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    • 3. 发明授权
    • Photo-mask having exposure blocking region and methods of designing and fabricating the same
    • 具有曝光阻挡区域的光掩模及其设计和制造方法
    • US07560198B2
    • 2009-07-14
    • US11145985
    • 2005-06-07
    • Il-Yong JangSeong-Woon ChoiSeong-Yong MoonJeong-Yun LeeSung-Hoon Jang
    • Il-Yong JangSeong-Woon ChoiSeong-Yong MoonJeong-Yun LeeSung-Hoon Jang
    • G03F1/00
    • G03F1/36
    • A photo-mask has a main mask pattern in a main region, a density correcting pattern in a peripheral region, and an exposure blocking pattern interposed between the main mask pattern and density correcting pattern. The exposure blocking pattern is configured to prevent the density correcting pattern from being transcribed to a wafer. The photo-mask is made by providing mask substrate on which a mask layer and a photoresist layer are disposed, providing design data that specifies at least the main mask pattern, and using the design data to derive exposure data that controls the exposure of the photoresist layer. The exposure data includes information that specifies the exposure blocking pattern, the portion of the peripheral region to be occupied by the density correcting pattern, and the pattern density of that portion of the peripheral region to be occupied by the density correcting pattern.
    • 光掩模在主区域中具有主掩模图案,在周边区域中具有浓度校正图案,以及插入在主掩模图案和密度校正图案之间的曝光阻挡图案。 曝光阻挡图案被配置为防止将密度校正图案转录到晶片。 光掩模是通过提供其上设置有掩模层和光致抗蚀剂层的掩模基板制成的,提供至少指定主掩模图案的设计数据,并且使用该设计数据来导出控制光致抗蚀剂曝光的曝光数据 层。 曝光数据包括指定曝光阻挡图案的信息,由密度校正图案占据的外围区域的部分以及由密度校正图案占据的外围区域的那部分的图案密度。
    • 6. 发明授权
    • Mask for use in measuring flare, method of manufacturing the mask, method of identifying flare-affected region on wafer, and method of designing new mask to correct for flare
    • 用于测量火炬的掩模,制造掩模的方法,识别晶片上的闪光影响区域的方法以及设计新的掩模以校正闪光的方法
    • US07393615B2
    • 2008-07-01
    • US10974950
    • 2004-10-28
    • Won-Tai KiSeong-Woon ChoiTae-Moon JeongShun-Yong ZinnWoo-Sung HanJung-Min Sohn
    • Won-Tai KiSeong-Woon ChoiTae-Moon JeongShun-Yong ZinnWoo-Sung HanJung-Min Sohn
    • G03F1/00G06F17/21
    • G03F7/70591G03F1/44G03F1/70G03F7/70941
    • A mask for use in measuring flare produced by a projection lens of a photolithography system, a method of manufacturing the mask, a method of identifying a flare-affected region on a wafer, and a method for correcting for the flare to produce photoresist patterns of desired line widths are provided. A first photolithographic process is performed to form photoresist patterns on a test wafer using a mask including a light shielding region having a plurality of light transmission patterns and a light transmission region, and the photoresist patterns formed by light passing through the light transmission patterns of the light shielding region are compared to the photoresist patterns formed by light passing through the light transmission region. The amount of flare produced by the projection lens is quantified using the results of the comparison, and thus it is possible to identify a flare-affected region on the wafer. In addition, it is possible to form uniform photoresist patterns on the wafer by determining the open ratio of the flare-affected region and calculating an effective amount of the flare in the flare-affected region from the amount of flare of the lens and the open ratio. More specifically, a mask is produced in which the line widths of mask patterns are configured, i.e., corrected compared to the first mask, taking into consideration the effective amount of the flare.
    • 用于测量由光刻系统的投影透镜产生的闪光的掩模,掩模的制造方法,识别晶片上的火炬区域的方法,以及用于校正光斑以产生光致抗蚀剂图案的方法 提供所需的线宽。 执行第一光刻工艺以使用包括具有多个透光图案和光透射区域的遮光区域的掩模在测试晶片上形成光致抗蚀剂图案,并且由穿过光传输图案的光形成的光致抗蚀剂图案 将光屏蔽区域与通过光透射区域的光形成的光致抗蚀剂图案进行比较。 使用比较结果来量化由投影透镜产生的闪光量,因此可以识别晶片上的闪光影响区域。 此外,可以通过确定闪光影响区域的开放比率并且从透镜的闪光量和开口的量来计算火炬影响区域中的闪光的有效量,从而在晶片上形成均匀的光致抗蚀剂图案 比。 更具体地,考虑到闪光灯的有效量,产生掩模图案的线宽被配置的掩模,即与第一掩模相比校正的掩模。
    • 9. 发明授权
    • Methods for forming pattern using electron beam and cell masks used in electron beam lithography
    • 在电子束光刻中使用的电子束和细胞掩模形成图案的方法
    • US07736838B2
    • 2010-06-15
    • US11590878
    • 2006-11-01
    • Hee-Bom KimSeong-Woon Choi
    • Hee-Bom KimSeong-Woon Choi
    • G03C5/00
    • B82Y40/00B82Y10/00G03F1/78H01J37/3174Y10S430/143
    • Provided methods for forming a pattern using electron beam and cell masks for electron beam lithography. The methods may include forming a resist layer on a substrate, the resist layer including a first region, a second region surrounding the first region, and a third region surrounding the second region. The second may be irradiated with electron beam at a first dose, and the third region may be irradiated with an electron beam at a second dose less than the first dose. The cell mask may include a mask substrate and a shielding region disposed on the mask substrate. A transmitting region may extend a distance from the shielding region. A gray pattern region may be disposed around the transmitting region. The gray pattern region may include patterns having a pitch smaller than a resolution limit.
    • 提供了使用电子束形成图案的方法和用于电子束光刻的单元掩模。 所述方法可以包括在衬底上形成抗蚀剂层,抗蚀剂层包括第一区域,围绕第一区域的第二区域和围绕第二区域的第三区域。 可以以第一剂量用电子束照射第二区域,并且可以以小于第一剂量的第二剂量用电子束照射第三区域。 细胞掩模可以包括掩模基板和设置在掩模基板上的屏蔽区域。 透射区域可以从屏蔽区域延伸一段距离。 灰色图案区域可以设置在发送区域周围。 灰色图案区域可以包括具有小于分辨率限制的间距的图案。