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    • 2. 发明申请
    • A CHUCK FOR A HIGH PRECISION MACHINE TOOL
    • 一个高精度机床工具
    • WO2017036523A1
    • 2017-03-09
    • PCT/EP2015/070034
    • 2015-09-02
    • WIELANDTS UPMTWSL
    • WIELANDTS, Marc
    • B23B31/36B23B31/28B23B31/30
    • B23B31/36B23B31/28B23B31/307B23B2250/04B24B19/02B24B41/061B24B41/068
    • A chuck for a machine tool having a rotation spindle (14) with a main axis of rotation (19). The chuck comprises a base plate (1), a first rotatable plate (2) eccentrically mounted on the base plate (1), a second rotatable plate (3) eccentrically mounted on the first rotatable plate (2), balancing means (6, 11) for aligning a principal axis of inertia of the chuck with the main axis of rotation (19) and a holding mechanism (17,18). The chuck is provided with an actuating mechanism for angularly displacing the first rotatable plate (2) around a first rotation axis (20) over a first angle of rotation and/or the second rotatable plate (3) around a second rotation axis (21) over a second angle of rotation such that the position of the object (13) with respect to the main axis of rotation (19) can be altered.
    • 一种用于具有主轴(19)的旋转主轴(14)的机床的卡盘。 卡盘包括基板(1),偏心地安装在基板(1)上的第一可旋转板(2),偏心地安装在第一可旋转板(2)上的第二可旋转板(3) 11),用于使卡盘的主轴线与主轴线(19)对准,以及保持机构(17,18)。 卡盘设置有用于使第一旋转板(2)绕第一旋转轴线(20)绕第一旋转角度和/或第二可旋转板(3)围绕第二旋转轴线(21)成角度地移位的致动机构, 超过第二旋转角度,使得物体(13)相对于主旋转轴线(19)的位置可以改变。
    • 7. 发明申请
    • VACUUM CHUCK
    • 真空罐
    • WO2013143081A1
    • 2013-10-03
    • PCT/CN2012/073175
    • 2012-03-28
    • ACM RESEARCH (SHANGHAI) INC.WANG, JianJIN, YinuoSHAO, YongWANG, Hui
    • WANG, JianJIN, YinuoSHAO, YongWANG, Hui
    • H01L21/683B25B11/00H01L21/67B25J15/06
    • H01L21/6838B23B31/307B25B11/005H01L2221/683Y10T279/11
    • V ACUUM CHUCK ABSTRACT OF THE DISCLOSURE A vacuum chuck is disclosed for holding and positioning wafers more stably and securely. The vacuum chuck includes a supporting assembly having a receiving groove and at least one first vacuum aperture defined in the receiving groove. A seal unit includes a seal ring bulging to form a vacuum trough. The seal ring is fixed in the receiving groove of the supporting assembly and has at least one second vacuum aperture communicating with the first vacuum aperture. A chuck connector fastened with the supporting assembly has at least one vacuum port and at least one vacuum orifice communicating with the vacuum port. At least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal ring and the supporting assembly.
    • V ACUUM CHUCK摘要公开了一种更稳定和可靠地保持和定位晶片的真空卡盘。 真空吸盘包括支撑组件,其具有容纳凹槽和限定在容纳凹槽中的至少一个第一真空孔。 密封单元包括凸起形成真空槽的密封环。 密封环固定在支撑组件的接收槽中,并且具有与第一真空孔连通的至少一个第二真空孔。 紧固有支撑组件的卡盘连接器具有至少一个真空口和至少一个与真空口连通的真空孔。 至少一个真空软管将第一真空孔,第二真空孔与真空孔连接,并且夹持连接器的真空端口用于抽空真空槽的空气,以将晶片保持并定位在密封环和支撑组件上。
    • 9. 发明申请
    • PROTECTION OF WORK PIECE DURING SURFACE PROCESSING
    • 在表面处理过程中保护工件
    • WO2003086701A1
    • 2003-10-23
    • PCT/US2003/010811
    • 2003-04-09
    • STRASBAUGH, INC.
    • KASSIR, Salman, MoudrekSPIEGEL, Larry, A.
    • B24B1/00
    • B24B37/30B23B31/307B23B2226/18H01L21/6838
    • The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material (22) to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck (14) that allows the passage of a vacuum signal, a frame (24) holding the protective material, a frame holder (26) to hold the frame, and a fastening arrangement to fasten the frame holder to the chuck adjacent a support surface. The method can include providing a vacuum chuck, placing a protective material in contact with the chuck, placing a wafer in contact with the protective material, applying a vacuum signal securing the wafer with the chuck, and grinding the backside surface of the wafer.
    • 本发明提供了一种用于在表面处理期间保护工件的装置和方法。 该装置采用保护材料(22)以在背面研磨期间保护晶片。 该装置还可以包括允许真空信号通过的真空吸盘(14),保持保护材料的框架(24),用于保持框架的框架保持件(26)和紧固装置,以紧固框架架 靠近支撑表面的卡盘。 该方法可以包括提供真空卡盘,将保护材料放置在与卡盘接触的位置,使晶片与保护材料接触,施加用夹头固定晶片的真空信号,并研磨晶片的背面。