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    • 3. 发明公开
    • WAFER WITH RECESSED PLUG
    • WAFER MIT VERSENKTEM STECKER
    • EP2697158A1
    • 2014-02-19
    • EP12717983.6
    • 2012-04-13
    • Robert Bosch GmbH
    • GRAHAM, Andrew, B.YAMA, GaryO'BRIEN, Gary
    • B81C1/00H01L21/762
    • B81B7/00B81B2203/0307B81C1/00126H01L21/76283
    • In one embodiment, a method of forming a plug includes providing a base layer, providing an intermediate oxide layer above an upper surface of the base layer, providing an upper layer above an upper surface of the intermediate oxide layer, etching a trench including a first trench portion extending through the upper layer, a second trench portion extending through the oxide layer, and a third trench portion extending into the base layer, depositing a first material portion within the third trench portion, depositing a second material portion within the second trench portion, and depositing a third material portion within the first trench portion.
    • 在一个实施例中,形成插头的方法包括提供基底层,在基底层的上表面上方提供中间氧化物层,在中间氧化物层的上表面上方提供上层,蚀刻包括第一 延伸穿过上层的沟槽部分,延伸穿过氧化物层的第二沟槽部分和延伸到基层中的第三沟槽部分,在第三沟槽部分内沉积第一材料部分,在第二沟槽部分内沉积第二材料部分 并且在所述第一沟槽部分内沉积第三材料部分。
    • 5. 发明公开
    • MEMS device with central anchor for stress isolation
    • MEMS-Vorrichtung mit zentralem Anker zur Belastungsisolation
    • EP2514712A2
    • 2012-10-24
    • EP12162868.9
    • 2012-04-02
    • Freescale Semiconductor, Inc.
    • Lin, YizhenLi, Gary G.McNeil, Andrew CZhang, Lisa Z.
    • B81B3/00
    • B81B3/0072B81B2203/0136B81B2203/0307
    • A MEMS device (20) includes a proof mass (32) coupled to and surrounding an immovable structure (30). The immovable structure (30) includes fixed fingers (36, 38) extending outwardly from a body (34) of the structure (30). The proof mass (32) includes movable fingers (60), each of which is disposed between a pair (62) of the fixed fingers (36, 38). A central area (42) of the body (34) is coupled to an underlying substrate (24), with the remainder of the immovable structure (30) and the proof mass (32) being suspended above the substrate (24) to largely isolate the MEMS device (20) from package stress. Additionally, the MEMS device (20) includes isolation trenches (80) and interconnects (46, 50, 64) so that the fixed fingers (36), the fixed fingers (38), and the movable fingers (60) are electrically isolated from one another to yield a differential device configuration.
    • MEMS器件(20)包括耦合到并围绕不可移动结构(30)的检测质量块(32)。 不动结构(30)包括从结构(30)的主体(34)向外延伸的固定指状物(36,38)。 检测质量块(32)包括可动指状物(60),每个指状物设置在固定指状物(36,38)的一对(62)之间。 主体(34)的中心区域(42)联接到下面的基底(24),其中不可移动的结构(30)的其余部分和证明物质(32)悬挂在基底(24)上方以大大隔离 MEMS器件(20)来自封装应力。 另外,MEMS器件(20)包括隔离沟槽(80)和互连(46,50,64),使得固定指状物(36),固定指状物(38)和活动指状物(60)与 彼此产生差分器件配置。
    • 7. 发明公开
    • MEMS SENSOR
    • MEMS-SENSOR
    • EP2346083A1
    • 2011-07-20
    • EP09814664.0
    • 2009-09-18
    • Alps Electric Co., Ltd.
    • TAKAHASHI, ToruGOCHO, HidekiKOBAYASHI, Kiyoshi
    • H01L29/84G01P15/08G01P15/125
    • G01P15/125B81B7/007B81B2203/0307B81B2207/07B81B2207/097B81C2203/036G01P1/023G01P15/0802G01P2015/0814H01L21/84H01L27/1203
    • Particularly, to provide an MEMS sensor with improved bonding structure between movable electrode unit supported on a first substrate side and each of support conductive unit of a fixed electrode, and a lead layer embedded in an insulating layer of a second substrate side facing the first substrate with an interval therebetween.
      An MEMS sensor includes a first substrate 1, a second substrate 2, and a functional layer including a movable electrode unit and a fixed electrode unit which are interposed between the first substrate and the second substrate. A second insulating layer 30, a lead layer 35 and a connection electrode unit 32 are formed on a surface of the second substrate 2, the lead layer being embedded in the second insulating layer, and the connection electrode unit 32 making electrical connection with the lead layer and being individually connected to the support conductive units. A concave portion 37 penetrating up to a surface of the lead layer is formed in a surface of the second insulating layer 30. The connection electrode unit 32 includes a concave region 32a emulating the concave portion 37 and a connection region 32b extending on the surface of the second insulating layer 30 from one of both ends of the concave region. The support conductive units 17 are bonded to the connection region 32b of the connection electrode unit 32.
    • 特别地,为了提供一种在第一基板侧支撑的可动电极单元与固定电极的支撑导电单元之间具有改善的接合结构的MEMS传感器,以及嵌入在面向第一基板的第二基板侧的绝缘层中的引线层 间隔。 MEMS传感器包括第一基板1,第二基板2和包括位于第一基板和第二基板之间的可动电极单元和固定电极单元的功能层。 第二绝缘层30,引线层35和连接电极单元32形成在第二基板2的表面上,引线层嵌入第二绝缘层中,并且连接电极单元32与引线电连接 并且单独地连接到支撑导电单元。 在第二绝缘层30的表面上形成有贯通至引线层的表面的凹部37.连接电极单元32包括模拟凹部37的凹部32a和在该凹部37的表面上延伸的连接区域32b 第二绝缘层30从凹入区域的两端之一。 支撑导电单元17接合到连接电极单元32的连接区域32b。