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1. 发明申请

US20060001492A1 Bandpass amplifier 有权
标题翻译：带通放大器
公开(公告)号：US20060001492A1
公开(公告)日：2006-01-05
申请号：US10882215
申请日：2004-07-02
申请人： Sheng Chang , Jia Chen , Cherng Liu , Hung Chen , Shu Tang , Albert Chen
发明人： Sheng Chang , Jia Chen , Cherng Liu , Hung Chen , Shu Tang , Albert Chen
IPC分类号： H03F3/191
CPC分类号： H03F3/191 , H03F2200/147 , H03F2200/222 , H03F2200/372
摘要： The present invention discloses a bandpass amplifier having gain and bandpass performance. The bandpass amplifier includes an input match unit for matching the gain of the amplifier and having a first filter response; a first bias unit electrically connected to the input match unit for driving the first terminal of the amplifier and having a first high pass filter response; a gain stage electrically connected to the first bias unit for providing the flat gain of the amplifier; a second bias unit electrically connected to the gain stage for driving the second terminal of the amplifier and having a second high pass filter response; and an output match unit electrically connected to the second bias unit for matching the gain of the amplifier and having a second filter response.
摘要翻译：本发明公开了具有增益和带通性能的带通放大器。带通放大器包括用于匹配放大器的增益并具有第一滤波器响应的输入匹配单元; 电连接到输入匹配单元的第一偏置单元，用于驱动放大器的第一端并具有第一高通滤波器响应; 增益级，电连接到第一偏置单元，用于提供放大器的平坦增益; 电连接到增益级的第二偏置单元，用于驱动放大器的第二端并具有第二高通滤波器响应; 以及输出匹配单元，电连接到第二偏置单元，用于匹配放大器的增益并具有第二滤波器响应。

2. 发明授权

US09862070B2 Systems and methods for substrate polishing end point detection using improved friction measurement 有权
公开(公告)号：US09862070B2
公开(公告)日：2018-01-09
申请号：US13459071
申请日：2012-04-27
申请人： Shou-Sung Chang , Hung Chen , Lakshmanan Karuppiah , Paul D. Butterfield , Erik S. Rondum
发明人： Shou-Sung Chang , Hung Chen , Lakshmanan Karuppiah , Paul D. Butterfield , Erik S. Rondum
IPC分类号： B24B49/00 , B24B37/013 , B24B49/16
CPC分类号： B24B37/013 , B24B49/16
摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

3. 发明申请

US20130288577A1 METHODS AND APPARATUS FOR ACTIVE SUBSTRATE PRECESSION DURING CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：化学机械抛光期间主动基板预处理的方法与装置
公开(公告)号：US20130288577A1
公开(公告)日：2013-10-31
申请号：US13459075
申请日：2012-04-27
申请人： Hung Chen , Lakshmanan Karuppiah
发明人： Hung Chen , Lakshmanan Karuppiah
IPC分类号： B24B47/10 , B24B1/00 , B24B37/32
CPC分类号： B24B37/32 , B24B47/10
摘要： In some aspects, a chemical mechanical polishing (CMP) apparatus is provided that includes a polishing head having (a) a rotatable spindle; (b) a membrane coupled to the rotatable spindle and adapted to press a substrate against a polishing pad during polishing of the substrate; and (c) a retaining ring rotatable coupled to the spindle and adapted to surround a substrate being pressed against a polishing pad during polishing and to limit lateral movement of the substrate relative to the polishing head. The CMP apparatus also includes a drive mechanism coupled to the retaining ring and adapted to drive the retaining ring at a different rate of rotation than the spindle during polishing. Numerous other aspects are provided.
摘要翻译：在一些方面，提供了一种化学机械抛光（CMP）装置，其包括具有（a）可旋转主轴的抛光头; （b）膜，其耦合到所述可旋转心轴并适于在衬底的抛光期间将衬底压靠在抛光垫上; 和（c）保持环，其可旋转地联接到所述心轴并且适于围绕在抛光期间被压靠在抛光垫上的衬底并且限制所述衬底相对于所述抛光头的横向运动。 CMP设备还包括联接到保持环的驱动机构，并且适于在抛光期间以与主轴不同的旋转速度驱动保持环。提供了许多其他方面。

4. 发明申请

US20070141954A1 Paired pivot arm 有权
标题翻译：配对枢轴臂
公开(公告)号：US20070141954A1
公开(公告)日：2007-06-21
申请号：US11438497
申请日：2006-05-22
申请人： Hung Chen , Steven Zuniga
发明人： Hung Chen , Steven Zuniga
IPC分类号： B24B51/00 , B24B7/30 , B24B29/00
CPC分类号： B24B37/345 , B24B41/005
摘要： The present invention relates to an apparatus and method for polishing semiconductor substrates. In one embodiment, two polishing heads are mounted on two independent pivoting arms that share one pivot point. Each of the pivoting arms enable the corresponding polishing head direct access to two polishing stations. The polishing system of the present invention provides flexibility and improves throughput.
摘要翻译：本发明涉及一种用于抛光半导体衬底的设备和方法。在一个实施例中，两个抛光头安装在共享一个枢转点的两个独立的旋转臂上。每个枢转臂使相应的抛光头可直接进入两个抛光台。本发明的抛光系统提供灵活性并提高生产量。

5. 发明申请

US20060209243A1 Liquid crystal display with curving data lines 审中-公开
标题翻译：带弯曲数据线的液晶显示器
公开(公告)号：US20060209243A1
公开(公告)日：2006-09-21
申请号：US11384569
申请日：2006-03-20
申请人： Hung Chen , Chao Hung
发明人： Hung Chen , Chao Hung
IPC分类号： G02F1/1343
CPC分类号： G02F1/134309 , G02F2201/52 , G09G3/3614
摘要： A liquid crystal display includes a liquid crystal panel having a plurality of gate lines that are parallel to each other and that each extend along a first direction, and a plurality of data lines that are parallel to each other and that each extend along a second direction substantially orthogonal to the first direction, a plurality of pixel regions defined by points of intersection of the gate lines and the data lines, and a gate driver for driving the gate lines, and a data driver for driving the data lines. Each of the data lines includes curving portions, whereby pixel regions defined by two corresponding data lines each have two curving side boundaries.
摘要翻译：液晶显示器包括具有彼此平行并且各自沿着第一方向延伸的多条栅极线的液晶面板和彼此平行并分别沿着第二方向延伸的多条数据线基本上与第一方向正交的多个像素区域，由栅极线和数据线的相交点限定的多个像素区域以及用于驱动栅极线的栅极驱动器和用于驱动数据线的数据驱动器。每个数据线包括弯曲部分，由两个对应的数据线限定的像素区域各自具有两个弯曲边界。

6. 发明申请

US20060148387A1 Vibration damping in chemical mechanical polishing system 失效
标题翻译：化学机械抛光系统中的振动阻尼
公开(公告)号：US20060148387A1
公开(公告)日：2006-07-06
申请号：US11333992
申请日：2006-01-17
申请人： Hung Chen , John White , Shijian Li , Fred Redeker , Ramin Emami
发明人： Hung Chen , John White , Shijian Li , Fred Redeker , Ramin Emami
IPC分类号： B24B29/00
CPC分类号： B24B37/30 , B24B37/12 , B24B37/32 , B24B41/007
摘要： A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.
摘要翻译：用于化学机械抛光的载体头包括基底，附着到具有用于接触基底的表面的基部的支撑结构以及附接到基部的保持结构，以防止基底沿着表面移动。保持结构和表面限定用于接收基底的空腔。保持结构包括与基座接触的上部，下部和分隔上部和下部的振动阻尼器。振动阻尼器，减震器包括当经受变形时不能反弹到其原始形状的材料。

7. 发明申请

US20050245181A1 Vibration damping during chemical mechanical polishing 有权
标题翻译：化学机械抛光时的振动阻尼
公开(公告)号：US20050245181A1
公开(公告)日：2005-11-03
申请号：US11046189
申请日：2005-01-28
申请人： Hung Chen , Shijian Li , John White , Ramin Emami , Fred Redeker , Steven Zuniga , Ramakrishna Cheboli
发明人： Hung Chen , Shijian Li , John White , Ramin Emami , Fred Redeker , Steven Zuniga , Ramakrishna Cheboli
IPC分类号： B24B5/00 , B24B37/04 , B24B41/06
CPC分类号： B24B37/30
摘要： A carrier head for chemical mechanical polishing is described. The carrier head includes a backing assembly, a housing and a damping material. The backing assembly includes a substrate support surface. The housing is connectable to a drive shaft to rotate with the drive shaft about a rotation axis. In one implementation, the damping material is in a load path between the backing assembly and the housing to reduce transmission of vibrations from the backing assembly to the housing.
摘要翻译：描述了用于化学机械抛光的载体头。载体头包括背衬组件，壳体和阻尼材料。背衬组件包括基板支撑表面。壳体可连接到驱动轴，以驱动轴绕旋转轴线旋转。在一个实施方案中，阻尼材料位于背衬组件和壳体之间的负载路径中，以减少振动从背衬组件传递到壳体。

8. 发明申请

US20050191947A1 Retaining ring with shaped surface 有权
标题翻译：带环形表面的保持环
公开(公告)号：US20050191947A1
公开(公告)日：2005-09-01
申请号：US10988211
申请日：2004-11-12
申请人： Hung Chen , Steven Zuniga , Charles Garretson , Douglas McAllister , Jian Lin , Stacy Meyer , Sidney Huey , Jeonghoon Oh , Trung Doan , Jeffrey Schmidt , Martin Wohlert , Kerry Hughes , James Wang , Danny Cam Lu , Romain Beau De Lamenie , Venkata Balagani , Aden Allen , Michael Fong
发明人： Hung Chen , Steven Zuniga , Charles Garretson , Douglas McAllister , Jian Lin , Stacy Meyer , Sidney Huey , Jeonghoon Oh , Trung Doan , Jeffrey Schmidt , Martin Wohlert , Kerry Hughes , James Wang , Danny Cam Lu , Romain Beau De Lamenie , Venkata Balagani , Aden Allen , Michael Fong
IPC分类号： B24B37/32 , B24B1/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨期间，可以允许环围绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

9. 发明授权

US06575825B2 CMP polishing pad 有权
标题翻译： CMP抛光垫
公开(公告)号：US06575825B2
公开(公告)日：2003-06-10
申请号：US09759858
申请日：2001-01-12
申请人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
发明人： Robert D. Tolles , Steven T. Mear , Gopalakrishna B. Prabhu , Steven Zuniga , Hung Chen
IPC分类号： B24D1102
CPC分类号： B24B37/26 , B24B37/16 , Y10S451/921
摘要： A polishing pad for use in a chemical mechanical polishing system is provided. The pad is mounted to a rotatable platen and comprises a polishing surface and a deflection surface which provides a desired degree of rigidity and compliance to the pad when brought into contact with a substrate. The deflection surface may comprise one or more passageways extending through the pad which vent to atmosphere. In one embodiment, the deflection area defines a raised area and a recessed area. The raised area provides a mounting surface for the platen while the recessed area allows for compliance of the pad. In another embodiment, the deflection area comprises a plurality of channels defining a plurality of slanted protrusions. The channels may be non-intersecting such that the slanted protrusions are elongated portions disposed on the pad. Alternatively, the channels may be intersecting such that the slanted protrusions are isolated from one another and are disposed on the pad in spaced relation.
摘要翻译：提供了一种用于化学机械抛光系统的抛光垫。衬垫安装到可旋转的压板上并且包括抛光表面和偏转表面，当与衬底接触时，该抛光表面和偏转表面提供期望的刚度和顺应性。偏转表面可以包括延伸穿过垫的一个或多个通道，其通向大气。在一个实施例中，偏转区域限定凸起区域和凹陷区域。凸起区域为压板提供安装表面，而凹陷区域允许焊盘的顺应性。在另一个实施例中，偏转区域包括限定多个倾斜突起的多个通道。通道可以不相交，使得倾斜突起是设置在垫上的细长部分。或者，通道可以相交，使得倾斜的突起彼此隔离并且以间隔的关系设置在垫上。

10. 发明授权

US06517415B2 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system 有权
公开(公告)号：US06517415B2
公开(公告)日：2003-02-11
申请号：US09989498
申请日：2001-11-19
申请人： Boris Govzman , Steven M. Zuniga , Hung Chen , Sasson Somekh
发明人： Boris Govzman , Steven M. Zuniga , Hung Chen , Sasson Somekh
IPC分类号： B24B4900
CPC分类号： B24B37/30 , B24B37/0053
摘要： A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

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