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1. 发明公开

EP3381202A1 FLEXIBLE MEMS-LEITERPLATTENEINHEIT SOWIE SCHALLWANDLERANORDNUNG 有权
公开(公告)号：EP3381202A1
公开(公告)日：2018-10-03
申请号：EP16774929.0
申请日：2016-09-29
申请人： Usound GmbH
发明人： RUSCONI CLERICI, Andrea , BOTTONI, Ferruccio
IPC分类号： H04R17/00 , B81B3/00
CPC分类号： H04R17/005 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0307 , B81B2207/07 , H04R17/00 , H04R19/02 , H04R19/04 , H04R2201/003
摘要： The invention relates to a MEMS circuit board unit for an electroacoustic transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum, comprising a circuit board and a multilayer piezoelectric structure that allows a membrane, which is provided for this purpose, to vibrate and/or detects vibrations of the membrane, the circuit board advantageously being flexible, and the multilayer piezoelectric structure being embedded in the circuit board. The invention further relates to an electroacoustic transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum, comprising a membrane, a cavity, and a MEMS circuit board unit that includes a circuit board and a multilayer piezoelectric structure which allows the membrane to vibrate and/or detects vibrations of the membrane, the MEMS circuit board unit being designed as indicated above.

2. 发明授权

EP3156361B1 MICROSYSTÈME ÉLECTROMÉCANIQUE COMPRENANT UNE COUCHE DE DECOUPLAGE ET PROCÉDÉ DE FABRICATION 有权
标题翻译：包含解耦层的机电微观系统及其制造方法
公开(公告)号：EP3156361B1
公开(公告)日：2017-11-08
申请号：EP16190126.9
申请日：2016-09-22
申请人： Thales
发明人： FILHOL, Fabien , LEFORT, Pierre-Olivier , LEVERRIER, Bertrand , QUER, Régis , CHAUMET, Bernard
IPC分类号： B81B7/00
CPC分类号： B81B7/0016 , B81B7/0048 , B81B7/0051 , B81B2203/0307 , B81C1/00269 , B81C3/001 , B81C2201/019 , H01L23/10

3. 发明授权

EP2953890B1 MIKROMECHANISCHES BAUELEMENT MIT EINER MEMBRANSTRUKTUR 有权
标题翻译：与膜结构的微机械结构
公开(公告)号：EP2953890B1
公开(公告)日：2016-10-12
申请号：EP14700563.1
申请日：2014-01-03
申请人： Robert Bosch GmbH
发明人： ZOELLIN, Jochen , SCHELLING, Christoph
IPC分类号： B81B3/00
CPC分类号： B81B3/0072 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81B2203/0163 , B81B2203/0307 , B81B2203/04

4. 发明授权

EP2514712B1 MEMS device with central anchor for stress isolation 有权转让
标题翻译：与中央锚应变隔离MEMS器件
公开(公告)号：EP2514712B1
公开(公告)日：2015-08-26
申请号：EP12162868.9
申请日：2012-04-02
申请人： Freescale Semiconductor, Inc.
发明人： Lin, Yizhen , Li, Gary G. , McNeil, Andrew C , Zhang, Lisa Z.
IPC分类号： B81B3/00
CPC分类号： B81B3/0072 , B81B2203/0136 , B81B2203/0307

5. 发明授权

EP2530508B1 Display device 有权
公开(公告)号：EP2530508B1
公开(公告)日：2015-04-29
申请号：EP12170726.9
申请日：2012-06-04
申请人： Pixtronix, Inc.
发明人： Kimura, Yasukazu , Fujiyoshi, Jun , Kuriyagawa, Takeshi , Sonoda, Daisuke
IPC分类号： G02B26/02 , B81C1/00
CPC分类号： G02B26/02 , B32B3/00 , B81B3/0062 , B81B7/02 , B81B2201/047 , B81B2203/0307 , B81B2203/0376 , B81C1/00103 , G02B26/04 , G02F2203/12 , G09G3/34 , G09G5/10 , G09G2300/08 , H02N1/006

6. 发明公开

EP2307307A4 MICRO-POSTS HAVING IMPROVED UNIFORMITY AND A METHOD OF MANUFACTURE THEREOF 审中-公开
标题翻译：具有产生改进的均匀性和过程的微型柱
公开(公告)号：EP2307307A4
公开(公告)日：2014-10-01
申请号：EP09773898
申请日：2009-06-30
申请人： ALCATEL LUCENT USA INC
发明人： BOLLE CRISTIAN A , PARDO FLAVIO
IPC分类号： B81C1/00 , H01L21/027
CPC分类号： H01L21/30604 , B81B2201/047 , B81B2203/0118 , B81B2203/0307 , B81B2203/0361 , B81B2203/0384 , B81B2207/056 , B81C1/00015 , B81C1/00039 , B81C1/00531 , B81C1/00539 , H01L21/3065 , Y10T428/24479

7. 发明授权

EP1652219B1 ANCHORS FOR MICROELECTROMECHANICAL SYSTEMS HAVING AN SOI SUBSTRATE, AND METHOD OF FABRICATING SAME 有权
标题翻译：主播与用于制造SOI衬底的工艺和微机电系统
公开(公告)号：EP1652219B1
公开(公告)日：2013-12-18
申请号：EP04801839.4
申请日：2004-03-31
申请人： ROBERT BOSCH GMBH
发明人： LUTZ, Markus , PARTRIDGE, Aaron , KRONMUELLER, Silvia
IPC分类号： H01L21/00 , H01L29/82
CPC分类号： B81B3/0054 , B81B2203/0307 , B81C1/00126
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having mechanical structures and anchors to secure the mechanical structures to the substrate. The anchors of the present invention are comprised of a material that is relatively unaffected by the release processes of the mechanical structures. In this regard, the etch release process are selective or preferential to the material(s) securing the mechanical structures in relation to the material comprising the anchors. Moreover, the anchors of the present invention are secured to the substrate in such a manner that removal of the insulation layer has little to no affect on the anchoring of the mechanical structures to the substrate.

8. 发明公开

EP2663520A2 METHOD FOR MEMS DEVICE FABRICATION AND DEVICE FORMED 审中-公开
标题翻译：一种用于生产MEMS器件和方法本形装置
公开(公告)号：EP2663520A2
公开(公告)日：2013-11-20
申请号：EP12700915.7
申请日：2012-01-13
申请人： Cavendish Kinetics Inc.
发明人： RENAULT, Mickael , LACEY, Joseph Damian Gordon , JOSHI, Vikram , MAGUIRE, Thomas L.
IPC分类号： B81C1/00
CPC分类号： B81B3/0072 , B81B2203/0118 , B81B2203/0307 , B81B2207/096 , B81C1/00039 , B81C1/00333 , B81C1/00476 , B81C2201/0132 , B81C2201/014 , B81C2203/0145 , B81C2203/0714
摘要： The present invention generally relates to methods for producing MEMS or NEMS devices and the devices themselves. A thin layer of a material having a lower recombination coefficient as compared to the cantilever structure may be deposited over the cantilever structure, the RF electrode and the pull-off electrode. The thin layer permits the etching gas introduced to the cavity to decrease the overall etchant recombination rate within the cavity and thus, increase the etching rate of the sacrificial material within the cavity. The etchant itself may be introduced through an opening in the encapsulating layer that is linearly aligned with the anchor portion of the cantilever structure so that the topmost layer of sacrificial material is etched first. Thereafter, sealing material may seal the cavity and extend into the cavity all the way to the anchor portion to provide additional strength to the anchor portion.

9. 发明公开

EP2346083A4 MEMS SENSOR 有权
标题翻译： MEMS传感器
公开(公告)号：EP2346083A4
公开(公告)日：2012-06-20
申请号：EP09814664
申请日：2009-09-18
申请人： ALPS ELECTRIC CO LTD
发明人： TAKAHASHI TORU , GOCHO HIDEKI , KOBAYASHI KIYOSHI
IPC分类号： H01L29/84 , B81B7/00 , G01P1/02 , G01P15/08 , G01P15/125
CPC分类号： G01P15/125 , B81B7/007 , B81B2203/0307 , B81B2207/07 , B81B2207/097 , B81C2203/036 , G01P1/023 , G01P15/0802 , G01P2015/0814 , H01L21/84 , H01L27/1203

10. 发明公开

EP1864945A2 Michromechanical structure 审中-公开
标题翻译： Michromechanical结构
公开(公告)号：EP1864945A2
公开(公告)日：2007-12-12
申请号：EP07117371.0
申请日：2000-10-02
申请人： Nokia Corporation
发明人： Nieminen, Heikki , Ryhänen, Tapani , Ermolov, Vladimir , Silanto, Samuli
IPC分类号： B81B3/00
CPC分类号： B81B3/0072 , B81B2203/0109 , B81B2203/0307 , H01G5/16
摘要： The invention relates to a micromechanical structures that include movable elements. In particular the invention relates to an arrangement for coupling such movable elements to other structures of a microelectromechanical system (MEMS). The invention is characterized in that the arrangement comprises at least one coupling means (930-936) for coupling the movable element to the fixed structure, and at least one flexible means (980, 990-996) for allowing different thermal expansion between the movable element and the other structure in the direction which is substantially perpendicular to the characteristic movement of the movable element, wherein said coupling means and/or flexible means is reinforced in the direction of the characteristic movement of the movable element.
摘要翻译：本发明涉及包括可移动元件的微机械结构。特别地，本发明涉及用于将这种可移动元件耦合到微机电系统（MEMS）的其他结构的布置。本发明的特征在于，该装置包括用于将可移动元件耦合到固定结构的至少一个耦合装置（930-936），以及用于允许可移动元件之间的不同热膨胀的至少一个柔性装置（980,990-996）元件和另一结构在基本上垂直于可动元件的特性运动的方向上，其中所述耦合装置和/或柔性装置在可动元件的特性运动的方向上被加强。

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