semiconductor wafer. SOLUTION: A polishing section 2 for polishing the semiconductor wafer 4 by retaining the semiconductor wafer in an enclosure 1 having a sidewall by top ring 5 and at the same time pressing the semiconductor wafer to a turntable 3, and a washing section 30 for washing the semiconductor wafer 4 are housed. A partition wall 22 for separating the polishing section 2 from the cleaning section 30 is provided, and at the same time a transport mechanism 24 is provided to carry the semiconductor wafer 4 after polishing from the polishing section 2 to the cleaning section 30 via an opening 22a of the partition wall 22, and exhaust systems 46 and 47 are provided to evacuate air independently from the polishing section 2 and the cleaning section 30.

4. 发明专利

JPH08243916A POLISHING DEVICE 失效
公开(公告)号：JPH08243916A
公开(公告)日：1996-09-24
申请号：JP34479795
申请日：1995-12-06
申请人： EBARA CORP , TOSHIBA CORP
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： B23Q11/00 , B24B37/00 , B24B37/04 , B24B55/06 , H01L21/304
摘要： PURPOSE: To provide a polishing device which can effectively prevent pollution and can be installed in a clean room. CONSTITUTION: A polishing device is provided with a loading and unloading block 7 to deliver a cassette housing a wafer, a carrying block 8 to move the wafer from the cassette, a polishing block 6 to polish the wafer, a cleaning block 9 to clean and dry the wafer after it is polished and a control block 10 to control operation of the device, and has a wall plate on the periphery and the ceiling so as to cover the whole of these, and is constituted in a box shape. According to this polishing device, a semiconductor wafer is polished by the polishing block 6, and the polished semiconductor wafer is transferred to the cleaning block 9 from the polishing block. The semiconductor wafer is cleaned and dried. Therefore, the semiconductor wafer is taken out of the polishing device in a cleaned and dried condition.

5. 发明专利

JPH08150559A SEMICONDUCTOR WAFER POLISHING DEVICE 失效
公开(公告)号：JPH08150559A
公开(公告)日：1996-06-11
申请号：JP31928994
申请日：1994-11-29
申请人： EBARA CORP , TOSHIBA CORP
发明人： SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIROU , KODERA MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： B24B37/04 , H01L21/304
摘要： PURPOSE: To provide a semiconductor wafer polishing device which can be set in a clean room and which is capable of discharging a semiconductor wafer to a following process by wafer carrier normally used in the clean room after washing and drying the semiconductor wafer after polishing without contaminating the clean room. CONSTITUTION: A polishing part 2 to polish a semiconductor wafer 4 by way of pressing the semiconductor wafer 4 on a turn table 3 while holding the semiconductor wafer 4 by a top ring 5 and a washing part 30 to wash the semiconductor wafer 4 are stored in a case body 1 having a side wall. A bulkhead 22 to separate the polishing part 2 and the washing part 30 is provided, a carrier mechanism to carry the semiconductor wafer 4 after polishing from the polishing part 2 to the washing part 30 through an opening 22a of the bulkhead 22 is provided, and exhaust systems 46, 47 to respectively independently exhaust from the polishing part 2 and the washing part 30 are provided.

6. 发明专利

JP2006191030A Polishing machine 有权
标题翻译：抛光机
公开(公告)号：JP2006191030A
公开(公告)日：2006-07-20
申请号：JP2005363897
申请日：2005-12-16
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： H01L21/304 , B24B37/04 , B24B55/06 , B65G49/00
摘要： PROBLEM TO BE SOLVED: To provide a polishing machine which can be installed in a clean room that can efficiently prevent contamination. SOLUTION: The polishing machine is provided with a loading/unloading block 7 for the delivery of a cassette 13 housing a wafer 16, a carrier block 8 for moving the wafer 16 from the cassette 13, a polishing block 6 for polishing the wafer 16, a cleaning block 9 for cleaning and drying the wafer 16 after polishing, and a control block 10 for controlling the operation of the machine by forming a ceiling and surrounding wall plates so as to surround the whole of the blocks to constitute a box. The wafer 16 is polished by the polishing block 6, and the polished wafer 16 is moved from the polishing block 6 to the cleaning block 9. Then the wafer 16 is cleaned and dried, and then taken out of the polishing machine. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以安装在可以有效防止污染的洁净室中的抛光机。解决方案：抛光机设置有用于传送容纳晶片16的盒13的装载/卸载块7，用于从盒13移动晶片16的载体块8，用于抛光晶片16的抛光块6 晶片16，用于在抛光之后清洁和干燥晶片16的清洁块9，以及用于通过形成天花板和围绕壁板来围绕整个块以构成盒子来控制机器的操作的控制块10 。抛光块6抛光晶片16，抛光晶片16从抛光块6移动到清洁块9.然后将晶片16清洗干燥，然后从抛光机中取出。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005101633A Polishing device 审中-公开
标题翻译：抛光装置
公开(公告)号：JP2005101633A
公开(公告)日：2005-04-14
申请号：JP2004319186
申请日：2004-11-02
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： OMICHI TAKASHI , TOGAWA TETSUJI , NISHI TOYOMI , YAJIMA HIROMI , IMOTO YUKIO , KODAMA SHOICHI , AOKI RIICHIRO
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device adapted for blocking, superior in productivity, expandability, maintainability and correspondency to users, and also efficient in cooperation with incidental devices. SOLUTION: The polishing device is adapted for polishing a wafer 1. The polishing device comprises a load/unload block 5 that delivers and receives a cassette 2 with the wafer 1 received in, a conveying block 6 that transports the wafer 1, a polishing block 7 adapted to polish the wafer 1, a cleaning block 8 adapted to clean the polished wafer 1, and a control block 9 that memorizes, through teaching, the relative position between the cassette 2 in the load/unload block 5 and a robot 15 in the conveying block 6. Control devices are arranged in respective blocks, and the polishing device is provided with any one of a grinding-liquid feeder 31, a waste-liquid treating device 32, a cooling-water feeder 33, and a warm-water feeder 34. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供适于阻挡，优异的生产率，可扩展性，可维护性和与用户对应的抛光装置，并且还能够与附带的装置配合使用。抛光装置适于抛光晶片1.抛光装置包括装载/卸载块5，其承载并接收晶片1所接收的盒2，输送块6的输送块6，适于抛光晶片1的抛光块7，适于清洁抛光晶片1的清洁块8，以及通过教导存储装载/卸载块5中的盒2之间的相对位置的控制块9和机器人15在输送块6中。控制装置布置在相应的块中，并且抛光装置设置有研磨液供给器31，废液处理装置32，冷却水供给器33和温水送料器34.版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2007189258A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2007189258A
公开(公告)日：2007-07-26
申请号：JP2007107289
申请日：2007-04-16
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： OMICHI TAKASHI , TOGAWA TETSUJI , NISHI TOYOMI , YAJIMA HIROMI , IMOTO YUKIO , KODAMA SHOICHI , AOKI RIICHIRO
IPC分类号： H01L21/304 , B24B37/10
摘要： PROBLEM TO BE SOLVED: To provide a polishing device adapted for blocking of the device, having excellent productivity, extendibility, maintainability, and adaptability to users, and having good cooperation efficiency with incidental facility. SOLUTION: The device is equipped with: a load/unload block 5 for delivering a cassette 2; conveyance block 6 for moving a wafer 1, polishing block 7 for polishing the wafer 1; cleaning block 8 for cleaning the wafer 1 after polishing; and control block 9 which memorizes relative position of the cassette 2 of the load/unload block 5 and robot 15 of the conveyance block 6 by teaching, further memorizes the number of wafers in the cassette and position information of the cassette 2 on a housing shelf 13 by the measurement of a sensing sensor 12, and instructs a robot 15 to take the semiconductor wafer 1 out of the shelf of the cassette 2 and to return polished, cleaned, and dried semiconductor wafer 1 to the housing shelf 13. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供适于阻挡装置的抛光装置，具有优异的生产率，可扩展性，可维护性和对用户的适应性，并且具有良好的协作效率和附带的设施。
解决方案：设备配备有：用于传送盒式磁带2的装载/卸载块5; 用于移动晶片1的输送块6，用于抛光晶片1的抛光块7; 清洁块8，用于在抛光之后清洁晶片1; 以及控制块9，其通过教导来存储装载/卸载块5的盒式磁带2和传送块6的机器人15的相对位置，进一步将盒中的晶片数量存储在盒体上并将盒式磁带2的位置信息存储在外壳架上通过感测传感器12的测量，并且指示机器人15将半导体晶片1从盒2的架子中取出并且将抛光的，清洁的和干燥的半导体晶片1返回到壳体搁架13。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2004158883A Semiconductor wafer polishing apparatus and its polishing method 有权
公开(公告)号：JP2004158883A
公开(公告)日：2004-06-03
申请号：JP2004037458
申请日：2004-02-13
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： SAITO HARUMITSU , TSUJIMURA MANABU , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , KODERA MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： B24B37/04 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer polishing apparatus which can be located in a clean room and in which the semiconductor wafer is transferred to the next process by a wafer carrier used in the clean room generally after cleaning and drying the polished semiconductor wafer without contaminating the clean room, and also to provide its polishing method.
SOLUTION: In the semiconductor wafer polishing apparatus, a polishing section 2 for polishing the semiconductor wafer 4 and a cleaning section 30 for cleaning the semiconductor wafer 4 are contained in a box 1 having side walls. A partition wall 22, which separates the polishing section 2 and the cleaning section 30, and a transferring mechanism 24 which transfers the polished semiconductor wafer 4 from the polishing section 2 to the cleaning section 30 through the opening 22a of the partition wall 22, are positioned in the box 1. The box is rectangularly flat, and a cassette 17 holding the semiconductor wafer 4 before polishing and a cassette 45 containing the semiconductor wafer 4 after polishing are located on the same side of the box 1.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2003324082A Polishing equipment 有权
标题翻译：抛光设备
公开(公告)号：JP2003324082A
公开(公告)日：2003-11-14
申请号：JP2003152308
申请日：2003-05-29
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： NISHI TOYOMI , TOGAWA TETSUJI , YAJIMA HIROMI , HIUGA KAZUAKI , KODAMA SHOICHI , IMOTO YUKIO , AOKI RIICHIRO , WATASE MASAKO , SHIGETA ATSUSHI , MISHIMA SHIRO , KONO YOSHISUKE
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide polishing equipment which can be installed in a clean room which can prevent contamination effectively.
SOLUTION: The polishing equipment is provided with: an outer fence unit, a bulkhead 11 which partitions the inside of the outer fence into a first chamber 27 and a second chamber 26 and has an opening for passing a wafer 16; a load unload block 7 which delivers a cassette 13 for accommodating the wafers; a polishing block 6 which is arranged in the first chamber 27 and has a turn table 23 wherein an abrasive cloth is stuck on an upper surface and a top ring 22 for pressing the wafer 16 against the abrasive cloth; a cleaning block 9 which is arranged in the second chamber 26 and has a cleaning unit for cleaning the wafer 16 after polishing, while supplying cleaning liquid, and a drying unit for drying the wafer 16 after cleaning; an exhaust means for performing exhaust from the first chamber 27; and an exhaust means for performing exhaust from the second chamber 26.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供可以安装在洁净室中的可以有效防止污染的抛光设备。解决方案：抛光设备设有：外挡板单元，将外挡板内侧分隔成第一室27和第二室26的隔板11，并具有用于通过晶片16的开口; 负载卸载块7，其输送用于容纳晶片的盒13; 抛光块6布置在第一室27中，并且具有转台23，其中研磨布粘附在上表面上，顶环22用于将晶片16压靠在研磨布上; 清洁块9布置在第二室26中，并且具有用于在抛光之后清洁晶片16同时供应清洁液体的清洁单元和用于在清洁之后干燥晶片16的干燥单元; 用于从第一室27进行排气的排气装置; 以及用于从第二室26排气的排气装置。（C）2004，JPO

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