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1. 发明申请

WO1995024730A2 APPARATUS HAVING INNER LAYERS SUPPORTING SURFACE-MOUNT COMPONENTS 审中-公开
标题翻译：装有内层的装置支持表面装配组件
公开(公告)号：WO1995024730A2
公开(公告)日：1995-09-14
申请号：PCT/US1995002678
申请日：1995-03-09
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , CRANE, Stanford, W., Jr. , PORTUONDO, Maria, M.
IPC分类号： H01L00/00
CPC分类号： H01L23/49861 , H01L23/49811 , H01L2924/0002 , H01L2924/181 , H05K1/112 , H05K3/308 , H05K3/321 , H05K3/3421 , H05K3/4623 , H05K2201/09472 , H05K2201/09536 , H05K2201/09645 , H05K2201/10189 , H05K2201/1031 , H05K2201/10318 , H05K2201/10704 , H05K2201/10772 , H05K2201/10893 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , H01L2924/00 , H01L2924/00012
摘要： An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate. Also, a method of manufacturing an apparatus comprising the steps of forming a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and extending at least one electrically conductive lead or wire from a device into the well such that the lead or wire is in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.
摘要翻译：一种包括多层衬底的装置，所述多层衬底包括多层绝缘材料，至少一个阱形成在至少一层中，所述阱从所述多层衬底的外表面延伸到所述多层衬底的内表面以及在所述多层基板的内表面上的所述阱内形成的导电部件; 以及具有延伸到阱中的至少一个导电引线或导线并与形成在多层基板的内表面上的导电部件直接物理接触的器件。另外，制造装置的方法包括以下步骤：形成包括多层绝缘材料的多层基板，至少一层形成在至少一层中的阱，所述阱从多层的外表面延伸在多层基板的内表面上形成有在多层基板的内表面上的导电部件，并且将至少一个导电引线或线从器件延伸到阱中，使得引线或引线与形成在多层衬底的内表面上的导电部件直接物理接触。

2. 发明申请

WO1996041378A1 SEMICONDUCTOR DIE CARRIER HAVING DOUBLE-SIDED DIE ATTACH PLATE 审中-公开
标题翻译：具有双面DIE附件板的半导体载体
公开(公告)号：WO1996041378A1
公开(公告)日：1996-12-19
申请号：PCT/US1996009325
申请日：1996-06-04
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , MOSLEY, Joseph, M. , PORTUONDO, Maria, M.
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , H01L2224/48091 , H01L2224/49109 , H01L2225/0651 , H01L2225/06582 , H01L2924/01004 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16195 , H01L2924/19041 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor die carrier includes an insulative package; a plurality of conductive leads extending from the insulative package; a die attach plate housed within the insulative package, the die attach plate comprising a first surface located on one side of the die attach plate and a second surface located opposite the first surface on an opposing side of the die attach plate; at least one semiconductor die secured to the first surface of the die attach plate; and at least one semiconductor die secured to the second surface of the die attach plate.
摘要翻译：半导体管芯载体包括绝缘封装; 从所述绝缘封装延伸的多个导电引线; 所述管芯附接板包括位于所述管芯安装板的一侧的第一表面和与所述管芯附接板的相对侧相对的第二表面的第二表面; 至少一个半导体管芯固定到管芯附接板的第一表面; 以及至少一个半导体管芯，其固定到管芯附接板的第二表面。

3. 发明申请

WO1995024733A1 PREFABRICATED SEMICONDUCTOR CHIP CARRIER 审中-公开
标题翻译：预制半导体芯片载体
公开(公告)号：WO1995024733A1
公开(公告)日：1995-09-14
申请号：PCT/US1995002675
申请日：1995-03-09
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , CRANE, Stanford, W., Jr. , PORTUONDO, Maria, M.
IPC分类号： H01L23/498
CPC分类号： H01L24/49 , H01L23/057 , H01L23/49827 , H01L23/49861 , H01L24/48 , H01L2224/45111 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49109 , H01L2224/49174 , H01L2224/49431 , H01L2224/49433 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/181 , H05K1/182 , H05K1/183 , H05K3/3426 , Y10T29/49146 , Y10T29/49147 , Y10T29/49153 , H01L2924/00 , H01L2224/05599 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead frame; a semiconductor die positioned such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and structure for providing electrical connection between the semiconductor die and corresponding ones of the electrically conductive leads. A method of manufacturing a semiconductor die carrier includes the steps of individually manufacturing a plurality of electrically conductive leads without use of a lead frame; extending a plurality of the electrically conductive leads from at least one of a plurality of electrically insulative side walls; positioning a semiconductor die such that the electrically conductive leads are disposed at one or more locations around the periphery of the die; and electrically connecting the semiconductor die to corresponding ones of the electrically conductive leads.
摘要翻译：半导体管芯载体包括多个电绝缘侧壁; 从至少一个侧壁延伸的多个导电引线，每个引线在不使用引线框架的情况下单独制造; 半导体管芯，定位成使得导电引线设置在围绕芯片周边的一个或多个位置; 以及用于在半导体管芯和对应的导电引线之间提供电连接的结构。制造半导体管芯载体的方法包括以下步骤：在不使用引线框的情况下分别制造多个导电引线; 从多个电绝缘侧壁中的至少一个延伸多个导电引线; 定位半导体管芯，使得导电引线设置在围绕芯片周边的一个或多个位置处; 并且将半导体管芯电连接到相应的导电引线。

4. 发明申请

WO1995024729A2 MODULAR ARCHITECTURE FOR HIGH BANDWIDTH COMPUTERS 审中-公开
标题翻译：高带宽计算机的模块化架构
公开(公告)号：WO1995024729A2
公开(公告)日：1995-09-14
申请号：PCT/US1995002676
申请日：1995-03-09
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , CRANE, Stanford, W., Jr. , PORTUONDO, Maria, M. , ERICKSON, Willard , BIZZARRI, Maurice
IPC分类号： H01L00/00
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R12/737 , H05K1/0286 , H05K1/14 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445
摘要： A computeur system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly, a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
摘要翻译：功能兼容的电子元件位于模块化印刷电路板上的计算系统架构。因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。类似地，可以简单地通过更换包含外围控制器的印刷电路板来改变所使用的一种外围总线。高密度连接器连接电路板。本发明的一些实施例使用单个背板。其他实施例将外围插槽放置在第二无源底板上。

5. 发明申请

WO1996041400A1 CONTACT BEAM FOR ELECTRICAL INTERCONNECT COMPONENT 审中-公开
标题翻译：用于电气互连部件的接触梁
公开(公告)号：WO1996041400A1
公开(公告)日：1996-12-19
申请号：PCT/US1996009282
申请日：1996-06-05
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , CRANE, Stanford, W., Jr. , PORTUONDO, Maria, M.
IPC分类号： H01R13/26
CPC分类号： H01R13/11 , H01R12/716 , H01R13/26 , H01R24/60 , H01R2107/00
摘要： An electrically conductive contact beam (6) for use in an electrical interconnect component. The contact beam (6) includes a stabilizing section (62) for securing the contact beam (6) within a support substrate (7) and a contact section (61), connected to the stabilizing section (62), for establishing contact between the contact beam (6) and an electrically conductive contact from another electrical interconnect component. The contact section includes a merge radius section connecting the contact section to the stabilizing section (62), a flexible section (61b) connected to the merge radius section (61a) and having an elongated curvature, a contact area (61c), disposed at an end of the curvature opposite the merge radius section (61a), for contacting the conductive contact from the other electrical interconnect component, and a lead-in section (61d), connected to the contact area (61c), for initiating deflection of the contact section (61) upon contact of the lead-in section (61d) with a portion of the other electrical interconnect component.
摘要翻译：一种用于电互连部件的导电接触梁（6）。接触梁（6）包括用于将接触梁（6）固定在支撑衬底（7）内的稳定部分（62）和连接到稳定部分（62）的接触部分（61），用于在接触梁（6）和来自另一电互连部件的导电触头。接触部分包括将接触部分连接到稳定部分（62）的合并半径部分，连接到合并半径部分（61a）并且具有细长曲率的柔性部分（61b），接触区域（61c）与合并半径部分（61a）相对的曲率的端部，用于接触来自另一个电气互连部件的导电接触件，以及连接到接触区域（61c）的引入部分（61d），用于引起接触部分（61）在导入部分（61d）与另一个电互连部件的一部分接触时。

6. 发明申请

WO1996041377A1 HIGH PERFORMANCE SEMICONDUCTOR DIE CARRIER 审中-公开
标题翻译：高性能半导体载体
公开(公告)号：WO1996041377A1
公开(公告)日：1996-12-19
申请号：PCT/US1996009277
申请日：1996-06-05
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , MOSLEY, Joseph, M. , PORTUONDO, Maria, M.
IPC分类号： H01L23/64
CPC分类号： H01L24/49 , H01L23/49537 , H01L23/49548 , H01L23/49861 , H01L23/50 , H01L23/642 , H01L23/66 , H01L24/45 , H01L24/48 , H01L2224/45111 , H01L2224/48011 , H01L2224/48091 , H01L2224/49109 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H05K3/3421 , H01L2924/2065 , H01L2924/20651 , H01L2924/20652 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the insulative module for facilitating transmission of high frequency signals carried to and from the semiconductor die on the electrically conductive leads.
摘要翻译：半导体管芯载体包括绝缘模块; 从所述绝缘模块延伸的多个导电引线; 与绝缘模块一起容纳的半导体管芯; 以及固定到绝缘模块的至少一个高频电容器，用于便于传输在导电引线上和从半导体管芯上传输的高频信号。

7. 发明申请

WO1996041507A1 LOW PROFILE SEMICONDUCTOR DIE CARRIER 审中-公开
标题翻译：低剖面半导体载体
公开(公告)号：WO1996041507A1
公开(公告)日：1996-12-19
申请号：PCT/US1996009156
申请日：1996-06-04
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , MOSLEY, Joseph, M. , PORTUONDO, Maria, M. , TAYLOR, Drew, L.
IPC分类号： H05K01/18
CPC分类号： H01L24/49 , H01L23/057 , H01L23/49861 , H01L24/48 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/49109 , H01L2224/49174 , H01L2224/49431 , H01L2224/49433 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01039 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/16195 , H01L2924/181 , H05K1/182 , H05K1/183 , H05K3/3426 , H01L2924/00 , H01L2224/45099
摘要： A semiconductor die carrier (102) configured to be secured to a printed circuit board (119) includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one row of electrically conductive leads (103) extends from at least one of the side surfaces of the insulative package. Each of the leads (103) comprises a proximal end, at least one horizontal portion extending in a horizontal direction, at least one vertical portion extending in a vertical direction, and a distal end. The distal ends of the leads are configured to be secured to the printed circuit board (119) such that, when the distal ends of the leads are secured to the printed circuit board (119), at least a portion of the insulative package (102) is located below an upper surface of the printed circuit board.
摘要翻译：被配置为固定到印刷电路板（119）的半导体管芯载体（102）包括用于容纳半导体管芯的绝缘封装。绝缘包装具有顶表面，底表面和联接顶表面和底表面的多个侧表面。至少一排导电引线（103）从绝缘封装的至少一个侧表面延伸。每个引线（103）包括近端，沿水平方向延伸的至少一个水平部分，在垂直方向上延伸的至少一个垂直部分和远端。引线的远端构造成固定到印刷电路板（119），使得当引线的远端固定到印刷电路板（119）时，绝缘封装（102）的至少一部分）位于印刷电路板的上表面下方。

8. 发明申请

WO1995030945A3 A COMPUTER SYSTEM 审中-公开
公开(公告)号：WO1995030945A3
公开(公告)日：1995-11-16
申请号：PCT/US1995005210
申请日：1995-05-02
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , CRANE, Stanford, W., Jr. , PORTUONDO, Maria, M. , CRUZ, Edward, V. , RAZO, Vincent, R. , FYNN, Shaun
IPC分类号： G06F01/20

9. 发明申请

WO1995024747A1 SEMICONDUCTOR CHIP AFFORDING A HIGH-DENSITY EXTERNAL INTERFACE 审中-公开
标题翻译：半导体芯片解决高密度外部接口
公开(公告)号：WO1995024747A1
公开(公告)日：1995-09-14
申请号：PCT/US1995002677
申请日：1995-03-09
申请人： THE PANDA PROJECT
发明人： THE PANDA PROJECT , CRANE, Stanford, W., Jr. , PORTUONDO, Maria, M.
IPC分类号： H01R13/26
CPC分类号： H01L24/73 , H01L2224/16225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4823 , H01L2224/48247 , H01L2224/49109 , H01L2224/73207 , H01L2224/73257 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15312 , H01L2924/16195 , H01L2924/181 , H01R12/73 , H01R13/26 , H05K3/3421 , H05K7/1084 , H01L2924/00014 , H01L2924/00 , H01L2224/29099
摘要： A semiconductor die carrier may include an insulative substrate (14); an array of groups of multiple electrically conductive contacts (18) arranged in rows and columns on the insulative substrate (14), wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die (11) and the conductive contacts (18). A semiconductor die carrier may also include an insulative substrate; a plurality of leads each having an external portion extending out of the semiconductor die carrier from a lower surface of the insulative substrate and an internal portion located within the semiconductor die carrier at an upper surface of the insulative substrate; a semiconductor die; and a layer of conductive material in contact with conductive portions of the semiconductor die and also in contact with the internal portions of the leeds.
摘要翻译：半导体管芯载体可以包括绝缘衬底（14）; 在绝缘衬底（14）上以行和列布置的多个导电触头（18）的一组阵列，其中相邻行的组与来自相邻列的组交错，并且每个组的一部分重叠成阵列的相邻行或相邻列; 半导体芯片; 以及用于在半导体管芯（11）和导电触点（18）之间提供电连接的结构。半导体管芯载体还可以包括绝缘衬底; 多个引线，其各自具有从所述绝缘基板的下表面延伸出所述半导体管芯载体的外部部分，以及在所述绝缘基板的上表面处设置在所述半导体管芯载体内的内部部分; 半导体芯片; 以及与半导体管芯的导电部分接触并且还与引线的内部部分接触的导电材料层。

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