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1. 发明授权

US6165424A Water vapor trap and liquid separator for singlet-delta oxygen generator 失效
标题翻译：用于单线态三氧化氮发生器的水汽阱和液分离器
公开(公告)号：US6165424A
公开(公告)日：2000-12-26
申请号：US890717
申请日：1997-07-09
申请人： Charles W. Clendening, Jr. , Jeffrey S. Hartlove , Robert J. Day
发明人： Charles W. Clendening, Jr. , Jeffrey S. Hartlove , Robert J. Day
IPC分类号： B01D53/26 , B01J10/00 , B01J19/00 , C01B13/02 , H01S3/095 , H01S3/22 , F28D7/00 , B03B7/00 , C01B13/00
CPC分类号： B01J19/006 , B01D53/263 , B01J10/002 , B01J2219/00768 , C01B13/02 , C01B13/0248 , H01S3/095 , H01S3/2215
摘要： A singlet-delta oxygen generator 10 comprises a chamber 14 in which a gas stream 22 of singlet-delta oxygen, O.sub.2 (.sup.1 .DELTA.), is generated; a water vapor trap 40 to remove water vapor from the gas stream, and a liquid separator 60 downstream of the water vapor trap to separate liquid from the gas stream subsequent to removal of the water vapor. The water vapor trap comprises a liquid droplet dispersing device 42 which forms a droplet field 44 of cold liquid droplets in the chamber. The cold liquid droplets interact with and condense water vapor in the gas stream. The cold liquid is preferably hydrogen peroxide. The liquid separator comprises a baffle 62 arrangement which forms a tortuous flow path for the gas stream. Liquid in the gas stream is unable to traverse the baffles and is separated from the liquid, to produce an essentially dry gas stream for introduction into a gain generator 34 downstream of the singlet-delta oxygen generator.
摘要翻译：单重态三氧化碳发生器10包括室14，其中产生单重态三氧化碳气体（O2）（1TATA）的气流22; 用于从气流中除去水蒸汽的水蒸汽捕集器40以及在水蒸汽捕集器下游的液体分离器60，以在除去水蒸汽之后将液体与气流分离。水蒸汽捕集器包括液滴分散装置42，其在室中形成冷液滴的液滴场44。冷液滴与气流中的水蒸汽相互作用并冷凝。冷液优选为过氧化氢。液体分离器包括形成用于气流的曲折流动路径的挡板62布置。气流中的液体不能穿过挡板并与液体分离，以产生基本上干燥的气流，用于引入单重态三氧化碳生成器下游的增益发生器34。

2. 发明授权

US5974072A High energy airborne coil laser 失效
标题翻译：高能机载线圈激光器
公开(公告)号：US5974072A
公开(公告)日：1999-10-26
申请号：US9617
申请日：1998-01-20
申请人： Jeffrey S. Hartlove , Charles W. Clendening, Jr. , Robert J. Day , Gary C. Koop
发明人： Jeffrey S. Hartlove , Charles W. Clendening, Jr. , Robert J. Day , Gary C. Koop
IPC分类号： F41H11/02 , F41H13/00 , H01S3/095 , H01S3/23 , F41B15/00
CPC分类号： F41H13/0062 , F41H11/02 , H01S3/095 , H01S3/2383
摘要： A high energy chemical laser capable of being operated in an aircraft to interdict and destroy theater ballistic missiles is provided. A key to the chemical laser of the invention is the use of individual chemical lasers whose individual photon energy outputs can be combined into a single high-energy laser beam.
摘要翻译：提供能够在飞机上操作以拦截和销毁剧院弹道导弹的高能化学激光器。本发明的化学激光器的关键是使用各自的化学激光器，其单独的光子能量输出可以组合成单个高能激光束。

3. 发明授权

US06212769B1 Process for manufacturing a printed wiring board 失效
标题翻译：制造印刷电路板的工艺
公开(公告)号：US06212769B1
公开(公告)日：2001-04-10
申请号：US09343077
申请日：1999-06-29
申请人： Christina M. Boyko , Robert J. Day , Kristen A. Stauffer
发明人： Christina M. Boyko , Robert J. Day , Kristen A. Stauffer
IPC分类号： H05K330
CPC分类号： H05K3/426 , H05K3/108 , H05K3/181 , H05K3/381 , H05K2203/1152 , H05K2203/122 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. A roughened copper foil is laminated to a dielectric substrate. The foil is subsequently removed from the dielectric to create a roughened, irregular surface on the dielectric substrate. Vertical angle through holes and blind holes are formed in the substrate. A uniform copper commoning layer is electrolessly plated to the roughened dielectric substrate and through holes. A photoresist is applied on the surface of the electroless plated layer and irradiated through a mask having printed circuit features. After developing the photoresist the uncovered electroless layer is electrolytically plated to create the final features and circuitry. After stripping the remaining photoresist the unplated electroless copper layer is etched to electronically isolate the copper features and circuitry lines.
摘要翻译：本发明教导了使用半添加法制造高密度印刷线路板的简化方法。将粗糙化的铜箔层叠到电介质基板上。随后从电介质中去除箔以在电介质基底上产生粗糙的不规则表面。在基板上形成垂直角通孔和盲孔。将均匀的铜共同层无电镀在粗糙化的电介质基片和通孔上。将光致抗蚀剂施加在化学镀层的表面上并通过具有印刷电路特征的掩模照射。在显影光致抗蚀剂之后，未覆盖的化学镀层被电解以产生最终特征和电路。在剥离剩余的光致抗蚀剂之后，蚀刻未镀覆的无电解铜层以电绝缘铜特征和电路线。

4. 发明授权

US06775907B1 Process for manufacturing a printed wiring board 失效
标题翻译：制造印刷电路板的工艺
公开(公告)号：US06775907B1
公开(公告)日：2004-08-17
申请号：US09661738
申请日：2000-09-14
申请人： Christina M. Boyko , Robert J. Day , Kristen A. Stauffer
发明人： Christina M. Boyko , Robert J. Day , Kristen A. Stauffer
IPC分类号： H01K310
CPC分类号： H05K3/426 , H05K3/108 , H05K3/181 , H05K3/381 , H05K2203/1152 , H05K2203/122 , Y10T29/49155 , Y10T29/49165 , Y10T29/49167
摘要： The present invention teaches a simplified process for fabricating high density printed wiring boards using a semi-additive process. Steps required to achieve this objective include adhering an electroless plated copper commoning layer to a surface roughened dielectric substrate. Subsequently, the commoning layer is photolithographically personalized by covering the commoning layer with a resist and then uncovering predetermined areas of the aforementioned commoning layer. Consequently, the semi-additive method involves electroplating copper onto the uncovered areas of the commoning layer, thereby generating copper features and circuitry. Finally, the semi-additive process requires the stripping of the remaining photoresist, and the unplated electroless copper layer is etched in order to electronically isolate the copper features and circuitry lines.
摘要翻译：本发明教导了使用半添加法制造高密度印刷线路板的简化方法。实现这一目标所需的步骤包括将化学镀铜共同层粘附到表面粗糙化的电介质基底上。随后，通过用抗蚀剂覆盖共用层，然后露出上述公共层的预定区域，通过光刻来个性化普通层。因此，半添加方法涉及将铜电镀到公共层的未覆盖区域上，由此产生铜特征和电路。最后，半添加工艺需要剥离剩余的光致抗蚀剂，并且蚀刻未镀覆的无电镀铜层以便电绝缘铜特征和电路线。

5. 发明授权

US5311660A Methyl chloroform-free desmear process in additive circuitization 失效
标题翻译：甲基无氯化除垢工艺的加成电路
公开(公告)号：US5311660A
公开(公告)日：1994-05-17
申请号：US15742
申请日：1993-02-10
申请人： Warren A. Alpaugh , Anilkumar C. Bhatt , Michael J. Canestaro , Robert J. Day , Edmond O. Fey , John E. Larrabee
发明人： Warren A. Alpaugh , Anilkumar C. Bhatt , Michael J. Canestaro , Robert J. Day , Edmond O. Fey , John E. Larrabee
IPC分类号： H05K3/26 , H05K3/00 , H05K3/42 , H01K3/10
CPC分类号： H05K3/0055 , H05K2203/0783 , H05K2203/0789 , H05K2203/0796 , H05K2203/081 , H05K2203/088 , Y10T29/49165
摘要： Disclosed is a method of drilling, desmearing, and additively circuitizing a printed circuit board. The printed circuit board is drilled under conditions which produce glass and polymer smeared vias and through holes. The particulate debris is removed by vapor blasting the drilled printed circuit board. Next the printed circuit board is soaked in a solvent to swell the drill smear on the circuit interplanes of the printed circuit board. This solvent is then removed by entrainment in a gas, and a stream of an aqueous, acidic, oxidizing solution is passed through the printed circuit board holes to remove swollen smear in the thru holes and produce an etchback of conductors. After a water rinse an aqueous reducing solution is passed through the printed circuit board to reduce and remove aqueous acidic oxidizing solution, e.g., residual aqueous acid oxidizing solution. The printed circuit board is rinsed to remove the aqueous reducing solution. The surface of the printed circuit board is then seeded, the intended circuitization is photolithographically defined on the printed circuit board, and the circuitization, including the surface circuitization and the plated through hole circuitization, is additively plated.
摘要翻译：公开了一种对印刷电路板进行钻孔，去除和附加电路化的方法。印刷电路板在产生玻璃和聚合物涂抹通孔和通孔的条件下钻孔。通过对钻孔的印刷电路板进行蒸气喷射除去颗粒物。接下来，将印刷电路板浸泡在溶剂中以使印刷电路板的电路插板上的钻头污迹膨胀。然后通过夹带在气体中除去该溶剂，并且将水性，酸性氧化溶液流通过印刷电路板孔，以除去通孔中的溶胀污迹并产生导体回蚀。在水冲洗之后，将水性还原溶液通过印刷电路板以减少并除去酸性氧化性水溶液，例如残留的酸性水溶液。漂洗印刷电路板以除去还原水溶液。然后将印刷电路板的表面接种，将预期的电路光刻地定义在印刷电路板上，并且包括表面电路化和电镀通孔电路的电路被附加电镀。

6. 发明授权

US4020246A Low temperature primary electrolyte cell 失效
标题翻译：低温一次电解质电池
公开(公告)号：US4020246A
公开(公告)日：1977-04-26
申请号：US651013
申请日：1976-01-21
申请人： Eddie T. Seo , Herbert P. Silverman , Robert J. Day
发明人： Eddie T. Seo , Herbert P. Silverman , Robert J. Day
IPC分类号： H01M6/14 , H01M10/39 , H01M12/06
CPC分类号： H01M10/39 , H01M12/06 , H01M6/14
摘要： A cell is fabricated using a solid alkali metal anode and a fluid cathode which are separated by a modified aluminate solid barrier which permits the flow of only the alkali metal ions. The fluid cathode can contain a solid, gaseous, or liquid oxidizer in a liquid electrolyte. Operating temperatures for these cells range from less than -40.degree. C to approximately 95.degree. C. At ambient temperatures, energy densities of the cells range from approximately 0.7 to 1.8 watt-hour per cubic centimeter. These cells are electrically rechargeable by raising their temperature above the melting point of sodium.
摘要翻译：使用固体碱金属阳极和流体阴极制造电池，该碱性金属阳极和流体阴极由改进的铝酸盐固体阻挡层隔开，其允许仅流过碱金属离子。液体阴极可以在液体电解质中含有固体，气态或液体氧化剂。这些电池的工作温度范围从小于-40℃至约95℃。在环境温度下，电池的能量密度范围为每立方厘米约0.7至1.8瓦特。这些电池通过将它们的温度升高到高于钠的熔点而被电可再充电。

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