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    • 3. 发明公开
    • METHOD FOR FORMING SILICON CARBIDE THIN FILM
    • VERFAHREN ZUR BILDUNG EINER SILIZIUMKARBID-DÜNNSCHICHT
    • EP2740815A1
    • 2014-06-11
    • EP11855264.5
    • 2011-08-02
    • Shincron Co., Ltd.
    • SUGAWARA, TakuyaAOSHIMA, HikaruJIANG, YousongSHIONO, IchiroNAGAE, Ekishu
    • C23C14/34C23C14/58
    • C23C14/35C23C14/0078C23C14/0635C23C14/3464C23C14/5826G02B1/10
    • A film deposition method of a silicon carbide thin film having a high transmissivity and high film strength applicable for optical use purposes is provided, by which a film can be formed safely and efficiently in a short time also on a substrate having low heat resistance,.
      The method of the present invention is a method for depositing a silicon carbide thin film on a moving substrate S by using a film formation apparatus 1 configured that a reaction process region 60 and film formation process regions 20 and 40 are arranged spatially separated from one another in a vacuum container 11 and processing in the regions 20, 40 and 60 can be controlled independently, wherein silicon targets 29a and 29b are sputtered in the region 20 and carbon targets 49a and 49b are sputtered in the region 40. Thereby, an interlayer thin film containing silicon and carbon is formed on the substrate S. Next, in the region 60, the interlayer thin film is exposed to plasma generated in an atmosphere of a mixed gas of an inert gas and hydrogen so as to convert the interlayer thin film into an ultrathin film. Then, the ultrathin film is subjected to successive formation of another interlayer thin film and successive film conversion into an ultrathin film repeatedly.
    • 提供了适用于光学用途的具有高透光率和高膜强度的碳化硅薄膜的薄膜沉积方法,通过该薄膜沉积方法也可以在短时间内在耐热性低的基板上形成薄膜。 本发明的方法是通过使用成膜装置1将移动的基板S上的碳化硅薄膜沉积的方法,该成膜装置1将反应处理区域60和成膜处理区域20和40彼此空间分开地布置 在真空容器11中,并且可以独立地控制区域20,40和60中的处理,其中硅靶29a和29b溅射在区域20中,并且碳靶49a和49b溅射在区域40中。由此,层间薄膜 在基板S上形成含有硅和碳的膜。接着,在区域60中,将层间薄膜暴露于在惰性气体和氢气的混合气体的气氛中产生的等离子体,以将层间薄膜转化为 超薄的电影。 然后,将超薄膜连续地形成另一层间薄膜,并连续地将薄膜转化成超薄薄膜。
    • 6. 发明公开
    • GROUP-III METAL NITRIDE AND PREPARATION THEREOF
    • GROUP III金属氮化物及其制备方法
    • EP2140038A2
    • 2010-01-06
    • EP08710229.9
    • 2008-02-21
    • Mosaic Crystals Ltd.
    • EINAV, Moshe
    • C23C14/06C23C14/14C23C14/58C30B23/02C30B29/40
    • C23C14/0617C23C14/0026C23C14/14C23C14/5826C23C14/586C30B23/02C30B25/02C30B29/403C30B29/406
    • A method for forming a group-III metal nitride material film attached to a substrate, the method including the procedures of subjecting the substrate to an ambient pressure of no greater than 0.01 Pa, and heating the substrate to a temperature of between approximately 500°C-800°C. The method further includes the procedures of introducing a group III metal vapor to the surface of the substrate at a base pressure of at least 0.01 Pa, until a plurality of group III metal drops form on the surface, and introducing active nitrogen to the surface at a working pressure of between 0.05 Pa and 2.5 Pa, until group III metal nitride molecules form on the group III metal drops. The method also includes the procedures of maintaining the working pressure and the active nitrogen until the group III metal nitride molecules diffuse into the group III metal drops, forming nitride/metal solution drops, and until the nitride/metal solution drops turn into a wetting layer on the substrate, and continuing to increase the concentration of group III metal nitride molecules in the wetting layer until all the group III metal atoms contained in the wetting layer are exhausted, and the wetting layer transforms into a group III metal nitride film. According to another aspect of the disclosed technique, if the wetting layer is relatively thin, then group-III metal nitride molecules diffuse into the wetting layer, during the procedure of continuing to increase, thereby increasing the viscosity thereof, transforming the wetting layer into a solid amorphous group III metal nitride film. According to a further aspect of the disclosed technique, if the wetting layer is relatively thick, then a crystalline seeding layer is formed on the surface of the wetting layer, during the procedure of continuing to increase, and wherein the active nitrogen diffuses through the seeding layer, reacting with group-III metal in the wetting layer, thereby further thickening the seeding layer, transforming the wetting layer into a crystalline group III metal nitride film.