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    • 6. 发明申请
    • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • WO2011132590A1
    • 2011-10-27
    • PCT/JP2011/059224
    • 2011-04-07
    • SEMICONDUCTOR ENERGY LABORATORY CO., LTD.YAMAZAKI, Shunpei
    • YAMAZAKI, Shunpei
    • H01L29/786H01L21/336
    • H01L29/263H01L21/383H01L21/477H01L27/1225H01L29/4908H01L29/66969H01L29/78H01L29/78603H01L29/7869
    • One object of one embodiment of the present invention is to provide a highly reliable semiconductor device including an oxide semiconductor, which has stable electrical characteristics. In a method for manufacturing a semiconductor device, a first insulating film is formed; source and drain electrodes and an oxide semiconductor film electrically connected to the source and drain electrodes are formed over the first insulating film; heat treatment is performed on the oxide semiconductor film so that a hydrogen atom in the oxide semiconductor film is removed; oxygen doping treatment is performed on the oxide semiconductor film, so that an oxygen atom is supplied into the oxide semiconductor film; a second insulating film is formed over the oxide semiconductor film; and a gate electrode is formed over the second insulating film so as to overlap with the oxide semiconductor film.
    • 本发明的一个实施例的一个目的是提供一种具有稳定电特性的包括氧化物半导体的高度可靠的半导体器件。 在制造半导体器件的方法中,形成第一绝缘膜; 在所述第一绝缘膜上形成源极和漏极以及电连接到所述源极和漏极的氧化物半导体膜; 对氧化物半导体膜进行热处理,去除氧化物半导体膜中的氢原子; 对氧化物半导体膜进行氧掺杂处理,从而将氧原子供给到氧化物半导体膜中; 在氧化物半导体膜上形成第二绝缘膜; 并且在第二绝缘膜上形成栅电极以与氧化物半导体膜重叠。