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    • 4. 发明授权
    • Method of fabricating chrome-less phase shift mask
    • 无铬相移掩模的制造方法
    • US07595136B2
    • 2009-09-29
    • US11325149
    • 2006-01-03
    • Gi-Sung YoonIn-Kyun ShinSung-Hyuck Kim
    • Gi-Sung YoonIn-Kyun ShinSung-Hyuck Kim
    • G03F1/00
    • G03F1/34
    • An embodiment of a method of fabricating a chrome-less phase shift mask includes forming a hard mask film on a surface of a mask body having a trench circuit area and a mesa circuit area. The hard mask film is patterned. The mask body is anisotropically etched using the hard mask pattern as an etching mask to form pre-pitting patterns in the trench circuit area. The hard mask film having the hard mask pattern is again patterned to form a mesa hard mask pattern on the mesa circuit area and to expose a top surface of the trench circuit area. The mask body is anisotropically etched to form phase shift hillock patterns in the mesa circuit area and phase shift pitting patterns in the trench circuit area. Phase shift pitting patterns and phase shift hillock patterns may be formed on a single body.
    • 制造无铬相移掩模的方法的实施例包括在具有沟槽电路区域和台面电路区域的掩模体的表面上形成硬掩模膜。 硬掩模膜被图案化。 使用硬掩模图案作为蚀刻掩模对掩模体进行各向异性蚀刻,以在沟槽电路区域中形成预点蚀图案。 具有硬掩模图案的硬掩模膜再次被图案化以在台面电路区域上形成台面硬掩模图案并且暴露沟槽电路区域的顶表面。 掩模体被各向异性地蚀刻以在台面电路区域中形成相移小丘图案,并在沟槽电路区域中形成相移点蚀图案。 相移点蚀图案和相移小丘图案可以形成在单个主体上。
    • 6. 发明授权
    • Method of manufacturing chromeless phase shift mask
    • 无色相移掩模的制造方法
    • US07112390B2
    • 2006-09-26
    • US10368630
    • 2003-02-20
    • Myung-Ah KangIn-Kyun Shin
    • Myung-Ah KangIn-Kyun Shin
    • G01F9/00
    • G03F1/34
    • A method of manufacturing a chromeless phase shift mask includes forming a photoresist film pattern on a wafer using a basic form of the chromeless phase shift mask and measuring a specification of the photoresist film pattern. The basic form of the chromeless phase shift mask is isotropically etched to modify the phase shifter of the mask unless the photoresist film pattern specification is within a specified range. Accordingly, an application-specific chromeless phase shift mask can be produced for use in any exposure apparatus and under any exposure condition.
    • 无铬相变掩模的制造方法包括:使用无铬相移掩模的基本形式在晶片上形成光致抗蚀剂膜图案,并测量光致抗蚀剂膜图案的规格。 无铬相变掩模的基本形式被各向同性地蚀刻以修改掩模的移相器,除非光致抗蚀剂膜图案规格在指定范围内。 因此,可以制造用于任何曝光装置和任何曝光条件下的专用无铬相移掩模。
    • 8. 发明授权
    • Phase shift mask
    • 相移掩模
    • US07541118B2
    • 2009-06-02
    • US11969979
    • 2008-01-07
    • Myung-Ah KangIn-Kyun Shin
    • Myung-Ah KangIn-Kyun Shin
    • G03F1/00G03F1/14
    • G03F1/34G03F1/30
    • A phase shift mask includes a first non-phase shift region, a first phase shift region adjacent the first non-phase shift region, a second non-phase shift region, a second phase shift region adjacent the second non-phase shift region, and an opaque region interposed between said second phase shift and non-phase shift regions. The first and second non-phase shift regions transmit an exposure light at its original phase, whereas the first and second phase shift regions invert the phase of the exposure light. The phase shift mask is manufactured by first forming a layer of opaque material on a transparent mask substrate. The first phase shift region and the second phase and non-phase shift regions are formed by selectively etching the opaque material and underlying portions of the mask substrate to form recesses in the substrate. On the other hand, only the opaque layer is etched from the mask substrate to form the first non-phase shift region, and is left on the substrate between the second phase shift and non-phase shift regions.
    • 相移掩模包括第一非相移区域,与第一非相移区域相邻的第一相移区域,第二非相移区域,与第二非相移区域相邻的第二相移区域,以及 位于所述第二相移和非相移区域之间的不透明区域。 第一和第二非相移区域以其初始相位发射曝光光,而第一和第二相移区域反转曝光光的相位。 通过在透明掩模基板上首先形成不透明材料层来制造相移掩模。 通过选择性地蚀刻不透明材料和掩模基板的下面部分形成第一相移区域和第二相位和非相移区域,以在衬底中形成凹陷。 另一方面,从掩模基板仅蚀刻不透明层以形成第一非相移区域,并且留在第二相移与非相移区域之间的衬底上。