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1. 发明申请

WO2004060609A1 MODULAR METHOD FOR CHEMICAL MECHANICAL PLANARIZATION 审中-公开
标题翻译：化学机械平面化的模块化方法
公开(公告)号：WO2004060609A1
公开(公告)日：2004-07-22
申请号：PCT/US2003/039217
申请日：2003-12-09
申请人： STRASBAUGH, INC.
发明人： HALLEY, David, G.
IPC分类号： B24B5/00
CPC分类号： H01L21/67167 , B24B9/065 , B24B37/013 , B24B37/04 , B24B37/042 , B24B37/30 , B24B37/345 , B24B49/02 , B24B49/12 , B24B53/017 , B24B57/02 , H01L21/67173 , H01L21/67219
摘要： Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process one or more substrates therein. The plurality of modules are controllable separately by individual controllers associated separately with the modules. One of the modules is disengaged from the docking station, and is mechanically removed to free the module from the docking station, while the other modules are still operable to process the one or more substrates therein.
摘要翻译：本发明的具体实施方案涉及操作模块化化学机械平面化方法的方法。该方法包括操作CMP设备，其包括具有至少一个CMP模块的对接站和至少一个清洁模块，以在其中处理一个或多个基板。多个模块可以由与模块分开关联的各个控制器单独控制。其中一个模块从对接站脱离，并被机械地移除以将模块从对接站中释放出来，而其它模块仍可操作以处理其中的一个或多个基板。

2. 发明申请

WO2004091856A3 GRINDING APPARATUS AND METHOD 审中-公开
标题翻译：研磨设备和方法
公开(公告)号：WO2004091856A3
公开(公告)日：2005-03-03
申请号：PCT/US2004009676
申请日：2004-03-30
申请人： STRASBAUGH INC , WALSH THOMAS A , KASSIR SALMAN MAURINA
发明人： WALSH THOMAS A , KASSIR SALMAN MAURINA
IPC分类号： B24B7/22 , B24B49/16 , B24B49/00
CPC分类号： B24B49/16 , B24B7/22
摘要： A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted an the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. 2n other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.
摘要翻译：一种用于成形工件的磨削组件，其包括一个或多个研磨主轴。每个研磨主轴包括由单个主轴驱动器驱动的两个独立的砂轮。研磨主轴水平平移，用单个研磨主轴进行边缘和面磨削。工作主轴中的非接触位置传感器可测量研磨过程中的工作主轴位移，并向研磨主轴提供反馈，以调节由研磨主轴施加工件的力。在变型中，利用相对于主轴旋转轴径向放置的砂轮来执行工件的边缘磨削。在其他变体中，可以在单个研磨组件中进行清洗，抛光和研磨。在另一些变型中，当用于保持研磨轮的生产率的一个或多个力超过最大限度时，使用轮子修整装置来修整车轮。

3. 发明申请

WO2004091856A2 GRINDING APPARATUS AND METHOD 审中-公开
标题翻译：研磨设备和方法
公开(公告)号：WO2004091856A2
公开(公告)日：2004-10-28
申请号：PCT/US2004/009676
申请日：2004-03-30
申请人： STRASBAUGH, INC. , WALSH, Thomas, A. , KASSIR, Salman, Maurina
发明人： WALSH, Thomas, A. , KASSIR, Salman, Maurina
IPC分类号： B24B
CPC分类号： B24B49/16 , B24B7/22
摘要： A grinding assembly for shaping work pieces that includes one or more grind spindles. Each of the grind spindles include two independent grinding wheels driven by a single spindle drive. The grind spindles translate horizontally to perform both edge and face grinding with a single grind spindle. A non-contact position sensor in a work spindle measures work spindle displacement during grinding and provides feedback to the grind spindle to regulate the force imparted an the work piece by the grind spindle. In variations, an abrasive wheel disposed radially with respect to an axis of spindle rotation is utilized to perform edge grinding of the work piece. 2n other variations cleaning, polishing and grinding are carried out in a single grinding assembly. In yet other variations, a wheel dressing apparatus is utilized to dress the wheel when one or more forces to maintain productivity of the grind wheel exceed a threhold.
摘要翻译：一种用于成形工件的磨削组件，其包括一个或多个研磨主轴。每个研磨主轴包括由单个主轴驱动器驱动的两个独立的砂轮。研磨主轴水平平移，用单个研磨主轴进行边缘和面磨削。工作主轴中的非接触位置传感器可测量研磨过程中的工作主轴位移，并向研磨主轴提供反馈，以调节由研磨主轴施加工件的力。在变型中，利用相对于主轴旋转轴径向放置的砂轮来执行工件的边缘磨削。在其他变体中，可以在单个研磨组件中进行清洗，抛光和研磨。在另一些变型中，当用于保持研磨轮的生产率的一个或多个力超过最大限度时，使用轮子修整装置来修整车轮。

4. 发明申请

WO2003086701A1 PROTECTION OF WORK PIECE DURING SURFACE PROCESSING 审中-公开
标题翻译：在表面处理过程中保护工件
公开(公告)号：WO2003086701A1
公开(公告)日：2003-10-23
申请号：PCT/US2003/010811
申请日：2003-04-09
申请人： STRASBAUGH, INC.
发明人： KASSIR, Salman, Moudrek , SPIEGEL, Larry, A.
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B23B31/307 , B23B2226/18 , H01L21/6838
摘要： The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material (22) to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck (14) that allows the passage of a vacuum signal, a frame (24) holding the protective material, a frame holder (26) to hold the frame, and a fastening arrangement to fasten the frame holder to the chuck adjacent a support surface. The method can include providing a vacuum chuck, placing a protective material in contact with the chuck, placing a wafer in contact with the protective material, applying a vacuum signal securing the wafer with the chuck, and grinding the backside surface of the wafer.
摘要翻译：本发明提供了一种用于在表面处理期间保护工件的装置和方法。该装置采用保护材料（22）以在背面研磨期间保护晶片。该装置还可以包括允许真空信号通过的真空吸盘（14），保持保护材料的框架（24），用于保持框架的框架保持件（26）和紧固装置，以紧固框架架靠近支撑表面的卡盘。该方法可以包括提供真空卡盘，将保护材料放置在与卡盘接触的位置，使晶片与保护材料接触，施加用夹头固定晶片的真空信号，并研磨晶片的背面。

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