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1. 发明申请

WO2017151323A1 WAFER HANDLING ASSEMBLY 审中-公开
标题翻译：晶圆处理组件
公开(公告)号：WO2017151323A1
公开(公告)日：2017-09-08
申请号：PCT/US2017/018180
申请日：2017-02-16
申请人： VEECO INSTRUMENTS, INC
发明人： RASHKOVSKY, Yuliy , SNOWDEN, Brett Stuart , SALDANA, Miguel Angel
IPC分类号： H01L21/687 , H01L21/683
CPC分类号： H01L21/68735 , H01L21/6838 , H01L21/68728 , H01L21/68742 , H01L21/68785
摘要： A wafer handling assembly comprising a center hub supporting a vertical non-contact lifting head and at least one radially extending and radially retracting wafer engaging mechanism having a surface to engage a wager at a peripheral edge of the wafer, where the peripheral edge is a corner edge or a side edge. In some implementations, the wafer engaging mechanism has a foot on which the wafer edge is supported. The lifting head may be vertically moveable in respect to the assembly.
摘要翻译：一种晶片搬运组件，包括支撑垂直非接触式升降头的中心轮毂和至少一个径向延伸且径向缩回的晶片接合机构，所述晶片接合机构具有在晶片的外围边缘处与吸嘴接合的表面，其中外围边缘是角部边缘或侧边缘。在一些实施方式中，晶片接合机构具有脚，晶片边缘被支撑在脚上。升降头可以相对于组件垂直移动。

2. 发明申请

WO2012021370A1 ENHANCED WAFER CARRIER 审中-公开
标题翻译：增强的晶片载体
公开(公告)号：WO2012021370A1
公开(公告)日：2012-02-16
申请号：PCT/US2011/046567
申请日：2011-08-04
申请人： VEECO INSTRUMENTS INC. , VOLF, Boris , RASHKOVSKY, Yuliy
发明人： VOLF, Boris , RASHKOVSKY, Yuliy
IPC分类号： H01L21/687
CPC分类号： H01L21/68764 , C23C16/4586 , H01L21/68728 , H01L21/68771
摘要： A wafer carrier (32) used in wafer treatments such as chemical vapor deposition has pockets (40,240) for holding the wafers and support surfaces for supporting the wafers above the floors of the pockets. The carrier is provided with locks (50,250) for restraining wafers against upward movement away from the support surfaces (56, 254). Constraining the wafers against upward movement limits the effect of wafer distortion on the spacing between the wafer and the floor surfaces, and thus limits the effects of wafer distortion on heat transfer. The carrier may include a main portion (38) and minor portions (44) having higher thermal conductivity than the main portion, the minor portions being disposed below the pockets.
摘要翻译：用于诸如化学气相沉积之类的晶片处理中的晶片载体（32）具有用于保持晶片的支架（40,240）和用于将晶片支撑在袋的地板上方的支撑表面。托架设有锁定装置（50,250），用于防止晶片向上移离支撑表面（56,254）。限制晶片向上移动限制了晶片失真对晶片和地板表面之间的间隔的影响，并因此限制了晶片失真对传热的影响。载体可以包括主要部分（38）和具有比主要部分更高热导率的次要部分（44），次要部分设置在袋的下方。

3. 发明申请

WO2019190964A1 WAFER CARRIER HAVING THERMAL COVER FOR CHEMICAL VAPOR DEPOSITION 审中-公开
公开(公告)号：WO2019190964A1
公开(公告)日：2019-10-03
申请号：PCT/US2019/023838
申请日：2019-03-25
申请人： VEECO INSTRUMENTS, INC.
发明人： KRISHNAN, Sandeep , RASHKOVSKY, Yuliy , GURARY, Alexander , CHIN, Leo , DESHPANDE, Mandar
IPC分类号： H01L21/673 , H01L21/687 , H01L21/67
摘要： A wafer carrier as described and claimed herein includes a thermal cover and a plurality of platforms with corresponding radially inner and outer pedestals.

4. 发明申请

WO2012092008A1 WAFER CARRIER WITH SELECTIVE CONTROL OF EMISSIVITY 审中-公开
标题翻译：具有选择性控制的波浪载体
公开(公告)号：WO2012092008A1
公开(公告)日：2012-07-05
申请号：PCT/US2011/066034
申请日：2011-12-20
申请人： VEECO INSTRUMENTS INC. , VOLF, Boris , WEI, Guanghua , RASHKOVSKY, Yuliy
发明人： VOLF, Boris , WEI, Guanghua , RASHKOVSKY, Yuliy
IPC分类号： H01L21/687
CPC分类号： H01L21/68757 , H01L21/68771
摘要： A wafer carrier (28) for use in a chemical vapor deposition apparatus (10) includes at least one region on its outer surface having a substantially different (e.g., lower) emissivity than other regions on the outer surface. The modified emissivity region may be located on the outer edge (46), the top surface (29), and/or the bottom surface (31) of the carrier. The region may be associated with one or more wafer pockets (32) of the wafer carrier. The modified emissivity region may be shaped and sized so as to modify the heat transmission through the region, and thereby increase the temperature uniformity across portions of the top surface (29) of the wafer carrier or across individual wafers (34). The modified emissivity region may be provided by a coating on the outer surface of the wafer carrier.
摘要翻译：用于化学气相沉积装置（10）的晶片载体（28）包括在其外表面上的至少一个区域，其具有与外表面上的其它区域基本不同的（例如，较低的）发射率。修改的发射率区域可以位于载体的外边缘（46），顶表面（29）和/或底表面（31）上。该区域可以与晶片载体的一个或多个晶片槽（32）相关联。修改的辐射率区域可以被成形和定尺寸，以便改变通过该区域的热传递，从而增加跨越晶片载体的顶表面（29）的部分或跨越单个晶片（34）的温度均匀性。修改的发射率区域可以由晶片载体的外表面上的涂层提供。

5. 发明申请

WO2023034226A1 WAFER CARRIER ASSEMBLY WITH PEDESTAL AND COVER RESTRAINT ARRANGEMENTS THAT CONTROL THERMAL GAPS 审中-公开
公开(公告)号：WO2023034226A1
公开(公告)日：2023-03-09
申请号：PCT/US2022/041914
申请日：2022-08-29
申请人： VEECO INSTRUMENTS INC.
发明人： KRISHNAN, Sandeep , MITROVIC, Bojan , ARMOUR, Eric, A. , RASHKOVSKY, Yuliy , MAXWELL, Robert, S. , VAN DOREN, Matthew, J.
IPC分类号： C30B25/12 , H01L21/687
摘要： A wafer carrier assembly as described herein improves thermal control across a top surface thereof to maintain highly controlled deposition locations and thicknesses.

6. 发明申请

WO2017040140A1 MULTIPLE CHAMBER CHEMICAL VAPOR DEPOSITION SYSTEM 审中-公开
标题翻译：多室化学蒸气沉积系统
公开(公告)号：WO2017040140A1
公开(公告)日：2017-03-09
申请号：PCT/US2016/048351
申请日：2016-08-24
申请人： VEECO INSTRUMENTS INC.
发明人： PAPASOULIOTIS, George , SALDANA, Miguel , SNOWDEN, Brett , RASHKOVSKY, Yuliy , PACIER, Michael
IPC分类号： H01L21/205 , H01L21/02 , H01L21/677
CPC分类号： C23C16/52 , C23C14/22 , C23C14/568 , C23C16/45544 , C23C16/50 , C23C16/54 , H01L21/02529 , H01L21/0254 , H01L21/0262 , H01L21/67161 , H01L21/67201 , H01L21/67742 , H01L21/67745 , H01L21/6838 , H01L21/68764 , H01L21/68785
摘要： A chemical vapor deposition system is disclosed herein. The chemical vapor deposition system has a plurality of reaction chambers to operate independently in the growth of epitaxial layers on wafers within each of the reaction chambers for the purpose of reducing processing time while maintaining the quality necessary for the fabrication of high-performance semiconductor devices.
摘要翻译：本文公开了化学气相沉积系统。化学气相沉积系统具有多个反应室，以在每个反应室内的晶片上的外延层的生长中独立地操作，以便在保持制造高性能半导体器件所需的质量的同时缩短处理时间。

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