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1. 发明申请

WO2005053883A2 INFILTRATING A POWDER METAL SKELETON BY A SIMILAR ALLOY WITH DEPRESSED MELTING POINT EXPLOITING A PERSISTENT LIQUID PHASE AT EQUILIBRIUM, SUITABLE FOR FABRICATING STEEL PARTS 审中-公开
标题翻译：通过类似合金渗透粉末冶金点渗透粉末金属表面，在均衡器上开发适用于制造钢件的均匀液相
公开(公告)号：WO2005053883A2
公开(公告)日：2005-06-16
申请号：PCT/US2004/039133
申请日：2004-11-22
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , KERNAN, Brian, D. , SACHS, Emanuel, M. , ALLEN, Samuel, M. , LORENZ, Adam, M.
发明人： KERNAN, Brian, D. , SACHS, Emanuel, M. , ALLEN, Samuel, M. , LORENZ, Adam, M.
IPC分类号： B22F3/26
CPC分类号： C22C38/18 , B33Y80/00 , C22C33/0242
摘要： A steel powder metal skeleton is infiltrated with an infiltrant composition similar to the skeleton, with an additional agent that depresses the melting point of the infiltrant relative to the skeleton. Infiltration is driven primarily by capillary pressure. The powder and infiltrant compositions differ primarily only in a higher concentration of a melting point depressant agent "MPD" in the infiltrant. Carbon (C) and silicon (Si) and several other elements can be elements in an MPD, either alone or in combination. Certain steel target compositions are such that a complementary infiltrant, and skeleton can be chosen such that a skeleton will remain solid at an infiltration temperature at which the infiltrant can be melted and fully infiltrated, and further where there is a persistent two phase field, with a liquid phase that is large enough (greater than 7% vol, and typically between 20 and 40 volt) so that flow can be maintained without choke off from diffusional solidification. The solid and the liquid phases remaining after any diffusional solidification have different compositions, with a bulk composition of the target. Typically the difference is slight, and the full part is substantially homogeneous. Heat treating, such as austenitizing, quenching, or slow cooling and tempering, can improve homogeneity and mechanical properties. The MPD can have a relatively high diffusivity and solubility in the skeleton. Methods of designing systems of target, skeleton and infiltrant compositions and infiltration temperature are disclosed.
摘要翻译：钢粉末金属骨架用类似于骨架的渗透剂组合物渗透，另外一种可以降低渗透剂相对于骨架的熔点的试剂。渗透主要由毛细管压力驱动。粉末和渗透剂组合物主要仅在浸润剂中较高浓度的熔点降低剂“MPD”。碳（C）和硅（Si）等几种元素可以单独或组合使用在MPD中的元素。某些钢靶组合物使得可以选择互补的浸润剂和骨架，使得骨架将在浸润剂可以熔化和完全渗透的浸润温度下保持固体，并且进一步在存在持续的两相场的情况下，足够大的液相（大于7％体积，通常在20和40伏特之间），从而可以保持流动而不会阻碍扩散凝固。在任何扩散固化后残留的固体和液相具有不同的组成，具有靶的体积组成。通常，差异很小，整个部分基本上是均匀的。诸如奥氏体化，淬火或缓慢冷却和回火的热处理可以改善均匀性和机械性能。 MPD可以在骨架中具有相对较高的扩散性和溶解性。公开了设计目标，骨架和浸润剂组合物系统的方法和浸润温度。

2. 发明申请

WO2004091911A2 POSITIVE PRESSURE DROP-ON-DEMAND PRINTING 审中-公开
标题翻译：积极压力下降打印
公开(公告)号：WO2004091911A2
公开(公告)日：2004-10-28
申请号：PCT/US2004/010523
申请日：2004-04-07
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , SACHS, Emanuel, M. , GLEASON, Blake, W. , SERDY, James, G.
发明人： SACHS, Emanuel, M. , GLEASON, Blake, W. , SERDY, James, G.
IPC分类号： B41F
CPC分类号： B41J2/1429 , B33Y10/00 , B33Y30/00 , B41J2002/14475
摘要： A drop on demand printer has a nozzle with an orifice and a surrounding annular land. Surrounding the land is an edge, which is surrounded by a perimetrical surface that is inclined to the land at an angle α. A pressure controller maintains a positive overpressure on liquid to be printed such that a cap of liquid is substantially always present covering the orifice and the land. The edge between the land and the perimetrical surface prevents liquid from overflowing, and maintains the cap, if the pressure is maintained between lower and upper limits disclosed. The liquid to be printed preferably wets the orifice land, which may be alumina, glass, ceramic, and others. Liquids with very small, even zero, wetting angles relative to the land may be used, such as water and organic solvents, including, isopropyl and ethyl alcohol and chloroform. The liquid can be loaded with dissolved polymers, or particles, such as of polymer or ceramic. Very small drops can be printed, by using an orifice of about 40 microns effective diameter, with a land of about 90 microns effective diameter. The printer can be used for any drop dispensing application, such as ink jet, Three Dimensional printing, and also for depositing small amounts of pharmaceutical materials into a receptacle, or drug delivery vehicle. A means for establishing a temperature differential, with a higher upstream and lower downstream temperature, eliminates any gas bubbles at the orifice.
摘要翻译：按需打印机具有具有孔口和周围环形区域的喷嘴。周围的土地是一个边缘，被一个以α角度倾向于陆地的周边表面所包围。压力控制器对待印刷的液体保持正的超压，使得液体盖基本上始终存在覆盖孔口和焊盘。如果压力保持在所公开的下限和上限之间，则陆面和周边表面之间的边缘防止液体溢出，并保持盖。待印刷的液体优选地润湿孔板，其可以是氧化铝，玻璃，陶瓷等。可以使用相对于陆地具有非常小甚至零润湿角度的液体，例如水和有机溶剂，包括异丙醇和乙醇和氯仿。液体可以装载溶解的聚合物或颗粒，例如聚合物或陶瓷。通过使用约40微米有效直径的孔，可以印刷非常小的液滴，有效直径约为90微米。打印机可用于任何滴剂分配应用，例如喷墨，三维印刷，以及用于将少量药物材料沉积到容器或药物递送载体中。用于建立具有较高上游和下游温度的温差的装置消除了孔口处的任何气泡。

3. 发明申请

WO2009002550A1 RECRYSTALLIZATION OF SEMICONDUCTOR WAFERS IN A THIN FILM CAPSULE AND RELATED PROCESSES 审中-公开
标题翻译：薄膜胶片和相关工艺中半导体晶体的再结晶
公开(公告)号：WO2009002550A1
公开(公告)日：2008-12-31
申请号：PCT/US2008/008030
申请日：2008-06-26
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , SACHS, Emanuel, M. , SERDY, James, G. , HANTSOO, Eerik, T.
发明人： SACHS, Emanuel, M. , SERDY, James, G. , HANTSOO, Eerik, T.
IPC分类号： H01L21/00
CPC分类号： C30B13/00 , C30B1/02 , C30B28/02 , C30B29/06 , H01L21/02532 , H01L21/02667 , H01L23/3171 , H01L29/04 , H01L2924/0002 , H01L2924/00
摘要： An original wafer, typically silicon, has the form of a desired end PV wafer. The original may be made by rapid solidification or CVD. It has small grains. It is encapsulated in a clean thin film, which contains and protects the silicon when recrystallized to create a larger grain structure. The capsule can be made by heating a wafer in the presence of oxygen, or steam, resulting in silicon dioxide on the outer surface, typically 1-2 microns. Further heating creates a molten zone in space, through which the wafer travels, resulting in recrystallization with a larger grain size. The capsule contains the molten material during recrystallization, and protects against impurities. Recrystallization may be in air. Thermal transfer through backing plates minimizes stresses and defects. After recrystallization, the capsule is removed.
摘要翻译：原始晶片（通常为硅）具有期望的端部PV晶片的形式。原件可以通过快速凝固或CVD制成。它有小颗粒。它被封装在干净的薄膜中，其在再结晶时含有并保护硅以产生更大的晶粒结构。胶囊可以通过在氧气或蒸汽的存在下加热晶片来制造，从而在外表面上产生二氧化硅，通常为1-2微米。进一步的加热在空间中产生熔融区，晶片经过该熔融区，导致晶粒尺寸更大的再结晶。胶囊在再结晶期间含有熔融材料，防止杂质。重结晶可能在空气中。通过背板进行热转印可最大限度地减少应力和缺陷。重结晶后，除去胶囊。

4. 发明申请

WO2007067304A3 LIGHT CAPTURE WITH PATTERNED SOLAR CELL BUS WIRES 审中-公开
公开(公告)号：WO2007067304A3
公开(公告)日：2007-06-14
申请号：PCT/US2006/043877
申请日：2006-11-10
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , SACHS, Emanuel, M.
发明人： SACHS, Emanuel, M.
IPC分类号： H01L31/04
摘要： Crystalline silicon PV modules typically use tinned flat copper wire to increase the conductivity of a bus bar metallization and to interconnect to adjacent cells. Such a flat bus wire may be patterned with shallow v-shaped grooves using metal forming techniques, such as rolling, stamping and drawing. The grooves are designed so that incident light is reflected up toward the glass superstrate of t module at an internal interface angle that is large enough (typically greater than about 40°) so that the light undergoes total internal reflection at the glass-air interface and is reflected onto the solar cell. Grooves can be lengthwise along the conductor, or at an angle, angles. Rather than grooves, inclined faces can form pyramids, or other shapes.

5. 发明申请

WO2005114322A2 MANUFACTURING PROCESS, SUCH AS THREE-DIMENSIONAL PRINTING, INCLUDING SOLVENT VAPOR FILMING AND THE LIKE 审中-公开
标题翻译：制造工艺，如三维打印，包括溶剂蒸气包装和类似
公开(公告)号：WO2005114322A2
公开(公告)日：2005-12-01
申请号：PCT/US2005/016698
申请日：2005-05-12
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , SERDY, James, G. , SACHS, Emanuel, M.
发明人： SERDY, James, G. , SACHS, Emanuel, M.
IPC分类号： G03C1/00
CPC分类号： A61L27/56 , A61F2/28 , A61F2002/30062 , A61F2002/30224 , A61F2002/30225 , A61F2002/30785 , A61F2002/30985 , A61F2210/0004 , A61F2230/0069 , A61F2310/00293 , A61F2310/00353 , A61L27/54 , A61L2300/412 , A61L2300/434 , A61L2300/602 , B33Y10/00 , B33Y70/00 , B33Y80/00 , Y10T428/15 , Y10T428/24273 , Y10T428/31504
摘要： Methods of manufacturing an article use three-dimensional printing for a portion of the manufacturing. Three-dimensionally printing is conducted onto a powder bed which contains both organic-solvent-soluble, water-insoluble particles and water soluble, organic-solvent-insoluble particles. The water-soluble particles which may be selected for properties such as size and may include more than one substance. The organic-solvent-insoluble particles may further include at least one substantially insoluble substance such as a member of the calcium phosphate family. Printing may be done using an aqueous binder liquid. After removal of unbound powder, the preform may be exposed to the vapor of an organic solvent which causes the particles of organic-soluble-polymer to fuse to each other. This may further be followed by dissolving out the water-soluble particles, if such particles were present in the powder. Solvent vapor fusing together with the use of porogen particles may also be used in manufacturing methods other than 3DP. Rather than using organic solvent, heat responsive particles can be used, and can be filmed by elevated temperatures. Articles that may be produced by the described methods exhibit features such as a high porosity and an ability to undergo large deformations without breaking, and by at least partial springback from such deformation. The springback may be substantially instantaneous or may be time-dependent involving a time period of at least several seconds.
摘要翻译：制造制品的方法在制造的一部分中使用三维印刷。将三维打印进行到含有有机溶剂可溶性，水不溶性颗粒和水溶性有机溶剂不溶性颗粒的粉末床上。可以选择尺寸等性质的水溶性颗粒，并且可以包括多于一种物质。有机溶剂不溶性颗粒可以进一步包括至少一种基本上不溶的物质，例如磷酸钙族的成员。可以使用水性粘合剂液体进行印刷。在去除未结合的粉末之后，预制件可能暴露于有机溶剂的蒸气中，这导致有机可溶聚合物颗粒彼此熔合。如果这种颗粒存在于粉末中，则可以进一步溶解水溶性颗粒。与使用致孔剂颗粒一起使用的溶剂蒸汽熔融也可用于3DP以外的制造方法。不使用有机溶剂，可以使用热响应颗粒，并且可以通过升高的温度进行成膜。可以通过所述方法产生的制品表现出诸如高孔隙率和经受大变形而不断裂的能力以及至少部分回弹的特征。回弹可以基本上是瞬时的，或者可以是时间依赖性的，涉及至少几秒的时间段。

6. 发明申请

WO2009128946A1 WEDGE IMPRINT PATTERNING OF IRREGULAR SURFACE 审中-公开
标题翻译：不规则表面的楔形图案
公开(公告)号：WO2009128946A1
公开(公告)日：2009-10-22
申请号：PCT/US2009/002423
申请日：2009-04-17
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , 1366 TECHNOLOGIES INC. , POLITO, Benjamin, E. , GATES, Holly, G. , SACHS, Emanuel, M.
发明人： POLITO, Benjamin, E. , GATES, Holly, G. , SACHS, Emanuel, M.
IPC分类号： B29C59/02
CPC分类号： H01L31/182 , B29C43/021 , B29C43/222 , B29C59/02 , B29C2043/025 , B29C2043/3634 , B29C2043/3652 , B29C2043/465 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L31/0236 , H01L31/02363 , Y02E10/50
摘要： Patterned substrates for photovoltaic and other uses are made by pressing a flexible stamp upon a thin layer of resist material, which covers a substrate, such as a wafer. The resist changes phase or becomes flowable, flowing away from locations of impression, revealing the substrate, which is subjected to some shaping process, typically etching. Portions exposed by the stamp being are removed, and portions that protected by the resist, remain. A typical substrate is silicon, and a typical resist is a wax. Workpiece textures include extended grooves, discrete, spaced apart pits, and combinations and intermediates thereof. Platen or rotary patterning apparatus may be used. Rough and irregular workpiece substrates may be accommodated by extended stamp elements. Resist may be applied first to the workpiece, the stamp, or substantially simultaneously, in discrete locations, or over the entire surface of either. The resist dewets the substrate completely where desired.
摘要翻译：用于光伏和其他用途的图案化基板是通过将柔性印模压在覆盖诸如晶片的基底的抗蚀剂材料薄层上而制成的。抗蚀剂改变相位或变得可流动，从印模的位置流出，露出经受一些成形过程的基底，通常是蚀刻。被邮票曝光的部分被去除，并且被抗蚀剂保护的部分保留。典型的基底是硅，典型的抗蚀剂是蜡。工件纹理包括延伸凹槽，离散的，间隔开的凹坑，以及它们的组合和中间体。可以使用压板或旋转图案形成装置。粗糙和不规则的工件衬底可以由延长的印模元件容纳。抗蚀剂可以首先施加到工件，印模或基本上同时地在离散的位置，或者在两者的整个表面上。抗蚀剂在需要时完全将基材脱模。

7. 发明申请

WO2008100603A1 SOLAR CELLS WITH TEXTURED SURFACES 审中-公开
标题翻译：带有纹理表面的太阳能电池
公开(公告)号：WO2008100603A1
公开(公告)日：2008-08-21
申请号：PCT/US2008/002058
申请日：2008-02-15
申请人： MASSACHUSETTS INSTITUTE OF TECHNOLOGY , SACHS, Emanuel, M. , BREDT, James, F.
发明人： SACHS, Emanuel, M. , BREDT, James, F.
IPC分类号： H01L31/0352 , H01L31/00
CPC分类号： H01L31/02363 , C23C18/1607 , C23C18/1608 , C23C18/161 , C23C18/1635 , C23C18/1653 , C23C18/1692 , C23C18/1893 , C25D5/006 , C25D5/02 , C25D5/022 , C25D7/126 , H01L31/02168 , H01L31/022425 , Y02E10/50
摘要： Semiconductor photovoltaic cells have surfaces that are textured for processing and photovoltaic reasons. The absorbing regions may have parallel grooves that reduce loss of solar energy that would otherwise be lost by reflection. One form of texturing has parallel grooves and ridges. The cell also includes regions of metallization for collecting the generated electrical carriers and conducting them away, which may be channels. The topography is considered during production, using a process that takes advantage of the topography to govern what locations upon will receive a specific processing, and which locations will not receive such a processing. Liquids are treated directly into zones of the cell. They migrate throughout a zone and act upon the locations contacted. They do not migrate to other zones, due to impediments to fluid flow that are features of the surface texture, such as edges, walls and ridges. Blocking liquid may also be deposited and migrate within a zone, to block or mask a subsequent activity, such as etching.
摘要翻译：半导体光伏电池具有纹理的表面用于处理和光伏原因。吸收区域可以具有平行的沟槽，其减少否则将被反射损失的太阳能损失。一种形式的纹理具有平行的凹槽和脊。电池还包括金属化区域，用于收集所产生的电载体并使其远离，这可以是通道。在生产期间考虑地形，使用利用地形的过程来管理将接收特定处理的位置，以及哪些位置将不会接收到这样的处理。将液体直接处理到细胞的区域。他们迁移到整个区域，并对所联系的地点采取行动。它们不会迁移到其他区域，因为阻碍流体流动，这是表面纹理的特征，例如边缘，壁和脊。封闭液体也可以沉积并在区域内迁移，以阻挡或掩盖随后的活动，例如蚀刻。

8. 发明申请

WO2010104838A1 METHODS AND APPARATI FOR MAKING THIN SEMICONDUCTOR BODIES FROM MOLTEN MATERIAL 审中-公开
标题翻译：用于制备薄膜半导体体的方法和装置
公开(公告)号：WO2010104838A1
公开(公告)日：2010-09-16
申请号：PCT/US2010/026639
申请日：2010-03-09
申请人： 1366 TECHNOLOGIES INC. , SACHS, Emanuel, M. , WALLACE, Richard, L. , HANTSOO, Eerik, T. , LORENZ, Adam, M. , HUDELSON, G. D., Stephen , JONCZYK, Ralf
发明人： SACHS, Emanuel, M. , WALLACE, Richard, L. , HANTSOO, Eerik, T. , LORENZ, Adam, M. , HUDELSON, G. D., Stephen , JONCZYK, Ralf
IPC分类号： C30B15/00 , C03B19/02
CPC分类号： B29C33/44 , C30B11/007 , C30B15/30 , C30B19/068 , C30B28/04 , C30B29/06
摘要： A pressure differential is applied across a mold sheet and a semiconductor (e.g. silicon) wafer is formed thereon. Relaxation of the pressure differential allows release of the wafer. The mold sheet may be cooler than the melt. Heat is extracted almost exclusively through the thickness of the forming wafer. The liquid and solid interface is substantially parallel to the mold sheet. The temperature of the solidifying body is substantially uniform across its width, resulting in low stresses and dislocation density and higher crystallographic quality. The mold sheet must allow flow of gas through it. The melt can be introduced to the sheet by: full area contact with the top of a melt; traversing a partial area contact of melt with the mold sheet, whether horizontal or vertical, or in between; and by dipping the mold into a melt. The grain size can be controlled by many means.
摘要翻译：在模板上施加压差，并在其上形成半导体（例如硅）晶片。压差的放松允许晶片的释放。模具片可以比熔体更冷。几乎完全通过成形晶片的厚度提取热量。液体和固体界面基本上平行于模片。凝固体的温度在其宽度上基本均匀，导致低应力和位错密度和更高的晶体学质量。模板必须允许气体流过它。可以通过以下方式将熔体引入片材：与熔体的顶部完全区域接触; 穿过熔体与模板的部分区域接触，无论是水平还是垂直的，或者在其间; 并将模具浸入熔体中。可以通过许多方法控制晶粒尺寸。

9. 发明申请

WO2012075306A2 MAKING SEMICONDUCTOR BODIES FROM MOLTEN MATERIAL USING A FREE-STANDING INTERPOSER SHEET 审中-公开
标题翻译：使用自由插入片材制作材料的半导体器件
公开(公告)号：WO2012075306A2
公开(公告)日：2012-06-07
申请号：PCT/US2011/062914
申请日：2011-12-01
申请人： 1366 TECHNOLOGIES INC. , JONCZYK, Ralf , SACHS, Emanuel, M.
发明人： JONCZYK, Ralf , SACHS, Emanuel, M.
IPC分类号： H01L21/28
CPC分类号： H01L31/182 , C04B41/4539 , C04B41/5096 , C30B11/002 , C30B15/00 , C30B15/007 , C30B15/32 , C30B29/06 , H01L21/02002 , H01L21/02532 , H01L31/1804 , Y02E10/546 , Y02P70/521
摘要： An interposer sheet can be used for making semiconductor bodies, such as of silicon, such as for solar cell use. It is free-standing, very thin, flexible, porous and able to withstand the chemical and thermal environment of molten semiconductor without degradation. It is typically of a ceramic material, such as silica, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbide, silicon carbonitride, silicon oxycarbonitride and others. It is provided between a forming surface of a mold sheet, and the molten material from which a semiconductor body will be formed. It may be secured to the forming surface or deposited upon the melt. The interposer sheet suppresses grain nucleation, and limits heat flow from the melt. It promotes separation of the semiconductor body from the forming surface. It can be fabricated before its use. Because free-standing and not adhered to the forming surface, problems of mismatch of CTE are minimized. The interposer sheet and semiconductor body are free to expand and contract relatively independently of the forming surface.
摘要翻译：插入片可用于制造诸如硅的半导体本体，例如用于太阳能电池。它是独立的，非常薄的，柔性的，多孔的并且能够耐受熔融半导体的化学和热环境而不降解。它通常是陶瓷材料，例如二氧化硅，氮化硅，氮氧化硅，碳氧化硅，碳化硅，碳氮化硅，碳氮氧化硅等。设置在模板的成形表面和将形成半导体本体的熔融材料之间。它可以固定到成形表面或沉积在熔体上。插入片抑制晶粒成核，并限制来自熔体的热流。它促进半导体主体与成形表面的分离。它可以在使用之前进行制造。由于独立且不粘附到成型表面，CTE的失配问题被最小化。插入片和半导体本体相对于成形表面相对自由地膨胀和收缩。

10. 发明申请

WO2010129884A1 POROUS LIFT-OFF LAYER FOR SELECTIVE REMOVAL OF DEPOSITED FILMS 审中-公开
标题翻译：多孔提升层，用于选择性去除沉积膜
公开(公告)号：WO2010129884A1
公开(公告)日：2010-11-11
申请号：PCT/US2010/034067
申请日：2010-05-07
申请人： 1366 TECHNOLOGIES INC. , SACHS, Emanuel, M. , GABOR, Andrew, M.
发明人： SACHS, Emanuel, M. , GABOR, Andrew, M.
IPC分类号： H01L21/306 , H01L31/00 , H01L31/18
CPC分类号： H01L31/022425 , H01L21/76802 , H01L31/02363 , H01L31/18 , Y02E10/50
摘要： A porous lift off layer facilitates removal of films from surfaces, such as semiconductors. A film is applied over a patterned porous layer, the layer comprising openings typically larger than the film thickness. The porous material and the film are then removed from areas where film is not intended. The porous layer can be provided as a slurry, dried to open porosities, or fugitive particles within a field, which disassociate upon the application of heat or solvent. The film can be removed by etchant that enters through porosities where the film does not bridge the spaces between solid portions, so that the etchant attacks both film surfaces
摘要翻译：多孔提升层有助于从诸如半导体的表面去除膜。将膜施加在图案化的多孔层上，该层包括通常大于膜厚度的开口。然后将多孔材料和膜从不需要膜的区域中取出。多孔层可以作为浆料提供，干燥以打开孔隙，或场内的逸散颗粒，其在施加热或溶剂时解离。可以通过蚀刻剂从薄膜不固定部分之间的空隙的孔隙中进入薄膜，从而使蚀刻剂侵袭两个薄膜表面

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