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    • 2. 发明授权
    • Mask for use in measuring flare, method of manufacturing the mask, method of identifying flare-affected region on wafer, and method of designing new mask to correct for flare
    • 用于测量火炬的掩模,制造掩模的方法,识别晶片上的闪光影响区域的方法以及设计新的掩模以校正闪光的方法
    • US07393615B2
    • 2008-07-01
    • US10974950
    • 2004-10-28
    • Won-Tai KiSeong-Woon ChoiTae-Moon JeongShun-Yong ZinnWoo-Sung HanJung-Min Sohn
    • Won-Tai KiSeong-Woon ChoiTae-Moon JeongShun-Yong ZinnWoo-Sung HanJung-Min Sohn
    • G03F1/00G06F17/21
    • G03F7/70591G03F1/44G03F1/70G03F7/70941
    • A mask for use in measuring flare produced by a projection lens of a photolithography system, a method of manufacturing the mask, a method of identifying a flare-affected region on a wafer, and a method for correcting for the flare to produce photoresist patterns of desired line widths are provided. A first photolithographic process is performed to form photoresist patterns on a test wafer using a mask including a light shielding region having a plurality of light transmission patterns and a light transmission region, and the photoresist patterns formed by light passing through the light transmission patterns of the light shielding region are compared to the photoresist patterns formed by light passing through the light transmission region. The amount of flare produced by the projection lens is quantified using the results of the comparison, and thus it is possible to identify a flare-affected region on the wafer. In addition, it is possible to form uniform photoresist patterns on the wafer by determining the open ratio of the flare-affected region and calculating an effective amount of the flare in the flare-affected region from the amount of flare of the lens and the open ratio. More specifically, a mask is produced in which the line widths of mask patterns are configured, i.e., corrected compared to the first mask, taking into consideration the effective amount of the flare.
    • 用于测量由光刻系统的投影透镜产生的闪光的掩模,掩模的制造方法,识别晶片上的火炬区域的方法,以及用于校正光斑以产生光致抗蚀剂图案的方法 提供所需的线宽。 执行第一光刻工艺以使用包括具有多个透光图案和光透射区域的遮光区域的掩模在测试晶片上形成光致抗蚀剂图案,并且由穿过光传输图案的光形成的光致抗蚀剂图案 将光屏蔽区域与通过光透射区域的光形成的光致抗蚀剂图案进行比较。 使用比较结果来量化由投影透镜产生的闪光量,因此可以识别晶片上的闪光影响区域。 此外,可以通过确定闪光影响区域的开放比率并且从透镜的闪光量和开口的量来计算火炬影响区域中的闪光的有效量,从而在晶片上形成均匀的光致抗蚀剂图案 比。 更具体地,考虑到闪光灯的有效量,产生掩模图案的线宽被配置的掩模,即与第一掩模相比校正的掩模。
    • 3. 发明申请
    • Mask for use in measuring flare, method of manufacturing the mask, method of identifying flare-affected region on wafer, and method of designing new mask to correct for flare
    • 用于测量火炬的掩模,制造掩模的方法,识别晶片上的闪光影响区域的方法以及设计新的掩模以校正闪光的方法
    • US20050083518A1
    • 2005-04-21
    • US10974950
    • 2004-10-28
    • Won-Tai KiSeong-Woon ChoiTae-Moon JeongShun-Yong ZinnWoo-Sung HanJung-Min Sohn
    • Won-Tai KiSeong-Woon ChoiTae-Moon JeongShun-Yong ZinnWoo-Sung HanJung-Min Sohn
    • G03F1/14G03F7/20G01N21/00
    • G03F7/70591G03F1/44G03F1/70G03F7/70941
    • A mask for use in measuring flare produced by a projection lens of a photolithography system, a method of manufacturing the mask, a method of identifying a flare-affected region on a wafer, and a method for correcting for the flare to produce photoresist patterns of desired line widths are provided. A first photolithographic process is performed to form photoresist patterns on a test wafer using a mask including a light shielding region having a plurality of light transmission patterns and a light transmission region, and the photoresist patterns formed by light passing through the light transmission patterns of the light shielding region are compared to the photoresist patterns formed by light passing through the light transmission region. The amount of flare produced by the projection lens is quantified using the results of the comparison, and thus it is possible to identify a flare-affected region on the wafer. In addition, it is possible to form uniform photoresist patterns on the wafer by determining the open ratio of the flare-affected region and calculating an effective amount of the flare in the flare-affected region from the amount of flare of the lens and the open ratio. More specifically, a mask is produced in which the line widths of mask patterns are configured, i.e., corrected compared to the first mask, taking into consideration the effective amount of the flare.
    • 用于测量由光刻系统的投影透镜产生的闪光的掩模,掩模的制造方法,识别晶片上的火炬区域的方法,以及用于校正光斑以产生光致抗蚀剂图案的方法 提供所需的线宽。 执行第一光刻工艺以使用包括具有多个透光图案和光透射区域的遮光区域的掩模在测试晶片上形成光致抗蚀剂图案,并且由穿过光传输图案的光形成的光致抗蚀剂图案 将光屏蔽区域与通过光透射区域的光形成的光致抗蚀剂图案进行比较。 使用比较结果来量化由投影透镜产生的闪光量,因此可以识别晶片上的闪光影响区域。 此外,可以通过确定闪光影响区域的开放比率并且从透镜的闪光量和开口的量来计算火炬影响区域中的闪光的有效量,从而在晶片上形成均匀的光致抗蚀剂图案 比。 更具体地,考虑到闪光灯的有效量,产生掩模图案的线宽被配置的掩模,即与第一掩模相比校正的掩模。
    • 5. 发明授权
    • Simulation method and system for design of aperture in exposure apparatus and recording medium in which the simulation method is recorded
    • 用于记录曝光装置和记录介质中孔径设计的仿真方法和系统
    • US07376543B2
    • 2008-05-20
    • US10418220
    • 2003-04-18
    • Shun-Yong Zinn
    • Shun-Yong Zinn
    • G06G7/62
    • G03F7/705G03F7/70091G03F7/70125
    • A simulation method designs an aperture to obtain optimum resolution and DOF in consideration of the layout of a circuit pattern of a photomask, and a recording medium in which the simulation method is recorded. The simulation method for designing an aperture in an exposure apparatus including a light source, an optical lens group, a photomask, an aperture, receives the layout information of the photomask. The aperture is divided into a plurality of pixels. The pixels of the aperture are flipped, a photolithography simulation is executed to produce a simulated photoresist pattern, and the shape of the aperture that provides an optimum resolution for the simulated photoresist pattern is searched for. Beneficially, a system is provided to execute the method. Also, beneficially, the simulation method may be stored on a storage medium.
    • 考虑到光掩模的电路图案的布局以及其中记录了仿真方法的记录介质,仿真方法设计孔径以获得最佳分辨率和自由度。 用于设计包括光源,光学透镜组,光掩模,光圈的曝光装置中的光圈的模拟方法接收光掩模的布局信息。 孔径被分成多个像素。 旋转孔径的像素,执行光刻模拟以产生模拟的光致抗蚀剂图案,并且搜索为模拟的光致抗蚀剂图案提供最佳分辨率的孔的形状。 有益的是,提供了一种执行该方法的系统。 此外,有利的是,可以将模拟方法存储在存储介质上。
    • 7. 发明授权
    • Mask for use in measuring flare, method of manufacturing the mask, method of identifying flare-affected region on wafer, and method of designing new mask to correct for flare
    • 用于测量火炬的掩模,制造掩模的方法,识别晶片上的闪光影响区域的方法以及设计新的掩模以校正闪光的方法
    • US06835507B2
    • 2004-12-28
    • US10211359
    • 2002-08-05
    • Won-Tai KiSeong-Woon ChoiTae-Moon JeongShun-Yong ZinnWoo-Sung HanJung-Min Sohn
    • Won-Tai KiSeong-Woon ChoiTae-Moon JeongShun-Yong ZinnWoo-Sung HanJung-Min Sohn
    • G03F900
    • G03F7/70591G03F1/44G03F1/70G03F7/70941
    • A mask for use in measuring flare produced by a projection lens of a photolithography system, a method of manufacturing the mask, a method of identifying a flare-affected region on a wafer, and a method for correcting for the flare to produce photoresist patterns of desired line widths are provided. A first photolithographic process is performed to form photoresist patterns on a test wafer using a mask including a light shielding region having a plurality of light transmission patterns and a light transmission region, and the photoresist patterns formed by light passing through the light transmission patterns of the light shielding region are compared to the photoresist patterns formed by light passing through the light transmission region. The amount of flare produced by the projection lens is quantified using the results of the comparison, and thus it is possible to identify a flare-affected region on the wafer. In addition, it is possible to form uniform photoresist patterns on the wafer by determining the open ratio of the flare-affected region and calculating an effective amount of the flare in the flare-affected region from the amount of flare of the lens and the open ratio. More specifically, a mask is produced in which the line widths of mask patterns are configured, i.e., corrected compared to the first mask, taking into consideration the effective amount of the flare.
    • 用于测量由光刻系统的投影透镜产生的闪光的掩模,掩模的制造方法,识别晶片上的火炬区域的方法,以及用于校正光斑以产生光致抗蚀剂图案的方法 提供所需的线宽。 执行第一光刻工艺以使用包括具有多个透光图案和光透射区域的遮光区域的掩模在测试晶片上形成光致抗蚀剂图案,并且由穿过光传输图案的光形成的光致抗蚀剂图案 将光屏蔽区域与通过光透射区域的光形成的光致抗蚀剂图案进行比较。 使用比较结果来量化由投影透镜产生的闪光量,因此可以识别晶片上的闪光影响区域。 此外,可以通过确定闪光影响区域的开放比率并且从透镜的闪光量和开口的量来计算火炬影响区域中的闪光的有效量,从而在晶片上形成均匀的光致抗蚀剂图案 比。 更具体地,考虑到闪光灯的有效量,产生掩模图案的线宽被配置的掩模,即与第一掩模相比校正的掩模。