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1. 发明专利

JP2017092386A 半導体装置の製造方法审中-公开
公开(公告)号：JP2017092386A
公开(公告)日：2017-05-25
申请号：JP2015224138
申请日：2015-11-16
申请人：住友電工デバイス・イノベーション株式会社 , Sumitomo Electric Device Innovations Inc
发明人： OSAWA KEN
IPC分类号： H01L21/52
CPC分类号： H01L24/83 , B23K1/0016 , B23K1/0053 , H01L23/4827 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/75 , H01L2224/04026 , H01L2224/05644 , H01L2224/05647 , H01L2224/291 , H01L2224/29139 , H01L2224/29144 , H01L2224/32013 , H01L2224/32227 , H01L2224/32245 , H01L2224/75251 , H01L2224/75283 , H01L2224/75745 , H01L2224/75983 , H01L2224/75984 , H01L2224/83007 , H01L2224/83048 , H01L2224/83192 , H01L2224/8323 , H01L2224/83805 , H01L2224/83815 , H01L2924/00015 , H01L2924/01322 , H01L2924/10272 , H01L2924/15787 , H01L2924/3512 , H01L2924/014 , H01L2924/00014 , H01L2224/29116 , H01L2924/01032 , H01L2924/0105
摘要：【課題】ボイドの形成を抑制することが可能な半導体装置の製造方法を提供すること。【解決手段】本発明は、第1加熱部を用いて、ベース部の上面に設けられたロウ材を、前記ベース部の下面から、前記ロウ材が溶融する熱量を供給することで前記ロウ材を溶融する工程と、第2加熱部を用いて半導体チップを非接触で加熱する工程と、前記第2加熱部により加熱された半導体チップを前記溶融したロウ材と接触させることで、前記半導体チップを前記ベース部の上面に搭載する工程と、を有する半導体装置の製造方法を提供することができる。【選択図】図2B

3. 发明专利

JP2016021578A ボンディング構造および方法有权
标题翻译：粘结结构与方法
公开(公告)号：JP2016021578A
公开(公告)日：2016-02-04
申请号：JP2015160138
申请日：2015-08-14
申请人：セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー
发明人：シュテシュ・クリシュナン , ユン・スン・ウォン
IPC分类号： B22F9/00 , B22F7/00 , H01L21/52
CPC分类号： H01L24/27 , H01L23/49513 , H01L23/49524 , H01L24/29 , H01L24/36 , H01L24/40 , H01L24/83 , H01L2224/16225 , H01L2224/27318 , H01L2224/27334 , H01L2224/29 , H01L2224/29006 , H01L2224/29101 , H01L2224/29299 , H01L2224/293 , H01L2224/32013 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/40245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/73263 , H01L2224/73265 , H01L2224/83048 , H01L2224/83101 , H01L2224/83192 , H01L2224/83203 , H01L2224/838 , H01L2224/8384 , H01L2224/92 , H01L2224/92247 , H01L24/48 , H01L24/73 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/19105 , H01L2924/351
摘要：【課題】鉛の使用を減らすと共に、熱に関連する経費を削減することができるようなボンディング構造およびボンディング方法を提供する。【解決手段】ボンディング構造およびコンポーネントを接合する方法において、その接合構造は、ナノ粒子プリフォーム26を含む。実施例に従って、ナノ粒子プリフォームが基板50上に配置され、さらに、ワークピース40がナノ粒子プリフォーム上に配置される。【選択図】図7
摘要翻译：要解决的问题：提供能够减少铅的使用和与热量相关的成本的接合结构和接合方法。解决方案：在部件的接合结构和接合方法中，接合结构包括纳米颗粒预制件26。根据实施例，将纳米颗粒预制件放置在基板50上，并将工件40放置在纳米颗粒预制件上。选择图：图7

4. 发明专利

JP2012099384A Sinter bonding agent, method for producing the same, and bonding method using the same 有权
标题翻译：烧结剂，其制造方法以及使用该方法的粘合方法
公开(公告)号：JP2012099384A
公开(公告)日：2012-05-24
申请号：JP2010247220
申请日：2010-11-04
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： YASUDA YUSUKE , MORITA TOSHIAKI , KOBAYASHI YOSHIO
IPC分类号： H01B1/20 , H01L21/52 , H05K3/32
CPC分类号： H05K1/186 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/072 , H01L25/165 , H01L25/50 , H01L2224/0401 , H01L2224/05655 , H01L2224/06181 , H01L2224/11505 , H01L2224/13147 , H01L2224/1357 , H01L2224/13647 , H01L2224/13794 , H01L2224/13847 , H01L2224/14181 , H01L2224/16146 , H01L2224/16148 , H01L2224/16238 , H01L2224/27332 , H01L2224/29294 , H01L2224/29347 , H01L2224/32238 , H01L2224/37147 , H01L2224/40095 , H01L2224/40225 , H01L2224/48227 , H01L2224/73221 , H01L2224/81048 , H01L2224/81065 , H01L2224/81097 , H01L2224/81201 , H01L2224/8184 , H01L2224/83048 , H01L2224/83065 , H01L2224/83097 , H01L2224/83203 , H01L2224/83205 , H01L2224/8384 , H01L2224/8584 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/19041 , H01L2924/19105 , H05K3/32 , H05K3/4614 , H05K2201/0266 , H05K2201/10636 , H05K2203/1131 , H05K2203/1157 , Y02P70/611 , H01L2924/00012 , H01L2924/053 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To provide a sinter bonding agent using nanoparticles, which is mainly composed of copper oxide nanoparticles that achieve both stable dispersibility and bondability and are capable of suppressing ion migration, and to provide a method for producing the sinter bonding agent, and a bonding method using the sinter bonding agent.SOLUTION: The sinter bonding agent according to the present invention, which uses cupric oxide nanoparticles, is characterized in that: cupric oxide nanoparticles each having a particle diameter of 2-50 nm inclusive are used as primary particles; the primary particles aggregate to constitute secondary particles each having a particle diameter of 3-1000 nm inclusive; and the secondary particles are dispersed in a solution.
摘要翻译：要解决的问题：提供一种使用纳米颗粒的烧结粘合剂，其主要由能够抑制离子迁移的稳定分散性和粘合性的氧化铜纳米粒子组成，并提供一种烧结粘合剂的制造方法试剂和使用烧结粘合剂的粘合方法。＆lt; P＆gt;解决方案：使用氧化铜纳米粒子的本发明的烧结粘合剂的特征在于，使用粒径为2-50nm的二氧化铈纳米粒子作为一次粒子，一次粒子聚集形成粒径为3-1000nm以下的二次粒子，二次粒子分散在溶液中。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011236494A Method for manufacturing metal member joined body, and metal member joined body 有权
标题翻译：制造金属部件接合体的方法和金属部件接合体
公开(公告)号：JP2011236494A
公开(公告)日：2011-11-24
申请号：JP2010220751
申请日：2010-09-30
申请人： Nippon Handa Kk , ニホンハンダ株式会社
发明人： ISSHIKI MINORU , KUDO YASUMASA , MASUDA RYOKO , AKAMA DAISUKE , OCHI YUTAKA , KOBAYASHI YASUHIRO , ASAMI HIDETOMO
IPC分类号： B22F7/08 , B22F1/02 , B22F7/04 , H01B1/22 , H05K3/12
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/29339 , H01L2224/48091 , H01L2224/73265 , H01L2224/83048 , H01L2224/83101 , H01L2224/83205 , H01L2224/8384 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/15747 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal member joined, allowing the formation of a heated and sintered object of a predetermined thickness of heated and sintered metal particles between metal members, keeping the heated and sintered objects of the heated and sintered metal particles between the metal members, rigidly joining of the metal members by the heated and sintered object of metal particles, and preventing invasion and passage of liquid or gas in the sintered object, and the metal member joined body.SOLUTION: A pasty metal particle composition made of (A) the heated and sintered metal particles of an average particle size (median diameter D50) of 0.01-50 μm and (B) a volatile dispersant is interposed among the plurality of metal members. By heating under pressure-free condition (1), the volatile dispersant is vaporized, and the metal particles are sintered among them. A porous sintered body is thus generated having a void content at section of 15% or more in terms of area ratio. Using the porous sintered body, the plurality of metal members are joined and then the metal members are heated (2) at a temperature higher than the above heating (1) for reducing the porous content of the porous sintered body below 15%. The metal member joined body is thus obtained.
摘要翻译：要解决的问题：为了提供接合的金属构件的制造方法，允许在金属构件之间形成预定厚度的加热和烧结金属颗粒的加热烧结物体，保持加热和烧结的物体金属构件之间的加热和烧结金属颗粒，通过金属颗粒的加热和烧结物体刚性地接合金属构件，并防止烧结物体中的液体或气体的侵入和通过以及金属构件接合体。解决方案：由（A）平均粒径（中值粒径D50）为0.01〜50μm的加热烧结金属粒子和（B）挥发性分散剂构成的糊状金属粒子组合物插入在多个金属成员。通过在无压条件（1）下加热，挥发性分散剂蒸发，金属颗粒在其间烧结。因此，以面积比计，在截面为15％以上的空隙率的情况下，生成多孔烧结体。使用多孔烧结体，将多个金属构件接合，然后在高于上述加热（1）的温度下将金属构件加热（2），以将多孔烧结体的多孔含量降低至15％以下。由此获得金属构件接合体。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP3898689B2 Parts bonding apparatus 有权
公开(公告)号：JP3898689B2
公开(公告)日：2007-03-28
申请号：JP2003380567
申请日：2003-11-10
申请人：芝浦メカトロニクス株式会社
发明人：勉牧野 , 眞一荻本
IPC分类号： H01L21/60 , H01L21/52
CPC分类号： H01L2224/83048 , H01L2924/0002 , H01L2924/00

7. 发明专利

JP2004290993A Component fitting device 有权
公开(公告)号：JP2004290993A
公开(公告)日：2004-10-21
申请号：JP2003084423
申请日：2003-03-26
申请人： Juki Corp , ジューキ株式会社
发明人： SAITO MASARU , ANZAI HIROSHI , HACHIMAN NAOYUKI
IPC分类号： B23K3/00 , H01L21/52
CPC分类号： H01L2224/83048
摘要： PROBLEM TO BE SOLVED: To reduce the occurrence of a local temperature difference on heating.
SOLUTION: The component fitting device 10 for fitting a component T to fitting object by brazing is provided with: a fitting stand 20 having a fitting face 21 on which the fitting object S is placed; a preheating means 11 provided on the fitting stand 20 and preheating the fitting face 21; and a heating means 13 for heating the component T and the fitting object S by the irradiation of heat rays. The fitting stand 20 is provided with a passing part 25 of the heat rays, then the irradiation of heat rays is performed from the lower side of the placed fitting object S.
COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP3376968B2 How to Implement 有权
公开(公告)号：JP3376968B2
公开(公告)日：2003-02-17
申请号：JP24395099
申请日：1999-08-30
申请人：ソニーケミカル株式会社
发明人：博之熊倉
IPC分类号： H05K3/32 , H01L21/56 , H01L21/60
CPC分类号： H01L24/83 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83048 , H01L2224/83192 , H01L2224/83855 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/00

9. 发明专利

JPWO2017126344A1 電力用半導体装置および電力用半導体装置を製造する方法审中-公开
公开(公告)号：JPWO2017126344A1
公开(公告)日：2018-06-14
申请号：JP2017000314
申请日：2017-01-06
申请人：三菱電機株式会社
发明人：山田隆行 , 別芝範之 , 村松佑哉 , 福優 , 中島泰
IPC分类号： H01L29/78 , H01L29/12 , H01L29/739 , H01L21/336 , H01L29/861 , H01L29/868 , H01L21/52
CPC分类号： H01L21/52 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/83 , H01L29/12 , H01L29/78 , H01L2224/04026 , H01L2224/05023 , H01L2224/05124 , H01L2224/05155 , H01L2224/05166 , H01L2224/05568 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/06181 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73263 , H01L2224/83048 , H01L2224/83097 , H01L2224/83192 , H01L2224/83201 , H01L2224/8384 , H01L2924/00014 , H01L2924/01046 , H01L2924/01032 , H01L2924/01029 , H01L2924/01014
摘要：電力用半導体装置は、基板と、基板の上に焼結性金属接合材を用いて接合された半導体素子とを備える。半導体素子は、母材と、母材の基板側の第1面に設けられた第1導電層と、母材の第1面に対向する第2面に設けられた第2導電層とを有する。第1導電層の厚さは、第2導電層の厚さの0.5倍以上2.0倍以下である。

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