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11. 发明专利

JP4681241B2 Alignment method, a bonding method using this method, the joining apparatus 有权
公开(公告)号：JP4681241B2
公开(公告)日：2011-05-11
申请号：JP2004037671
申请日：2004-02-16
申请人：ボンドテック株式会社 , 唯知須賀
发明人：朗山内 , 唯知須賀
IPC分类号： H01L21/02 , H01L21/68

13. 发明专利

JPWO2013161891A1 チップオンウエハ接合方法及び接合装置並びにチップとウエハとを含む構造体有权
标题翻译：结构包括芯片上晶片接合方法和接合装置，并且所述芯片和晶片
公开(公告)号：JPWO2013161891A1
公开(公告)日：2015-12-24
申请号：JP2014512656
申请日：2013-04-24
申请人：須賀唯知 , 唯知須賀 , ボンドテック株式会社
发明人：須賀　唯知 , 唯知須賀 , 山内　朗 , 朗山内
IPC分类号： H01L21/60 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L25/0652 , B23K31/02 , B23K37/00 , B23K37/0408 , B23K2201/40 , H01L21/6836 , H01L22/10 , H01L23/10 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/74 , H01L24/742 , H01L24/743 , H01L24/75 , H01L24/80 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/95 , H01L25/105 , H01L25/50 , H01L2221/68327 , H01L2224/0384 , H01L2224/03845 , H01L2224/0401 , H01L2224/05009 , H01L2224/05611 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06134 , H01L2224/0615 , H01L2224/06177 , H01L2224/08145 , H01L2224/08225 , H01L2224/09181 , H01L2224/1184 , H01L2224/11845 , H01L2224/13009 , H01L2224/13016 , H01L2224/13017 , H01L2224/13021 , H01L2224/13022 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/14134 , H01L2224/1415 , H01L2224/14177 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/27009 , H01L2224/2755 , H01L2224/27823 , H01L2224/2784 , H01L2224/27845 , H01L2224/29111 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/73103 , H01L2224/74 , H01L2224/7501 , H01L2224/75101 , H01L2224/75102 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/75283 , H01L2224/753 , H01L2224/75301 , H01L2224/7531 , H01L2224/75501 , H01L2224/75502 , H01L2224/7565 , H01L2224/75701 , H01L2224/75702 , H01L2224/75753 , H01L2224/75802 , H01L2224/75804 , H01L2224/75824 , H01L2224/75842 , H01L2224/7598 , H01L2224/80003 , H01L2224/8001 , H01L2224/80013 , H01L2224/80065 , H01L2224/8013 , H01L2224/80132 , H01L2224/80143 , H01L2224/80201 , H01L2224/80203 , H01L2224/8022 , H01L2224/8023 , H01L2224/80447 , H01L2224/8083 , H01L2224/80907 , H01L2224/81002 , H01L2224/8101 , H01L2224/81013 , H01L2224/81065 , H01L2224/8113 , H01L2224/81132 , H01L2224/81143 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/8122 , H01L2224/8123 , H01L2224/81447 , H01L2224/81801 , H01L2224/81805 , H01L2224/8183 , H01L2224/81907 , H01L2224/83002 , H01L2224/8301 , H01L2224/83013 , H01L2224/83048 , H01L2224/83051 , H01L2224/83065 , H01L2224/83091 , H01L2224/8313 , H01L2224/83132 , H01L2224/83136 , H01L2224/83143 , H01L2224/83193 , H01L2224/83201 , H01L2224/83203 , H01L2224/8322 , H01L2224/8323 , H01L2224/83234 , H01L2224/83355 , H01L2224/83447 , H01L2224/83801 , H01L2224/8383 , H01L2224/83894 , H01L2224/83907 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/01322 , H01L2924/10157 , H01L2924/10253 , H01L2924/3511 , H01L2224/81 , H01L2924/00012 , H01L2924/00014 , H01L2924/01047 , H01L2224/80 , H01L2224/83 , H01L2924/00
摘要：【課題】接合界面に樹脂などの望ましくない残存物を残さないようにして、チップとウエハとの間又は積層された複数のチップ間の電気的接続を確立し機械的強度を上げる、ウエハ上にチップを効率よく接合する技術を提供すること。【解決手段】金属領域を有するチップ側接合面を有する複数のチップを、複数の接合部を有する基板に接合する方法が、チップ側接合面の金属領域を、表面活性化処理し、かつ親水化処理するステップ(S1)と、基板の接合部を表面活性化処理し、かつ親水化処理するステップ(S2)と、表面活性化処理されかつ親水化処理された複数のチップを、それぞれ、チップの金属領域が基板の接合部に接触するように、表面活性化処理されかつ親水化処理された基板の対応する接合部上に取り付けるステップ(S3)と、基板と基板上に取り付けられた複数のチップとを含む構造体を加熱するステップ(S4)とを備える。【選択図】図1
摘要翻译：甲以免留下不希望的残余物，如键合界面的树脂，增加之间或多个芯片和晶片的堆叠芯片的之间所建立的机械强度的电连接，在晶片上以用于有效地接合所述芯片的技术。多个具有具有的金属区域，粘接到具有多个关节的底物的方法，所述芯片侧粘结表面的金属区域，处理过的表面活化，和亲水性的芯片侧粘结表面的芯片步骤（S1），以进行处理，该基板处理过的表面活化的接合处，并且步骤（S2）亲水性处理，将多个芯片被处理表面活化和分别亲水化，芯片如在与基板的接合部接触的金属区域，所述步骤（S3），用于安装在表面处理的激活，并且已被亲水化的基板，安装在基板上的多个芯片的相应接头和基板上和用于加热含有结构和步骤（S4）。点域1

14. 发明专利

JP5565792B2 Alignment apparatus 有权
公开(公告)号：JP5565792B2
公开(公告)日：2014-08-06
申请号：JP2009268266
申请日：2009-11-26
申请人：ボンドテック株式会社
发明人：朗山内
IPC分类号： H01L21/02 , H01L21/68

15. 发明专利

JPWO2012133760A1 電子部品実装方法、電子部品実装システムおよび基板有权
公开(公告)号：JPWO2012133760A1
公开(公告)日：2014-07-28
申请号：JP2013507779
申请日：2012-03-30
申请人：ボンドテック株式会社
发明人：山内　朗 , 朗山内
IPC分类号： H01L21/60 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L25/50 , H01L21/67144 , H01L21/6835 , H01L24/13 , H01L24/75 , H01L24/80 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L2221/68354 , H01L2221/68381 , H01L2224/0401 , H01L2224/05571 , H01L2224/05647 , H01L2224/08145 , H01L2224/13023 , H01L2224/13025 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75315 , H01L2224/75753 , H01L2224/7598 , H01L2224/80357 , H01L2224/80895 , H01L2224/80896 , H01L2224/81191 , H01L2224/81201 , H01L2224/81815 , H01L2224/8183 , H01L2224/83 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/15788 , H01L2924/3511 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00012 , H01L2224/05552
摘要：複数の電子部品を基板上に平面配置して実装することをさらに容易に実現することが可能な実装技術を提供する。基板WA上に第i層の複数のチップCPiが平面配置されて積層される。値i=2のときには、まず、仮基板WT2上に形成された樹脂層RS2に、第2層の複数のチップCP2がフェイスアップ状態で平面配置され仮固定される。そして、仮基板WT2の上下を反転して第2層の複数のチップCP2をフェイスダウン状態で仮基板WT2に保持し、基板WAと仮基板WT2とを相対的に接近させることによって、第2層の各チップCP2と基板WA上の第1層の各チップCP1とが相対的に接近し、各チップCP1と各チップCP2とが接合する。さらに、各チップCP2が各チップCP1に接合された状態を維持しつつ、第2層の複数のチップCP2から仮基板WT2が分離される。

16. 发明专利

JP5256410B2 Transfer method and transfer device 有权
公开(公告)号：JP5256410B2
公开(公告)日：2013-08-07
申请号：JP2012204101
申请日：2012-09-18
申请人：ボンドテック株式会社
发明人：朗山内
IPC分类号： H01L21/027 , B29C59/02 , G01B11/00

17. 发明专利

JP5073540B2 Positioning device 有权
公开(公告)号：JP5073540B2
公开(公告)日：2012-11-14
申请号：JP2008065786
申请日：2008-03-14
申请人：ボンドテック株式会社
发明人：朗山内
IPC分类号： H01L21/68 , G12B5/00 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To secure a sufficient amount as a projecting amount of a support leg. SOLUTION: A lifting piezoelectric element 5 is arranged on a base 3, three driving piezoelectric elements 9a, 9b and 9c are connected thereon through a lower connection body 7, and a long support leg 13 is vertically connected and supported on the driving piezoelectric elements 9a, 9b and 9c through an upper connection body 11. A reception base 17 is erected on the base 3, an opening 17a at the center of the upper part of the reception base 17 is structured to vertically move the support leg 13, and a distal end (top end) of the support leg 13 is moved to the upper and lower sides relative to the top surface of the reception base 17 by extension/contraction of the respective driving piezoelectric elements 9a, 9b and 9c. A drive unit 19 in which the base 3, the reception base 17, the lifting piezoelectric element 5, the lower connection body 7, a piezo drive means 15 and the support leg 13 are integrated with one another is formed, and three of the drive units 19 are arranged nearly on the circumference of a circle to compose this positioning device. COPYRIGHT: (C)2010,JPO&INPIT

18. 发明专利

JP4919604B2 Bonding method and the bonding apparatus 有权
公开(公告)号：JP4919604B2
公开(公告)日：2012-04-18
申请号：JP2005038559
申请日：2005-02-16
申请人：ボンドテック株式会社 , 唯知須賀
发明人：朗山内 , 唯知須賀
IPC分类号： B23K20/14 , H01L21/02 , B23K20/24 , B23K101/40 , C23F4/00 , H01L21/304

19. 发明专利

JP5324309B2 Alignment equipment, alignment method, and semiconductor device 有权
公开(公告)号：JP5324309B2
公开(公告)日：2013-10-23
申请号：JP2009115969
申请日：2009-05-12
申请人：ボンドテック株式会社 , 唯知須賀
发明人：唯知須賀 , 晨曦王 , 朗山内
IPC分类号： H01L21/02 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide an alignment technique capable of further improving registration. SOLUTION: An alignment device calculates misregistration between both objects based on a superimposed image being an overlapping image of first and second patterns arranged on both the objects, and corrects the misregistration by driving both the objects relatively. The superimposed image has a first periodic concentration change (moire) generated by superimposing a first line group (pitch p1) of the first pattern and a second line group (pitch p2) of the second pattern, and also has a second periodic concentration change generated by superimposing a second line group of the first pattern and a first line group of the second pattern. A calculation means of the alignment device obtains two approximate curves approximating the two periodic concentration changes by image processing, and calculates misregistration between both the objects based on the misregistration between the two approximate curves. COPYRIGHT: (C)2011,JPO&INPIT

20. 发明专利

JP5256407B2 Bonding method and a device being created by this method, the bonding apparatus and substrate to be joined by this method 有权
公开(公告)号：JP5256407B2
公开(公告)日：2013-08-07
申请号：JP2008068032
申请日：2008-03-17
申请人：ボンドテック株式会社
发明人：朗山内
IPC分类号： B23K20/00 , B23K20/02 , B23K20/14 , H01L23/02

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