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1. 发明授权

US06931722B2 Method of fabricating printed circuit board with mixed metallurgy pads 失效
标题翻译：用混合冶金垫制造印刷电路板的方法
公开(公告)号：US06931722B2
公开(公告)日：2005-08-23
申请号：US10395944
申请日：2003-03-24
申请人： Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
发明人： Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
IPC分类号： H05K3/24 , H05K3/28 , H05K3/34 , H05K3/42 , H05K3/02
CPC分类号： H05K3/243 , H05K3/28 , H05K3/3452 , H05K3/3473 , H05K3/42 , H05K2201/0391 , H05K2203/0315 , H05K2203/0574 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.
摘要翻译：公开了一种制造印刷电路器件的方法，该印刷电路器件包括电绝缘衬底以及形成在衬底顶表面上的第一组，第二组和第三组导体。该方法包括在第二导体组上形成氧化物层; 在氧化物层上形成焊料掩模; 在第一组导体上形成复合层; 以及在所述第三组导体的至少一部分上形成焊料层。

2. 发明授权

US06586683B2 Printed circuit board with mixed metallurgy pads and method of fabrication 有权
公开(公告)号：US06586683B2
公开(公告)日：2003-07-01
申请号：US09844814
申请日：2001-04-27
申请人： Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A. Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
发明人： Edward L. Arrington , Anilkumar C. Bhatt , Edmond O. Fey , Kevin T. Knadle , John J. Konrad , Joseph A. Kotylo , Jeffrey McKeveny , Jose A. Rios , Amit K. Sarkhel , Andrew M. Seman , Timothy L. Wells
IPC分类号： H05K103
CPC分类号： H05K3/243 , H05K3/28 , H05K3/3452 , H05K3/3473 , H05K3/42 , H05K2201/0391 , H05K2203/0315 , H05K2203/0574 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

3. 发明授权

US5311660A Methyl chloroform-free desmear process in additive circuitization 失效
标题翻译：甲基无氯化除垢工艺的加成电路
公开(公告)号：US5311660A
公开(公告)日：1994-05-17
申请号：US15742
申请日：1993-02-10
申请人： Warren A. Alpaugh , Anilkumar C. Bhatt , Michael J. Canestaro , Robert J. Day , Edmond O. Fey , John E. Larrabee
发明人： Warren A. Alpaugh , Anilkumar C. Bhatt , Michael J. Canestaro , Robert J. Day , Edmond O. Fey , John E. Larrabee
IPC分类号： H05K3/26 , H05K3/00 , H05K3/42 , H01K3/10
CPC分类号： H05K3/0055 , H05K2203/0783 , H05K2203/0789 , H05K2203/0796 , H05K2203/081 , H05K2203/088 , Y10T29/49165
摘要： Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution. The surface of the printed circuit board is then seeded, the intended circuitization is photolithographically defined on the printed circuit board, and the circuitization, including the surface circuitization and the plated through hole circuitization, is additively plated.
摘要翻译：公开了一种对印刷电路板进行钻孔，去除和附加电路化的方法。印刷电路板在产生玻璃和聚合物涂抹通孔和通孔的条件下钻孔。通过对钻孔的印刷电路板进行蒸气喷射除去颗粒物。接下来，将印刷电路板浸泡在溶剂中以使印刷电路板的电路插板上的钻头污迹膨胀。然后通过夹带在气体中除去该溶剂，并且将水性，酸性氧化溶液流通过印刷电路板孔，以除去通孔中的溶胀污迹并产生导体回蚀。在水冲洗之后，将水性还原溶液通过印刷电路板以减少并除去酸性氧化性水溶液，例如残留的酸性水溶液。漂洗印刷电路板以除去还原水溶液。然后将印刷电路板的表面接种，将预期的电路光刻地定义在印刷电路板上，并且包括表面电路化和电镀通孔电路的电路被附加电镀。

4. 发明授权

US5268260A Photoresist develop and strip solvent compositions and method for their use 失效
标题翻译：光刻胶开发和剥离其使用的溶剂组合物和方法
公开(公告)号：US5268260A
公开(公告)日：1993-12-07
申请号：US781542
申请日：1991-10-22
申请人： Nageshwer R. Bantu , Anilkumar C. Bhatt , Ashwinkumar C. Bhatt , Joseph A. Kotylo , Gerald W. Jones , Robert J. Owen , Kostas Papathomas , Anaya K. Vardya
发明人： Nageshwer R. Bantu , Anilkumar C. Bhatt , Ashwinkumar C. Bhatt , Joseph A. Kotylo , Gerald W. Jones , Robert J. Owen , Kostas Papathomas , Anaya K. Vardya
IPC分类号： G03F7/32 , G03F7/42 , H05K3/06 , G03F7/30
CPC分类号： G03F7/422 , G03F7/325
摘要： Simple, environmentally friendly developers and strippers are disclosed for free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases both the developers and the strippers include gamma butyrolactone, propylene carbonate and benzyl alcohol, optionally also including a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water.
摘要翻译：公开了简单的，环保的显影剂和剥离剂，用于自由基引发的可加聚合的抗蚀剂，阳离子固化的抗蚀剂和焊接掩模以及Vacrel光致抗蚀剂。在所有情况下，显影剂和剥离剂都包括γ-丁内酯，碳酸亚丙酯和苄醇，任选地还包括少量甲醇，乙醇，异丙醇，丙二醇单甲基乙酸酯，乙二醇单甲醚，甲酰胺，硝基甲烷，环氧丙烷或甲基乙基酮，丙酮和水。

5. 发明授权

US4971715A Phenolic-free stripping composition and use thereof 失效
标题翻译：无酚剥离组合物及其用途
公开(公告)号：US4971715A
公开(公告)日：1990-11-20
申请号：US272847
申请日：1988-11-18
申请人： Richard G. Armant , Edward L. Arrington , Anilkumar C. Bhatt , Donald M. Egleton , Frederick M. Ortloff , Joseph J. Sniezek , John A. Welsh
发明人： Richard G. Armant , Edward L. Arrington , Anilkumar C. Bhatt , Donald M. Egleton , Frederick M. Ortloff , Joseph J. Sniezek , John A. Welsh
IPC分类号： G03F7/42 , H01L21/027 , H01L21/30
CPC分类号： G03F7/426
摘要： A stripping composition containing O-dichlorobenzene, dodecylbenzene sulfonic acid, perchloroethylene, and optionally an aromatic hydrocarbon containing at least 8 carbon atoms, and use thereof for removing photoresist.

6. 发明授权

US5156730A Electrode array and use thereof 失效
标题翻译：电极阵列及其用途
公开(公告)号：US5156730A
公开(公告)日：1992-10-20
申请号：US720677
申请日：1991-06-25
申请人： Anilkumar C. Bhatt , Michael T. Freeman , John J. Konrad , Narendra G. Shah
发明人： Anilkumar C. Bhatt , Michael T. Freeman , John J. Konrad , Narendra G. Shah
IPC分类号： C25D7/12 , C25D17/10 , C25D17/12 , C25F7/00 , H05K3/24
CPC分类号： C25D17/10 , H05K3/241
摘要： An electrode array containing individual electrode segments having means to electrically bias each of the segments individually and to control the quantity of current supplied to each of the electrode segments individually; and use of the array.
摘要翻译：一种电极阵列，其包含单独的电极段，其具有单独地电气地偏置每个所述段的装置并且分别控制提供给每个所述电极段的电流量; 并使用数组。

7. 发明授权

US06781064B1 Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same 失效
标题翻译：具有无玻璃非导电层的电子器件封装的印刷电路板及其形成方法
公开(公告)号：US06781064B1
公开(公告)日：2004-08-24
申请号：US09342584
申请日：1999-06-29
申请人： Bernd K. Appelt , Anilkumar C. Bhatt , James W. Fuller, Jr. , John M. Lauffer , Voya R. Markovich , William J. Rudik , William E. Wilson
发明人： Bernd K. Appelt , Anilkumar C. Bhatt , James W. Fuller, Jr. , John M. Lauffer , Voya R. Markovich , William J. Rudik , William E. Wilson
IPC分类号： H05K103
CPC分类号： H01L23/564 , H01L21/481 , H01L23/498 , H01L23/49894 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/181 , H05K1/036 , H05K1/0366 , H05K3/429 , H05K3/4626 , H05K3/4641 , H05K2201/0195 , H05K2201/0769 , H05K2201/09718 , H05K2201/09881 , H01L2924/00014 , H01L2924/00012
摘要： A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package. This printed circuit board includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.
摘要翻译：一种用于诸如球栅阵列封装或有机芯片载体封装的电子器件封装中的印刷电路板。该印刷电路板包括一个无玻璃的电介质，用于分离和绝缘电源芯，电路或电镀通孔，以防止导电材料沿玻璃基预浸料衬底迁移引起的短路。

8. 发明授权

US06495239B1 Dielectric structure and method of formation 失效
标题翻译：介电结构和形成方法
公开(公告)号：US06495239B1
公开(公告)日：2002-12-17
申请号：US09458291
申请日：1999-12-10
申请人： Anilkumar C. Bhatt , Stephen J. Fuerniss , Roy H. Magnuson , Voya R. Markovich
发明人： Anilkumar C. Bhatt , Stephen J. Fuerniss , Roy H. Magnuson , Voya R. Markovich
IPC分类号： B32B310
CPC分类号： B32B7/04 , B32B27/26 , B32B27/32 , B32B2250/40 , B32B2305/72 , H05K3/0023 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4641 , H05K2201/09509 , H05K2201/09536 , Y10S428/901 , Y10T428/24273 , Y10T428/28 , Y10T428/31511
摘要： A dielectric structure, wherein two fully cured photoimageable dielectric (PID) layers of the structure are nonadhesively interfaced by a partially cured PID layer. The partially cured PID layer includes a power plane sandwiched between a first partially cured PID sheet and a second partially cured PID sheet. The fully cured PID layers each include an internal power plane, a plated via having a blind end conductively coupled to the internal power plane, and a plated via passing through the fully cured PID layer. The dielectric structure may further include a first PID film partially cured and nonadhesively coupled to one of the fully cured PID layers. The dialectric structure may further include a second PID film partially cured and nonadhesively coupled to the other fully cured PID layer.
摘要翻译：一种电介质结构，其中该结构的两个完全固化的可光成像电介质（PID）层通过部分固化的PID层非粘性地接合。部分固化的PID层包括夹在第一部分固化的PID片和第二部分固化的PID片之间的动力平面。完全固化的PID层各自包括内部电源平面，具有导电耦合到内部电源平面的盲端的电镀通孔以及穿过完全固化的PID层的电镀通孔。电介质结构还可以包括部分固化并非粘性地耦合到完全固化的PID层之一的第一PID膜。所述方程式结构还可以包括部分固化并非粘性地耦合到另一完全固化的PID层的第二PID膜。

9. 发明授权

US06221694B1 Method of making a circuitized substrate with an aperture 失效
标题翻译：制造具有孔径的电路化基板的方法
公开(公告)号：US06221694B1
公开(公告)日：2001-04-24
申请号：US09343080
申请日：1999-06-29
申请人： Anilkumar C. Bhatt , Michael J. Cummings , Thomas R. Miller , Kristen A. Stauffer , Michael Wozniak
发明人： Anilkumar C. Bhatt , Michael J. Cummings , Thomas R. Miller , Kristen A. Stauffer , Michael Wozniak
IPC分类号： H01L2144
CPC分类号： H01L21/4803 , H01L21/4846 , H01L21/486 , H01L23/13 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/181 , H05K1/021 , H05K1/182 , H05K3/0061 , H05K3/427 , H05K2201/09554 , H05K2201/09981 , H05K2203/049 , H01L2224/05599 , H01L2924/00
摘要： A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and routing out a preselected portion of the base member to form an aperture. Metallization of the dielectric member and the walls of the aperture then occurs, followed by circuitization of the surfaces of the dielectric member. Direct metallization of the aperture walls eliminates many manufacturing steps previously required to metallize the aperture walls.
摘要翻译：制造可用作芯片载体结构的电路化衬底的方法。该方法包括以下步骤：提供电介质构件并布置出基底构件的预选部分以形成孔。然后发生电介质构件和孔的壁的金属化，随后电介质构件的表面被电路化。孔壁的直接金属化消除了先前为孔壁金属化所需的许多制造步骤。

10. 发明授权

US06187965B1 Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric units 失效
标题翻译：从包含至少10重量％单体单元的光刻废料流中回收高沸点溶剂的方法
公开(公告)号：US06187965B1
公开(公告)日：2001-02-13
申请号：US09188007
申请日：1998-11-06
申请人： Anilkumar C. Bhatt , Jerome J. Wagner
发明人： Anilkumar C. Bhatt , Jerome J. Wagner
IPC分类号： C07C2980
CPC分类号： C07D307/33 , C07C29/80 , C07C33/20 , C07C33/22 , C07C33/24
摘要： A method of recovering benzyl alcohol, gamma butyrolactone, or propylene carbonate from an impure effluent stream of an industrial process is provided. The effluent waste stream contains greater than about 10 percent by weight of monomeric units that are reacted to form larger oligomers and polymers. The first step in the recovery process involves polymerizing the monomeric units present in the effluent waste stream under conditions effective to reduce the concentration of monomeric units in the waste stream to less than about 10 weight percent. The waste stream then is fed to a first separation stage where it is separated into (i) a gaseous stream of water, soluble gases, and volatile contaminants and (ii) a suspension comprising the high boiling solvent, semi-volatile materials, and non-volatile contaminants and materials. Then the dewatered, low vapor pressure, high boiling solvent-containing suspension is either distilled or evaporated to separate the high boiling solvent from non-volatile materials. In this second separation stage, the solvent-containing suspension is separated into (i) a solvent-containing fraction, and (ii) a sludge fraction. The sludge fraction contains non-volatile materials in the high boiling solvent.
摘要翻译：提供了从工业过程不纯的流出物流中回收苄醇，γ-丁内酯或碳酸亚丙酯的方法。流出物废物流含有大于约10重量％的单体单元，其被反应以形成较大的低聚物和聚合物。回收过程中的第一步包括在有效降低废物流中的单体单元浓度至小于约10重量％的条件下聚合存在于流出物废物流中的单体单元。然后将废物流送入第一分离阶段，在该分离阶段将其分离为（i）气态的水流，可溶性气体和挥发性污染物，和（ii）包含高沸点溶剂，半挥发性物质和非挥发性物质的悬浮液挥发性污染物和材料。然后将脱水，低蒸气压，高沸点溶剂的悬浮液蒸馏或蒸发，以将高沸点溶剂与非挥发性物质分离。在该第二分离阶段，将含溶剂的悬浮液分离成（i）含溶剂的级分，和（ii）污泥馏分。污泥级分在高沸点溶剂中含有非挥发性物质。

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