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2. 发明专利

JPWO2012105474A1 接合面作製方法、接合基板、基板接合方法、接合面作製装置、及び基板接合体有权
公开(公告)号：JPWO2012105474A1
公开(公告)日：2014-07-03
申请号：JP2012555850
申请日：2012-01-30
申请人：須賀唯知 , 唯知須賀 , ボンドテック株式会社 , 太陽誘電株式会社 , ランテクニカルサービス株式会社
发明人：須賀　唯知 , 唯知須賀 , 山内　朗 , 朗山内 , 龍一近藤 , 龍一近藤 , 松本　好家 , 好家松本
IPC分类号： H01L21/02 , B23K20/00
CPC分类号： B32B38/08 , B23K1/20 , B23K20/24 , B23K2201/36 , B32B7/04 , H01J37/317 , H01J2237/08 , H01J2237/202 , H01J2237/3165 , H01L21/02046 , H01L21/2007 , H01L21/302 , H01L21/67092 , H01L21/67115 , H01L21/76251 , H01L23/147 , H01L23/5252 , H01L2924/0002 , Y10T428/265 , Y10T428/31678 , H01L2924/00
摘要：【課題】適用範囲の広い基板接合技術を提供する。【解決手段】接合面内にシリコン薄膜を形成し、基板との境界はエネルギー粒子、金属粒子により、表面処理する。【選択図】図2

3. 发明专利

JPWO2012105473A1 接合基板作製方法、接合基板、基板接合方法、接合基板作製装置、及び基板接合体有权
公开(公告)号：JPWO2012105473A1
公开(公告)日：2014-07-03
申请号：JP2012555849
申请日：2012-01-30
申请人：須賀唯知 , 唯知須賀 , ボンドテック株式会社 , 太陽誘電株式会社 , ランテクニカルサービス株式会社
发明人：須賀　唯知 , 唯知須賀 , 山内　朗 , 朗山内 , 龍一近藤 , 龍一近藤 , 松本　好家 , 好家松本
IPC分类号： H01L21/02 , B23K20/00
CPC分类号： H01L21/3221 , B23K1/20 , B23K20/24 , B23K2201/36 , H01J37/317 , H01J2237/202 , H01J2237/3165 , H01L21/02046 , H01L21/2007 , H01L21/263 , H01L21/302 , H01L21/67092 , H01L21/67115 , H01L21/76251 , H01L29/04 , H01L29/36
摘要：【課題】適用範囲の広い基板接合技術を提供する。【解決手段】接合面内にシリコン薄膜を形成し、基板との境界はエネルギー粒子、金属粒子により、表面処理する。【選択図】図2

4. 发明专利

JP5118546B2 Electrical micro-mechanical switch 有权
公开(公告)号：JP5118546B2
公开(公告)日：2013-01-16
申请号：JP2008114803
申请日：2008-04-25
申请人：太陽誘電株式会社
发明人：中村　　健太郎 , 龍一近藤
IPC分类号： H01H57/00 , B81B3/00

5. 发明专利

JP5314932B2 Electrical micro-mechanical switch 有权
标题翻译：空值
公开(公告)号：JP5314932B2
公开(公告)日：2013-10-16
申请号：JP2008137186
申请日：2008-05-26
申请人：太陽誘電株式会社
发明人：龍一近藤 , 中村　　健太郎
IPC分类号： H01L41/31 , B81B3/00 , H01H57/00 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/39 , H02N2/00
摘要： PROBLEM TO BE SOLVED: To provide an MEMS switch for suppressing warpage of a material due to stress, and reducing dispersion of an electric characteristic. SOLUTION: This switch includes: drive parts 8a and 8b each having a plate-like elastic body with one end or both ends fixed to a board, a lower electrode formed on the upper surface of the elastic body, a piezoelectric body formed on the upper surface of the lower electrode and an upper electrode formed on the upper surface of the piezoelectric body; a contact 8c formed in a part of the drive parts; a signal line 3b with at least one end fixed to the board and extended to the contact; and a lock part 9 jointed to the board to support the drive parts 8a and 8b and formed of an insulating material. The drive parts 8a and 8b contact the signal line 3b through the contact 8c, and the lock part 9 supports the drive parts 8a and 8b from the side opposite to the signal line 3b. For instance, when the lock part 9 is structured to support the drive parts 8a and 8b in a hole, a cutout part or the like, warpage of a material due to stress is suppressed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于抑制由于应力引起的材料翘曲并减小电特性的分散的MEMS开关。解决方案：该开关包括：驱动部分8a和8b，每个驱动部件8a和8b均具有固定到板的一端或两端的板状弹性体，形成在弹性体的上表面上的下电极，形成的压电体在所述下电极的上表面上，形成在所述压电体的上表面上的上电极; 形成在所述驱动部的一部分中的接触件8c; 信号线3b，其至少一端固定到板并延伸到触点; 以及与板接合以支撑驱动部分8a和8b并由绝缘材料形成的锁定部分9。驱动部分8a和8b通过触点8c接触信号线3b，并且锁定部分9从与信号线3b相反的一侧支撑驱动部分8a和8b。例如，当锁定部9被构造成将驱动部8a和8b支撑在孔，切口部等中时，抑制了由于应力引起的材料翘曲。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP5123532B2 Microcantilever 有权
标题翻译：空值
公开(公告)号：JP5123532B2
公开(公告)日：2013-01-23
申请号：JP2007018810
申请日：2007-01-30
申请人：太陽誘電株式会社
发明人：中村　　健太郎 , 龍一近藤
IPC分类号： B81B3/00 , H01L41/09 , H01L41/18 , H01L41/187 , H01L41/22 , H01L41/332 , H02N2/00
CPC分类号： H01L41/094 , H01L41/1876 , H01L41/257 , H01L41/318 , H01L41/332 , Y10T29/42
摘要： A micro-cantilever of a simple structure and capable of obtaining a larger displacement at a low voltage including a plate-like piezoelectric substrate having electrode films as an upper electrode and a lower electrode formed on both surfaces thereof, a plate-like resilient member in close contact with the piezoelectric substrate on the side of the lower electrode and a support for supporting a driving member in a cantilever manner, in which a thin-walled portion is formed to the vicinity of a base portion of the driving member supported by the support.
摘要翻译：一种简单结构的微悬臂梁，能够在低电压下获得较大的位移，包括具有电极膜作为上电极的板状压电基板和形成在其两个表面上的下电极，板状弹性构件与下部电极侧的压电基板紧密接触，以及用于以悬臂方式支撑驱动构件的支撑体，其中薄壁部分形成在由支撑件支撑的驱动构件的基部附近。

7. 发明专利

JP5180683B2 Switched capacitor 有权
公开(公告)号：JP5180683B2
公开(公告)日：2013-04-10
申请号：JP2008144150
申请日：2008-06-02
申请人：太陽誘電株式会社
发明人：謙一太田 , 中村　　健太郎 , 龍一近藤
IPC分类号： H01G7/06 , B81B3/00
CPC分类号： H01G5/18
摘要： PROBLEM TO BE SOLVED: To provide a new switched capacitor where a digital switching mechanism and an analog switching mechanism are unified. SOLUTION: The switched capacitor includes: a driving arm which has a plate-like elastic body at least one end of which is fixed to a substrate, a lower electrode layer formed on the upper surface of the elastic body, a piezoelectric layer formed on the upper surface of the lower electrode layer, and an upper electrode layer formed on the upper surface of the piezoelectric layer; a capacitor portion formed at a portion of the driving arm; and a signal line at least one end of which is fixed to the substrate. The signal line is extended to the upper part of the capacitor portion formed at a portion of the driving arm, and can be brought into contact with the driving arm via the capacitor portion. Accordingly, the digital switching mechanism and the analog switching mechanism can be unified, and improvement of characteristics and reduction of mounting cost are achieved. COPYRIGHT: (C)2010,JPO&INPIT

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