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1. 发明专利

AU2021204408A1 Biodegradable Composite and Product Containing Biodegradable Composite 未知
公开(公告)号：AU2021204408A1
公开(公告)日：2022-11-10
申请号：AU2021204408
申请日：2021-06-28
申请人： CHANG HUNG CHING , CHANG SHU TANG , HSU CHUNG KING , WANG JUI TSAI
发明人： HSU CHUNG-KING
IPC分类号： C05F11/08 , B01J20/02 , B01J20/20 , C08K11/00 , C08L67/04 , C12N1/20
摘要： A biodegradable composite includes an organic matter and a porous material, wherein the organic matter has viable bacteria, and a total plate count of the organic matter is greater than or equal to 104 CFU/g. The organic matter accounts for 40% to 80% of a 5 weight of the biodegradable composite. The porous material accounts for 20% to 60 % of the weight of the biodegradable composite. The biodegradable composite could instantly remove unpleasant odor and accelerate a decomposition process to form compost. A product containing the biodegradable composite is provided as well.

2. 发明申请

US20220339681A1 BIODEGRADABLE COMPOSITE AND PRODUCT CONTAINING BIODEGRADABLE COMPOSITE 有权
公开(公告)号：US20220339681A1
公开(公告)日：2022-10-27
申请号：US17379791
申请日：2021-07-19
申请人： CHUNG-KING HSU , JUI-TSAI WANG , SHU-TANG CHANG , HUNG-CHING CHANG
发明人： CHUNG-KING HSU
IPC分类号： B09B3/00 , C08L67/04 , D21H27/00 , D21H21/14 , D21H17/00 , C05F11/08 , C05F9/04
摘要： A biodegradable composite includes an organic matter and a porous material, wherein the organic matter has viable bacteria, and a total plate count of the organic matter is greater than or equal to 104 CFU/g. The organic matter accounts for 40% to 80% of a weight of the biodegradable composite. The porous material accounts for 20% to 60% of the weight of the biodegradable composite. The biodegradable composite could instantly remove unpleasant odor and accelerate a decomposition process to form compost. A product containing the biodegradable composite is provided as well.

3. 发明申请

US20130126932A1 PACKAGE OF ENVIRONMENTAL SENSITIVE ELECTRONIC ELEMENT 有权
标题翻译：环境敏感电子元件包装
公开(公告)号：US20130126932A1
公开(公告)日：2013-05-23
申请号：US13354298
申请日：2012-01-19
申请人： Kuang-Jung Chen , Jian-Lin Wu , Shu-Tang Yeh
发明人： Kuang-Jung Chen , Jian-Lin Wu , Shu-Tang Yeh
IPC分类号： H01L33/56
CPC分类号： H01L51/5256
摘要： A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.
摘要翻译：提供一种包括第一基板，第二基板，环境敏感电子元件，柔性结构层和填充层的环境敏感电子元件的封装。环境敏感电子元件设置在第一基板上并且位于第一基板和第二基板之间。环境敏感电子元件包括阳极层，空穴注入层，空穴传输层，有机发光层，阴极层和电子注入层。柔性结构层设置在环境敏感电子元件上，并且包括软层，捕获层和保护层。捕获层的材料与电子注入层的材料相同。填充层设置在第一基板和第二基板之间，并且封装环境敏感的电子元件和柔性结构层。

4. 发明授权

US08093512B2 Package of environmentally sensitive electronic device and fabricating method thereof 有权
标题翻译：环保型电子器件封装及其制造方法
公开(公告)号：US08093512B2
公开(公告)日：2012-01-10
申请号：US12487658
申请日：2009-06-19
申请人： Kuang-Jung Chen , Jia-Chong Ho , Jing-Yi Yan , Shu-Tang Yeh
发明人： Kuang-Jung Chen , Jia-Chong Ho , Jing-Yi Yan , Shu-Tang Yeh
IPC分类号： H01L23/28
CPC分类号： H01L23/564 , H01L21/56 , H01L23/293 , H01L23/3121 , H01L51/5243 , H01L51/5246 , H01L51/525 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , Y10T29/49002 , H01L2924/00
摘要： A package of an environmentally sensitive electronic device including a first substrate, a second substrate, an environmentally sensitive electronic device, a plurality of barrier structures, and a fill is provided. The second substrate is disposed above the first substrate. The environmentally sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structures are disposed between the first substrate and the second substrate, wherein the barrier structures surround the environmental sensitive electronic device, and the water vapor transmission rate of the barrier structures is less than 10−1 g/m2/day. The fill is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device and the barrier structures.
摘要翻译：提供一种包括第一基板，第二基板，环境敏感电子设备，多个屏障结构和填充物的环境敏感电子设备的封装。第二基板设置在第一基板的上方。环境敏感的电子设备设置在第一基板上并且位于第一基板和第二基板之间。阻挡结构设置在第一基板和第二基板之间，其中阻挡结构围绕环境敏感电子设备，并且阻挡结构的水蒸汽透过率小于10-1g / m 2 /天。填充物设置在第一基板和第二基板之间并且覆盖环境敏感的电子设备和屏障结构。

5. 发明授权

US07445857B2 Organometallic complex and organic electroluminescent devices utilizing the same 有权
标题翻译：有机金属络合物和利用其的有机电致发光器件
公开(公告)号：US07445857B2
公开(公告)日：2008-11-04
申请号：US11212796
申请日：2005-08-29
申请人： Kuo-Hui Shen , Shu-Tang Yeh , Heh-Lung Huang , I-Ho Shen , Miao-Tsai Chu , Tien-Shou Shieh
发明人： Kuo-Hui Shen , Shu-Tang Yeh , Heh-Lung Huang , I-Ho Shen , Miao-Tsai Chu , Tien-Shou Shieh
IPC分类号： H01L51/54 , C09K11/06
CPC分类号： C09K11/06 , C07F15/0033 , C09K2211/1011 , C09K2211/1037 , C09K2211/1092 , C09K2211/185 , H01L51/0059 , H01L51/006 , H01L51/0062 , H01L51/0071 , H01L51/0085 , H01L51/5016 , H05B33/14 , Y10S428/917
摘要： An organometallic complex. The organometallic complex has formula (I): wherein A1 is a substituted or non-substituted aromatic heterocyclic group, A2 is a substituted or non-substituted aryl group, A3 is an acetylacetone group or picolinic acid group, and X is selected from the group consisting of fluorine atom, trifluoromethyl, alkoxy, thioalkyl, and amino. The invention also provides an organic electroluminescent device utilizing the organometallic complex.
摘要翻译：有机金属配合物。有机金属配合物具有式（I）：其中A 1是取代或未取代的芳族杂环基，A 2是取代或未取代的芳基，A 3是乙酰丙酮基或吡啶甲酸基，X选自由氟原子，三氟甲基，烷氧基，硫代烷基和氨基组成。本发明还提供了利用有机金属络合物的有机电致发光器件。

6. 发明授权

US07438980B2 Organometallic complex and organic electroluminescent devices utilizing the same 有权
标题翻译：有机金属络合物和利用其的有机电致发光器件
公开(公告)号：US07438980B2
公开(公告)日：2008-10-21
申请号：US11176274
申请日：2005-07-08
申请人： Shu-Tang Yeh , Tien-Shou Shieh , Mei-Rurng Tseng , Miao-Tsai Chu
发明人： Shu-Tang Yeh , Tien-Shou Shieh , Mei-Rurng Tseng , Miao-Tsai Chu
IPC分类号： H01L51/54 , C09K11/06
CPC分类号： C09K11/06 , C07F15/0033 , C09K2211/1007 , C09K2211/1044 , C09K2211/1051 , C09K2211/185 , H01L51/0059 , H01L51/0062 , H01L51/007 , H01L51/0081 , H01L51/0085 , H01L51/5016 , H05B33/14
摘要： An organometallic complex is provided. The organometallic complex is selected from the group consisting of and wherein C is an acetyl acetone group or picolinic acid group m is 1˜3, n is 0˜3 and m+n=3, wherein D, E and G are the same or different and selected from the group consisting of H, halogen atoms, trifluoromethyl, C1-20 alkyl, C1-20 alkyl halide, C3-10 aryl and C3-20 heterocyclic ring containing O, N or S.
摘要翻译：提供有机金属络合物。所述有机金属络合物选自C，其中C是乙酰丙酮基或吡啶甲酸基，m是1〜3，n是0〜3，m + n = 3，其中D，E和G相同，不同且选自H，卤素原子，三氟甲基，C 1-20烷基，C 1-20烷基卤化物，C 3〜含有O，N或S的芳基和C 3-20 N杂环。

7. 发明授权

US07427552B2 Method for fabricating isolation structures for flash memory semiconductor devices 有权
标题翻译：闪存半导体器件隔离结构的制造方法
公开(公告)号：US07427552B2
公开(公告)日：2008-09-23
申请号：US11556131
申请日：2006-11-02
申请人： Da Jin , Shu Shu Tang , Zuo Ya Yang
发明人： Da Jin , Shu Shu Tang , Zuo Ya Yang
IPC分类号： H01L21/76
CPC分类号： H01L27/115 , H01L27/11521
摘要： A method for fabricating integrated circuit devices, e.g., Flash memory devices, embedded Flash memory devices. The method includes providing a semiconductor substrate, e.g., silicon, silicon on insulator, epitaxial silicon. In a specific embodiment, the semiconductor substrate has a peripheral region and a cell region. The method includes forming a first dielectric layer (e.g., silicon dioxide) having a first thickness overlying a cell region and a second dielectric layer (e.g., silicon dixode) having a second thickness overlying the peripheral region. In a specific embodiment, the cell region is for Flash memory devices and/or other like structures. The method forms a pad oxide layer overlying the first dielectric layer and forms a nitride layer overlying the pad oxide layer. The method includes patterning at least the nitride layer to expose a first trench region in the peripheral region and to expose a second trench region in the cell region, while a portion of the first dielectric layer having the first thickness in the cell region is maintained. The method includes forming a first trench structure having a first depth in the first trench region, while the portion of the first dielectric layer having the first thickness in the cell region protects the second trench region. The method includes removing the portion of the first dielectric layer to expose the second trench region. In a specific embodiment, the method includes subjecting the first trench region, including the first trench structure, and the second trench region with an etching process to continue to form the first trench structure from the first depth to a second depth and to form a second trench structure having a third depth within the second trench region. In the third depth is less than the second depth.
摘要翻译：集成电路器件的制造方法，例如闪存器件，嵌入式闪存器件。该方法包括提供半导体衬底，例如硅，绝缘体上的硅，外延硅。在具体实施例中，半导体衬底具有周边区域和单元区域。该方法包括形成具有覆盖在单元区域上的第一厚度的第一介电层（例如二氧化硅）和覆盖周边区域的第二厚度的第二介电层（例如硅二极管）。在特定实施例中，单元区域用于闪速存储器件和/或其它类似结构。该方法形成覆盖在第一介电层上的衬垫氧化层，并形成覆盖衬垫氧化物层的氮化物层。该方法包括图案化至少该氮化物层以露出外围区域中的第一沟槽区域并露出该单元区域中的第二沟槽区域，同时保持该单元区域中具有第一厚度的第一介电层的一部分。该方法包括在第一沟槽区域中形成具有第一深度的第一沟槽结构，而在单元区域中具有第一厚度的第一介电层的部分保护第二沟槽区。该方法包括移除第一电介质层的部分以暴露第二沟槽区域。在一个具体实施例中，该方法包括用蚀刻工艺对包括第一沟槽结构的第一沟槽区域和第二沟槽区域进行处理，以继续从第一深度到第二深度形成第一沟槽结构，并形成第二沟槽区域沟槽结构在第二沟槽区域内具有第三深度。在第三深度小于第二深度。

8. 发明授权

US3936953A Air impingement system 失效
标题翻译：空气冲击系统
公开(公告)号：US3936953A
公开(公告)日：1976-02-10
申请号：US550971
申请日：1975-02-19
申请人： James L. Chance , Shu Tang Han
发明人： James L. Chance , Shu Tang Han
IPC分类号： D21F5/02 , F26B13/14 , F26B21/00 , F26B13/00
CPC分类号： F26B21/004 , D21F5/02 , F26B13/145
摘要： Method and apparatus for drying a moving web utilizing one or more air caps each including an apertured plate together with a high pressure plenum which is arranged to deliver high pressure air through the apertures in the plate to impinge against the web. The geometry of the plates, their spacing from the web and the positioning of exhaust means are correlated to provide a minimum amount of cross flow interference thereby improving the heat transfer and ultimately the efficiency of the drying operation.
摘要翻译：一种使用一个或多个空气盖来干燥活动网的方法和装置，每个空气盖包括多孔板以及高压集气室，所述高压增压室被布置成将高压空气通过所述板中的所述孔以撞击所述幅材。板的几何形状，它们与幅材的间隔和排气装置的位置相关联，以提供最小量的交叉流动干扰，从而改善传热并最终提高干燥操作的效率。

9. 发明授权

US09142798B2 Package of environmental sensitive electronic element 有权
标题翻译：环保敏感电子元件包装
公开(公告)号：US09142798B2
公开(公告)日：2015-09-22
申请号：US13354298
申请日：2012-01-19
申请人： Kuang-Jung Chen , Jian-Lin Wu , Shu-Tang Yeh
发明人： Kuang-Jung Chen , Jian-Lin Wu , Shu-Tang Yeh
IPC分类号： H01L33/56 , H01L51/52
CPC分类号： H01L51/5256
摘要： A package of an environmental sensitive electronic element including a first substrate, a second substrate, an environmental sensitive electronic element, a flexible structure layer and a filler layer is provided. The environmental sensitive electronic element is disposed on the first substrate and located between the first substrate and the second substrate. The environmental sensitive electronic element includes an anode layer, a hole injecting layer, a hole transporting layer, an organic light emitting layer, a cathode layer and an electron injection layer. The flexible structure layer is disposed on the environmental sensitive electronic element and includes a soft layer, a trapping layer and a protective layer. The material of the trapping layer is the same as the material of the electron injection layer. The filler layer is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive electronic element and the flexible structure layer.
摘要翻译：提供一种包括第一基板，第二基板，环境敏感电子元件，柔性结构层和填充层的环境敏感电子元件的封装。环境敏感电子元件设置在第一基板上并且位于第一基板和第二基板之间。环境敏感电子元件包括阳极层，空穴注入层，空穴传输层，有机发光层，阴极层和电子注入层。柔性结构层设置在环境敏感电子元件上，并且包括软层，捕获层和保护层。捕获层的材料与电子注入层的材料相同。填充层设置在第一基板和第二基板之间，并且封装环境敏感的电子元件和柔性结构层。

10. 发明申请

US20130305263A1 COMMUNICATIONS MANAGEMENT 有权
标题翻译：通信管理
公开(公告)号：US20130305263A1
公开(公告)日：2013-11-14
申请号：US13470048
申请日：2012-05-11
申请人： Jared Go , Aron B. Hall , Wen Shu Tang Lu , Annie Ding
发明人： Jared Go , Aron B. Hall , Wen Shu Tang Lu , Annie Ding
IPC分类号： G06F9/44 , G06F15/173
CPC分类号： G06F8/61 , G06F9/4411 , G06F13/00 , G06F13/102 , G06F2213/0058 , G06F2213/3808
摘要： The creation of a virtual network adapter is disclosed. At least one existing network device having an existing driver is discovered. At least one of an existing device-to-driver mapping and an existing driver associated with the existing network device is removed. A new driver capable of communicating with the existing network device using a common set of primitive commands is installed. The new driver is mapped to the existing device. The use of the virtual network adapter is also disclosed.
摘要翻译：公开了虚拟网络适配器的创建。发现具有现有驱动器的至少一个现有网络设备。移除与现有网络设备相关联的现有设备到驱动器映射和现有驱动器中的至少一个。安装能够使用一组共同的原始命令与现有网络设备通信的新驱动程序。新驱动程序映射到现有设备。还公开了使用虚拟网络适配器。

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