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1. 发明授权

US4971715A Phenolic-free stripping composition and use thereof 失效
标题翻译：无酚剥离组合物及其用途
公开(公告)号：US4971715A
公开(公告)日：1990-11-20
申请号：US272847
申请日：1988-11-18
申请人： Richard G. Armant , Edward L. Arrington , Anilkumar C. Bhatt , Donald M. Egleton , Frederick M. Ortloff , Joseph J. Sniezek , John A. Welsh
发明人： Richard G. Armant , Edward L. Arrington , Anilkumar C. Bhatt , Donald M. Egleton , Frederick M. Ortloff , Joseph J. Sniezek , John A. Welsh
IPC分类号： G03F7/42 , H01L21/027 , H01L21/30
CPC分类号： G03F7/426
摘要： A stripping composition containing O-dichlorobenzene, dodecylbenzene sulfonic acid, perchloroethylene, and optionally an aromatic hydrocarbon containing at least 8 carbon atoms, and use thereof for removing photoresist.

2. 发明授权

US06453549B1 Method of filling plated through holes 有权
标题翻译：填充电镀孔的方法
公开(公告)号：US06453549B1
公开(公告)日：2002-09-24
申请号：US09460278
申请日：1999-12-13
申请人： Anilkumar C. Bhatt , David E. Houser , John A. Welsh
发明人： Anilkumar C. Bhatt , David E. Houser , John A. Welsh
IPC分类号： H05K330
CPC分类号： H05K3/4046 , H05K3/427 , H05K2201/0347 , H05K2201/10416 , Y10T29/49139 , Y10T29/49144 , Y10T29/49155
摘要： A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a plated through hole in an electronic package, the hole or via is filled with metal, and the surface of the electronic package is sealed.
摘要翻译：用于导电地填充电子封装中的孔或通孔的方法，以提供具有较低热膨胀系数的结构。在电子封装中制造通孔或电镀通孔之后，孔或通孔被金属填充，电子封装的表面被密封。

3. 发明授权

US4918574A Multilayer circuit board with reduced susceptability to shorts caused by trapped impurities 失效
标题翻译：多层电路板由于被杂质杂质引起的短路易损性降低
公开(公告)号：US4918574A
公开(公告)日：1990-04-17
申请号：US183491
申请日：1988-04-15
申请人： Joseph G. Hoffarth , Donald J. Lazzarini , John A. Welsh , John P. Wiley
发明人： Joseph G. Hoffarth , Donald J. Lazzarini , John A. Welsh , John P. Wiley
IPC分类号： H05K1/00 , H05K3/46
CPC分类号： H05K3/4626 , H05K3/4676 , H05K2201/0154 , H05K2201/0195 , H05K2203/066
摘要： A multilayer circuit board having a conformal layer of an insulating material separating a circuit core from an adjacent insulating layer is disclosed. The conformal layer encapsulates the substrate and conductive pattern of circuit lines in the circuit core, thereby reducing failures caused by impurities trapped during lamination. The multilayer circuit board is manufactured by coating at least one circuit core with the conformal layer of insulating material before final lamination of the circuit cores into a multilayer circuit board.
摘要翻译：公开了一种具有将电路芯与相邻绝缘层分离的绝缘材料的共形层的多层电路板。保形层将电路线的衬底和导电图案封装在电路芯中，从而减少在层压期间被杂质捕获的故障。多层电路板通过在将电路芯最终层压成多层电路板之前，用绝缘材料的保形层涂覆至少一个电路芯。

4. 发明授权

US4810326A Interlaminate adhesion between polymeric materials and electrolytic copper surfaces 失效
标题翻译：聚合材料与电解铜表面之间的层间粘合
公开(公告)号：US4810326A
公开(公告)日：1989-03-07
申请号：US91549
申请日：1987-08-31
申请人： Suryadevara V. Babu , Vu Q. Bui , Joseph G. Hoffarth , John A. Welsh
发明人： Suryadevara V. Babu , Vu Q. Bui , Joseph G. Hoffarth , John A. Welsh
IPC分类号： B29C65/48 , B32B15/08 , C08J5/12 , C09J5/02 , C23C8/36 , H05K3/38 , H05K3/46 , B32B31/28 , C25D1/00
CPC分类号： H05K3/382 , H05K2203/095 , H05K3/4611
摘要： A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a fluorohydrocarbon.

5. 发明授权

US4431685A Decreasing plated metal defects 失效
标题翻译：减少电镀金属缺陷
公开(公告)号：US4431685A
公开(公告)日：1984-02-14
申请号：US394588
申请日：1982-07-02
申请人： Michael J. Canestaro , Donald G. McBride , John A. Welsh
发明人： Michael J. Canestaro , Donald G. McBride , John A. Welsh
IPC分类号： C23C18/18 , C23C18/16 , C23C18/38 , C23C18/42 , C25D5/02 , G03F7/11 , H01L21/70 , H05K3/10 , H05K3/24 , H05K3/38 , G03C5/00
CPC分类号： H05K3/244 , C23C18/1605 , C23C18/1651 , C23C18/54 , G03F7/11 , H01L21/707 , H05K3/384 , H05K2201/0347 , H05K2203/072 , H05K3/108 , H05K3/382
摘要： A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.
摘要翻译：一种通过在光致抗蚀剂和金属表面之间施加一层贵金属如钯，铂，金，铱，铑或其混合物来减少电镀金属缺陷的方法。

6. 发明授权

US06986198B2 Method of forming printed circuit card 失效
标题翻译：形成印刷电路卡的方法
公开(公告)号：US06986198B2
公开(公告)日：2006-01-17
申请号：US10744142
申请日：2003-12-22
申请人： Kenneth Fallon , Miguel A. Jimarez , Ross W. Keesler , John M. Lauffer , Roy H. Magnuson , Voya R. Markovich , Irv Memis , Jim P. Paoletti , Marybeth Perrino , John A. Welsh , William E. Wilson
发明人： Kenneth Fallon , Miguel A. Jimarez , Ross W. Keesler , John M. Lauffer , Roy H. Magnuson , Voya R. Markovich , Irv Memis , Jim P. Paoletti , Marybeth Perrino , John A. Welsh , William E. Wilson
IPC分类号： H05K3/36
CPC分类号： H05K3/445 , H01L23/49827 , H01L23/49833 , H01L23/50 , H01L2924/0002 , H05K1/056 , H05K1/113 , H05K3/0023 , H05K3/0052 , H05K3/0094 , H05K3/06 , H05K3/108 , H05K3/426 , H05K3/429 , H05K3/44 , H05K3/4623 , H05K3/4641 , H05K2201/0919 , H05K2201/09536 , H05K2201/09554 , H05K2201/096 , H05K2201/10734 , H05K2203/0323 , H05K2203/0574 , H05K2203/0733 , H05K2203/1394 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00
摘要： A method of forming a printed circuit card with a metal power plane layer between two photoimageable dielectric layers is provided. Photoformed metal filled vias plated through holes are in the photopatternable material, and signal circuitry is on the surfaces of each of the dielectric materials connected to the vias and plated through holes. A border may be around the card including a metal layer termination in from the edge of one of the dielectric layers. Copper foil with clearance holes is provided. First and second layers of photoimageable curable dielectric material are on opposite sides of the copper. Patterns are developed on the first and second layers of the photoimageable material to reveal the metal layer through vias. Through holes are developed where holes were patterned in both dielectric layers. The surfaces of the photoimageable material, vias and through holes are metallized by copper plating, preferably using photoresist.
摘要翻译：提供了一种在两个可光成像的电介质层之间形成具有金属功率平面层的印刷电路卡的方法。通过孔穿过的光刻金属填充通孔位于光图案化材料中，信号电路位于连接到通孔和电镀通孔的每个介电材料的表面上。边框可以在卡周围，包括从电介质层之一的边缘终止的金属层。提供带有间隙孔的铜箔。第一层和第二层可光成像的可固化电介质材料位于铜的相对两侧。在可光成像材料的第一层和第二层上形成图案以通过通孔显露金属层。开发了通孔，在两个电介质层中对其进行图案化。可光成像材料，通孔和通孔的表面通过镀铜进行金属化，优选使用光致抗蚀剂。

7. 发明授权

US06432182B1 Treatment solution for reducing adhesive resin bleed 有权
标题翻译：用于减少粘合剂树脂流失的处理溶液
公开(公告)号：US06432182B1
公开(公告)日：2002-08-13
申请号：US09588459
申请日：2000-06-06
申请人： John Joseph Konrad , Konstantinos I. Papathomas , John A. Welsh
发明人： John Joseph Konrad , Konstantinos I. Papathomas , John A. Welsh
IPC分类号： C09D538
CPC分类号： H05K3/282 , H01L23/49894 , H01L2924/0002 , H01L2924/12044 , H05K3/28 , H05K3/305 , Y10S428/901 , Y10T428/12889 , Y10T428/265 , H01L2924/00
摘要： In accordance with the present invention, a method of treating the surface of an organic substrate, particularly a circuitized surface of an organic substrate, which method reduces the spread of adhesive resin that is subsequently deposited on the surface, is provided. This method comprises the steps of applying a treatment solution comprising a fatty acid compound, an alkalizing agent, and a solvent comprising water and from about 5% to about 90% by volume of an organic solvent selected from the group consisting of an alcohol, a glycol ether, and combinations thereof to the surface; and then removing substantially all of the solvent from the solution to provide a thin film on the surface of said substrate. The film comprises the fatty acids that were present in the treatment solution. In a preferred embodiment the treatment solution further comprises a chelating agent. The present invention also relates to a treatment solution for reducing adhesive resin bleed on the surface of a circuitized organic substrate. The present invention also relates to a circuitized organic substrate that is resistant to resin bleed. Such substrate has a film comprising a fatty acid compound disposed on the circuitized surface thereto.
摘要翻译：根据本发明，提供了一种处理有机基板的表面，特别是有机基板的电路化表面的方法，该方法减少随后沉积在表面上的粘合剂树脂的扩散。该方法包括以下步骤：施加包含脂肪酸化合物，碱化剂和包含水的溶剂和约5体积％至约90体积％的选自以下的有机溶剂的处理溶液：醇，乙二醇醚及其组合; 然后从溶液中基本上除去所有溶剂，以在所述基材的表面上提供薄膜。该膜包含存在于处理溶液中的脂肪酸。在优选的实施方案中，处理溶液还包含螯合剂。本发明还涉及一种用于在电路化的有机基底的表面上减少粘合剂树脂渗出的处理溶液。本发明还涉及耐树脂流出的电路化有机基材。这种基材具有包含设置在其电路化表面上的脂肪酸化合物的膜。

8. 发明授权

US06488198B1 Wire bonding method and apparatus 有权
标题翻译：引线接合方法和装置
公开(公告)号：US06488198B1
公开(公告)日：2002-12-03
申请号：US09347580
申请日：1999-07-01
申请人： Douglas E. Chrzanowski , John A. Welsh , James W. Wilson , Jeffrey A. Zimmerman
发明人： Douglas E. Chrzanowski , John A. Welsh , James W. Wilson , Jeffrey A. Zimmerman
IPC分类号： B23K3102
CPC分类号： H01L24/85 , H01L23/13 , H01L23/145 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4847 , H01L2224/78313 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/14 , H01L2924/20752 , H01L2924/20753 , Y10T428/193 , Y10T442/2164 , Y10T442/2197 , Y10T442/60 , H01L2924/00 , H01L2924/20751 , H01L2924/00015
摘要： A process and apparatus are described for wire bonding circuit pads of large scale integrated design. The bonding process employs a capillary tool that applies heat and pressure to the wires in order to bond them to the circuit pad. The circuit pad is supported upon a closed woven, fiberglass mesh, which supports the circuit pad during the bonding process.
摘要翻译：描述了用于大规模集成设计的引线接合电路板的工艺和设备。接合工艺采用毛细管工具，其将热和压力施加到导线上，以便将它们结合到电路板。电路板支撑在封闭的编织玻璃纤维网上，该网状物在接合过程中支撑电路板。

9. 发明授权

US6009620A Method of making a printed circuit board having filled holes 失效
标题翻译：制造具有填充孔的印刷电路板的方法
公开(公告)号：US6009620A
公开(公告)日：2000-01-04
申请号：US115715
申请日：1998-07-15
申请人： Ashwinkumar C. Bhatt , Joseph A. Kotylo , Kenneth S. Lyjak , Amarjit S. Rai , John A. Welsh
发明人： Ashwinkumar C. Bhatt , Joseph A. Kotylo , Kenneth S. Lyjak , Amarjit S. Rai , John A. Welsh
IPC分类号： H05K1/11 , H05K3/00 , H05K3/42
CPC分类号： H05K3/0094 , H01L2224/16225 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/19041 , H05K1/112 , H05K2201/0959 , H05K2203/0278 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a circuitized substrate wherein fill material is forced into the substrate's holes to thus provide additional support for conductive circuitry or the like thereon, thus increasing the final product's circuit density. The fill is provided in a substantially uncured state, following which partial cure occurs. Thereafter, the fill is substantially fully cured and the aforementioned circuit elements may then be provided directly thereon. Alternatively, a dual fill process is used with both quantities of uncured fill being disposed in each hole and then cured by a singular UV exposure step.
摘要翻译：一种制造电路化基板的方法，其中填充材料被迫进入基板的孔中，从而为其上的导电电路等提供额外的支撑，从而增加最终产品的电路密度。填充物以基本上未固化的状态提供，随后发生部分固化。此后，填充物基本上完全固化，然后可以直接在其上提供上述电路元件。或者，使用双填充方法，将两种量的未固化填料置于每个孔中，然后通过单一的UV曝光步骤固化。

10. 发明授权

US4618477A Uniform plasma for drill smear removal reactor 失效
标题翻译：用于钻屑去除反应器的均匀等离子体
公开(公告)号：US4618477A
公开(公告)日：1986-10-21
申请号：US692145
申请日：1985-01-17
申请人： Suryadevara V. Babu , Ronald S. Horwath , Neng-hsing Lu , John A. Welsh
发明人： Suryadevara V. Babu , Ronald S. Horwath , Neng-hsing Lu , John A. Welsh
IPC分类号： C23F4/00 , H01J37/32 , H01L21/302 , H01L21/3065 , H05H1/46 , H05K3/00 , B01J19/08 , B01J19/12 , C23F1/02
CPC分类号： H05H1/46 , H01J37/32082 , H01J37/32165 , H05K3/0055 , H05K2203/095
摘要： A system for generating a substantially uniform plasma for processing a substrate having two major surfaces. Each of the substrate major surfaces may have electrically conductive portions. Two electrodes are oppositely disposed with respect to one another on either side of the substrate. A first r.f. power source is electrically connected to the first electrode and a second r.f. power source is electrically connected to the second electrode. The first and second r.f. power sources are out of phase with respect to one another, resulting in the generation of a substantially uniform plasma field.
摘要翻译：一种用于产生用于处理具有两个主表面的基板的基本上均匀的等离子体的系统。每个基底主表面可以具有导电部分。两个电极在衬底的任一侧相对于彼此相对设置。第一个r.f. 电源电连接到第一电极和第二电极。电源电连接到第二电极。第一和第二r.f. 电源相对彼此异相，导致产生基本均匀的等离子体场。

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