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    • 3. 发明申请
    • POLISHING HEAD TESTING WITH MOVABLE PEDESTAL
    • 抛光头测试与可移动的PEDESTAL
    • US20100327900A1
    • 2010-12-30
    • US12829971
    • 2010-07-02
    • Jeffrey P. SchmidtJay RohdeStacy Meyer
    • Jeffrey P. SchmidtJay RohdeStacy Meyer
    • G01R31/26
    • B24B37/34B24B37/0053
    • A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed.
    • 在具有用于支撑测试晶片的基座和可控基座致动器的测试台中测试抛光头,以将基座中心晶片支撑表面和测试晶片移向抛光头。 在本说明书的另一方面,测试晶片可以使用具有定位在基座中心晶片支撑表面周围的第一多个测试晶片接合构件的定位器定位。 在另一方面,晶片位置可以具有第二多个测试晶片接合构件,其位于围绕基座中心晶片支撑表面设置并适于支撑测试晶片的外部晶片支撑表面周围。 第二多个测试晶片接合构件可以围绕环构件的第二圆周分布,第二圆周具有比第一圆周更宽的直径。 描述和要求保护附加的实施例和方面。