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    • 4. 发明公开
    • HALBLEITERANORDNUNG MIT GEKOPPELTEN SPERRSCHICHT- FELDEFFEKTTRANSISTOREN
    • 耦合结型场效应晶体管功率半导体装置
    • EP2067170A1
    • 2009-06-10
    • EP07820405.4
    • 2007-09-20
    • SiCED Electronics Development GmbH & Co KG
    • FRIEDRICHS, PeterSTEPHANI, Dietrich
    • H01L27/098H03K17/082H01L27/02H01L29/808
    • H01L27/098H01L27/0248H01L29/8083H03K17/0822H03K17/6877
    • The invention relates to a semiconductor arrangement, comprising a first depletion layer field effect transistor and a second first depletion layer field effect transistor, wherein each depletion layer field effect transistor comprises a semiconductor body (116) of the one conductor type, which is in contact with a source electrode (S1; S2) and a drain electrode (D) spaced from the same such that between the source electrode and the drain electrode a flow path in created in the semiconductor body, and zones (117, 139, 122; 140, 128, 124) of the other conductor type that is opposite from the one conductor type, wherein the zones are provided in the region of the flow path in the semiconductor body and are in contact with a gate electrode (G1; G2) and form space charge regions controlling the flow path in the semiconductor body (116). The drain electrodes of the two depletion layer field effect transistors are short-circuited, and the source electrode (S1) of the first field effect transistor is short circuited with the gate electrode (G2) of the second depletion layer field effect transistor. The invention further relates to a circuit arrangement comprising this semiconductor arrangement, which has a switch element (104) that is controlled by the potential of the source electrode (S2) of the second depletion layer field effect transistor. The switch element can connect the gate electrode (G1) and the source electrode (S1) of the first depletion layer field effect transistor with a potential difference increasing the space charge regions.
    • 10. 发明公开
    • A manufacturing method for cascoded junction type field effect transistors
    • HerstellungsmethodefürJunction-Feldeffekttransistoren在Kaskodenschaltung。
    • EP0278410A1
    • 1988-08-17
    • EP88101652.1
    • 1988-02-04
    • KABUSHIKI KAISHA TOSHIBA
    • Okano, Jun-ichi Patent DivisionMatsumoto, Kiyohito Patent Division
    • H01L27/08H01L27/06
    • H01L27/098H01L21/82Y10S438/911
    • A method for manufacturing cascoded junction type field effect transistors comprises the steps of forming an epitaxial layer (33) of a first conductivity type used as a channel region on a semiconductor substrate (32) of a second conductivity type and performing selec­tive oxidation to form a thick oxide film on part of the epitaxial layer (33). Then, the thick oxide film is removed to provide a part of the surface which is a level lower than the main surface of the epitaxial layer (33). Next, an impurity of the first conductivity type is doped into the low and high surface areas of the epitaxial layer (33) from the surface thereof to form source and drain regions (38 and 39) separated at a preset distance. After this, an impurity of the second conductivity type is doped into the low and high level surface areas of the epitaxial layer (33) between the source and drain regions (38 and 39) to simultaneously form first and second junction gates (44 and 45) which are separated at a present distance. Then, the semicon­ductor substrate (32) is connected to the second junc­tion gate (45) and source region (38) to connect two junction FETs in cascode fashion.
    • 制造级联结型场效应晶体管的方法包括以下步骤:在第二导电类型的半导体衬底(32)上形成用作沟道区的第一导电类型的外延层(33),并执行选择性氧化以形成 部分外延层(33)上的厚氧化膜。 然后,去除厚的氧化物膜以提供比外延层(33)的主表面低的水平的一部分表面。 接下来,从其表面将第一导电类型的杂质掺杂到外延层(33)的低表面和高表面区域中,以形成以预设距离分离的源区和漏区(38和39)。 此后,第二导电类型的杂质被掺杂到源区和漏区(38和39)之间的外延层(33)的低和高电平表面区域中,以同时形成第一和第二结栅(44和45 ),它们以目前的距离分离。 然后,半导体衬底(32)连接到第二结栅极(45)和源极区域(38),以串联方式连接两个结型FET。