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1. 发明授权

EP2984032B1 ELEKTROSTATISCHER AKTUATOR UND VERFAHREN ZUM HERSTELLEN DESSELBEN 有权
公开(公告)号：EP2984032B1
公开(公告)日：2017-05-24
申请号：EP14727452.6
申请日：2014-05-26
申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
发明人： LANGE, Nicolas , WIPPERMANN, Frank
IPC分类号： B81B3/00 , H02N1/00
CPC分类号： H02N1/006 , B81B3/0086 , B81B2201/038 , B81B2203/019 , B81B2203/04 , B81B2203/058

2. 发明授权

EP2803633B1 Vorrichtung mit einem schwingfähig aufgehängten optischen Element 有权
标题翻译： Vorrichtung mit einemschwingfähigaufgehängtenoptischen Element
公开(公告)号：EP2803633B1
公开(公告)日：2015-08-19
申请号：EP14168396.1
申请日：2014-05-15
申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
发明人： Gu-Stoppel, Shanshan , Quenzer, Hans Joachim , Janes, Joachim
IPC分类号： B81B3/00
CPC分类号： G02B26/0833 , B81B3/0045 , B81B2201/042 , B81B2203/0109 , B81B2203/0163 , B81B2203/019

3. 发明公开

EP2866469A3 Acoustic transducer and package module including the same 审中-公开
标题翻译：声换能器和封包模块等等
公开(公告)号：EP2866469A3
公开(公告)日：2016-04-13
申请号：EP14275037.1
申请日：2014-03-03
申请人： Samsung Electro-Mechanics Co., Ltd. , TOHOKU UNIVERSITY
发明人： Park, Yoon Sok , Esashi, Masayoshi , Kang, Pil Joong
IPC分类号： H04R19/00
CPC分类号： H04R17/00 , B81B3/0086 , B81B2201/0257 , B81B2203/0127 , B81B2203/019 , H01L2224/48091 , H01L2224/48137 , H01L2924/16151 , H01L2924/16152 , H04R19/005 , H01L2924/00014
摘要： There is provided an acoustic transducer (100) including an electrode substrate (120) having a plurality of holes (124) formed therein and having a first electrode thereon, a diaphragm (140) disposed so as to face the electrode substrate (120) and having a second electrode thereon to form an electric field in a space between the diaphragm (140) and the electrode substrate (120), and a plurality of protrusions (142) formed on the diaphragm (140) and having the second electrode to form electric fields in the plurality of holes (124).

4. 发明授权

EP1760038B1 Method for manufacturing a mass-spring system 有权
标题翻译：一种用于生产质量 - 弹簧系统方法
公开(公告)号：EP1760038B1
公开(公告)日：2013-06-26
申请号：EP06119036.9
申请日：2006-08-16
申请人： Infineon Technologies AG
发明人： Jakobsen, Henrik
IPC分类号： B81C1/00
CPC分类号： B81C1/00142 , B81B2203/0163 , B81B2203/019 , B81C1/00476

5. 发明公开

EP2495212A3 Mems devices having support structures and methods of fabricating the same 审中-公开
标题翻译：与支撑结构及其制造方法的MEMS装置
公开(公告)号：EP2495212A3
公开(公告)日：2012-10-31
申请号：EP12170329.2
申请日：2006-07-20
申请人： QUALCOMM MEMS Technologies, Inc.
发明人： Chui, Clarence , Chung, Wonsuk , Ganti, Surya Prakash , Kothari, Manish , Miles, Mark W. , Sampsell, Jeffrey Brian , Sasagawa, Teruo
IPC分类号： B81B3/00 , B81C1/00 , G02B26/00 , G02B26/08
CPC分类号： G02B26/0841 , B81B3/0072 , B81B2201/047 , B81B2203/0163 , B81B2203/019 , B81B2203/0307 , B81B2203/053 , B81C1/00142 , B81C1/00666 , B81C2201/0167 , G02B26/001 , Y10S359/90
摘要： Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

6. 发明公开

EP3121561A4 SENSOR 有权
公开(公告)号：EP3121561A4
公开(公告)日：2018-02-21
申请号：EP15765000
申请日：2015-03-19
申请人： KYOCERA CORP
发明人： NAGATA MASARU , YAMAJI TOKUICHI , TANAHASHI SHIGEO
IPC分类号： G01C19/56 , B81B3/00 , G01P15/08 , G01P15/12 , H01L29/84
CPC分类号： G01C19/5762 , B81B3/0048 , B81B2201/0242 , B81B2203/0154 , B81B2203/019 , G01P15/123 , G01P2015/0857
摘要： A sensor includes a weight body, a frame which is located so as to surround the weight body when viewed from above, a beam part which is provided with flexibility and in which a first end is connected to the weight body and a second end is connected to the frame, and a detection part which is provided on the beam part and detects deformation of the beam part as an electric signal. The beam part includes a main part in which a cross-sectional shape in a direction perpendicular to a longitudinal direction connecting the first end and the second end is a rectangular shape, and an extending part which protrudes from at least one of an upper surface or a lower surface of the main part and extends in the longitudinal direction or extends in a width direction perpendicular to the longitudinal direction when viewed from above.

7. 发明公开

EP3121561A1 SENSOR 有权
标题翻译：传感器
公开(公告)号：EP3121561A1
公开(公告)日：2017-01-25
申请号：EP15765000.3
申请日：2015-03-19
申请人： KYOCERA Corporation
发明人： NAGATA, Masaru , YAMAJI, Tokuichi , TANAHASHI, Shigeo
IPC分类号： G01C19/56 , B81B3/00 , H01L29/84
CPC分类号： G01C19/5762 , B81B3/0048 , B81B2201/0242 , B81B2203/0154 , B81B2203/019 , G01P15/123 , G01P15/18 , G01P2015/0857
摘要： A sensor includes a weight body, a frame which is located so as to surround the weight body when viewed from above, a beam part which is provided with flexibility and in which a first end is connected to the weight body and a second end is connected to the frame, and a detection part which is provided on the beam part and detects deformation of the beam part as an electric signal. The beam part includes a main part in which a cross-sectional shape in a direction perpendicular to a longitudinal direction connecting the first end and the second end is a rectangular shape, and an extending part which protrudes from at least one of an upper surface or a lower surface of the main part and extends in the longitudinal direction or extends in a width direction perpendicular to the longitudinal direction when viewed from above.
摘要翻译：传感器包括配重体，框架，其位于从上方观察时围绕配重体，设置有柔性的梁部，第一端连接到配重体，第二端连接以及设置在光束部上的检测部，检测光束部的变形为电信号。梁部分包括主要部分，其中在垂直于连接第一端和第二端的纵向的方向上的横截面形状是矩形形状，并且延伸部分从上表面或主要部分的下表面并且在从上方观察时沿纵向延伸或者在垂直于纵向方向的宽度方向上延伸。

8. 发明公开

EP1760038A3 Method for Manufacturing a Mass-Spring System 有权
标题翻译：制造微机械结构的方法
公开(公告)号：EP1760038A3
公开(公告)日：2007-10-31
申请号：EP06119036.9
申请日：2006-08-16
申请人： Infineon Technologies SensoNor AS
发明人： Jakobsen, Henrik
IPC分类号： B81C1/00
CPC分类号： B81C1/00142 , B81B2203/0163 , B81B2203/019 , B81C1/00476
摘要： A method for manufacturing a micromechanical mass-spring system comprising a mass and an asymmetric spring is provided. A silicon substrate is provided, and the silicon substrate is etched to define a section upon which the asymmetric spring is to be formed. A surface layer is formed on the surface of the substrate. Etching is then performed to form the asymmetric spring from the surface layer, and further etching releases the mass and spring from the substrate. A device comprising a micromechanical mass-spring system manufactured according to the method is also provided.

9. 发明公开

EP1608590A1 A METHOD FOR MANUFACTURING A MEMBRANE IN A (111) SURFACE OF A (100) SILICIUM WAFER 审中-公开
标题翻译：制造方法膜在（100）硅晶片（111）表面
公开(公告)号：EP1608590A1
公开(公告)日：2005-12-28
申请号：EP04722478.7
申请日：2004-03-22
申请人： Technische Universiteit Delft
发明人： VENSTRA, Warner, Jurrien
IPC分类号： B81C1/00 , B81B3/00
CPC分类号： B81C1/0015 , B81B2201/10 , B81B2201/12 , B81B2203/019 , B81C1/00158 , B81C2201/0132
摘要： The invention relates to a method for the fabrication of a membrane oriented in a (111) plane of a (100) silicon wafer. To this end the method comprises the following steps: applying a mask to both sides of the wafer, wherein portions of the sides are covered by the mask; and the at least partial removal by etching away silicon material from the portions of the two sides of the wafer that are not covered. This method is characterised in that the etching step substantially removes the silicon material forming recesses in the two surfaces of the wafer, such that the walls of the recesses are formed by (111) planes, and in that not covered portions at both sides of the wafer are aligned in relation to one another such that a (111) plane is formed and the distance d between said two planes is less than the thickness of the silicon wafer, so as to form a membrane in the (111) plane having a thickness d. Such a membrane has many application possibilities in the field of MEMS, for example by dividing the membrane into individual cantilevers.

10. 发明公开

EP3308555A2 MEMS-WANDLER ZUM INTERAGIEREN MIT EINEM VOLUMENSTROM EINES FLUIDS UND VERFAHREN ZUM HERSTELLEN DESSELBEN 有权转让
标题翻译：用于与流体的体积流量相互作用的MEMS转换器及其制造方法
公开(公告)号：EP3308555A2
公开(公告)日：2018-04-18
申请号：EP16729884.3
申请日：2016-06-14
申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
发明人： SCHENK, Harald , CONRAD, Holger , GAUDET, Matthieu , SCHIMMANZ, Klaus , LANGA, Sergiu , KAISER, Bert
IPC分类号： H04R19/00 , B81C1/00
CPC分类号： B81B3/0021 , B81B2201/0257 , B81B2201/036 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/0136 , B81B2203/019 , B81B2203/051 , B81C1/00142 , B81C1/0015 , B81C1/00158 , H04R1/023 , H04R1/08 , H04R9/02 , H04R15/00 , H04R17/00 , H04R19/005 , H04R23/002 , H04R2201/003 , H04R2499/11
摘要： The invention relates to a MEMS transducer for interacting with a volume flow of a fluid, comprising a substrate having a cavity, and an electromechanical transducer which is connected to the substrate in the cavity and has an element which can be deformed along a lateral movement direction. A deformation of the deformable element along the lateral movement direction and the volume flow of the fluid are causally related.

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