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    • 6. 发明公开
    • System for monitoring material dispensed onto a subtrate
    • 系统zum Erfassen von Material auf einem Substrat。
    • EP0275334A1
    • 1988-07-27
    • EP87100654.0
    • 1987-01-20
    • NORDSON CORPORATION
    • Merkel, Stephen L.
    • G01N21/88B05C5/00
    • C23C14/52G01J1/42G05D5/03
    • A system for monitoring energy radiant from a material dispensed onto a substrate (S). As disclosed, an infrared sensor (16) is positioned to receive infrared energy radiated by a substrate and by a heated adhe­sive (B) applied to the substrate (S), with the resistance of the sensor varying in dependence upon the amount of infrared energy received. An amplifier has an input capacitively coupled to the sensor, and the voltage at the amplifier input varies in dependence upon the resistance of the sensor. The output voltage of the amplifier varies in dependence upon the amplifier input voltage, and hence upon the amount of infrared energy reaching the sensor. In order to prevent inaccuracies in the amplifier output signal due to, for example, temperature-related resistance variations of the sensor, the amplifier input is grounded during intervals when the sensor receives infrared energy from the substrate and ungrounded shortly before the sensor begins to receive infrared energy from the heated adhesive.
    • 一种用于监测从分配到衬底(S)上的材料辐射的能量的系统。 如所公开的,红外传感器(16)被定位成接收由衬底和施加到衬底(S)的加热粘合剂(B)辐射的红外能量,传感器的电阻根据红外能量的量而变化 接收。 放大器具有与传感器电容耦合的输入,放大器输入端的电压根据传感器的电阻而变化。 放大器的输出电压根据放大器的输入电压而变化,并因此依赖于到达传感器的红外能量。 为了防止由于例如传感器的温度相关的电阻变化引起的放大器输出信号的不准确性,当传感器从衬底接收到红外能量并在传感器开始接收之前不接地时,放大器输入接地 来自加热粘合剂的红外能量。
    • 7. 发明授权
    • Mask assembly for testing a deposition process.
    • 用于测试沉积过程的掩模组件。
    • EP2703518B1
    • 2017-07-12
    • EP13169604.9
    • 2013-05-29
    • Samsung Display Co., Ltd.
    • Kim, Min HoCha, You MinPark, Seuk Hwan
    • C23C14/04C23C14/54C23C14/52C23C14/56C23C14/46B05C3/20
    • B05C3/20C23C14/042C23C14/46C23C14/52C23C14/542C23C14/568
    • A deposition apparatus includes deposition sources (S1, S2, S3, S4), a deposition chamber (CB), a mask assembly (MA, MA10, MA20, MA30), and a transfer unit (TP). The mask assembly (MA, MA10, MA20, MA30) includes a support member (10), a shutter member (20), and a drive member (30). The support member (10) has a first opening (OP1) configured to allow the deposition materials (M1, M2, M3, M4) to pass through while supporting the base substrate (SUB) on which the deposition materials are deposited. The shutter member (20) is accommodated in the support member (10) and has a second opening (OP2) smaller than the first opening (OP1). The drive member (30) is configured to change a position of the second opening (OP2) with respect to the base substrate (SUB) in accordance with the movement of the mask assembly (MA, MA10, MA20, MA30).
    • 沉积设备包括沉积源(S1,S2,S3,S4),沉积室(CB),掩模组件(MA,MA10,MA20,MA30)和转印单元(TP)。 面罩组件(MA,MA10,MA20,MA30)包括支撑构件(10),活门构件(20)和驱动构件(30)。 支撑构件(10)具有第一开口(OP1),该第一开口(OP1)被配置为允许沉积材料(M1,M2,M3,M4)在支撑沉积有沉积材料的基础基板(SUB)的同时穿过。 活门构件20容纳在支撑构件10中并具有比第一开口OP1小的第二开口OP2。 驱动构件(30)构造成根据掩模组件(MA,MA10,MA20,MA30)的移动而改变第二开口(OP2)相对于基础基板(SUB)的位置。