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    • 1. 发明申请
    • FILM OF POLYCRYSTALLINE SEMICONDUCTOR MATERIAL, METHOD OF MAKING SAME AND ORIENTING/UNDERCOOLING MOLDS THEREFOR, AND ELECTRONIC DEVICE
    • 多晶半导体材料的薄膜,其制备方法及其制备方法和电子设备
    • WO2014001886A1
    • 2014-01-03
    • PCT/IB2013/001370
    • 2013-06-27
    • RGS DEVELOPMENT B.V.
    • LEEMPOEL, PatrickPICHON, Pierre-YvesSCHÖNECKER, Axel
    • C30B15/00C30B28/10H01L31/18
    • C30B15/007C30B28/10C30B29/06H01L31/182Y02E10/546Y02P70/521
    • A film of polycrystalline semiconductor material, a method of making the film and orienting/undercooling molds that are useful in the method, and an electronic device comprising or prepared from the film. An orienting/undercooling mold that is impermeable to gas flow, the orienting/undercooling mold comprising a first orienting/undercooling surface configured with a basal surface consisting essentially of a low nucleation-potency material and with a plurality of contact points, at least some of the plurality of contact points consisting essentially of a monocrystalline semiconductor material for orienting crystal growth and controlling positions of nucleation sites on the orienting/undercooling surface, and any remainder of the plurality of contact points consisting essentially of a low nucleation-potency material for controlling heat transfer without functioning as nucleation sites; and wherein crystal lattices of at least 80 percent of the total number of the contact points consisting essentially of a monocrystalline semiconductor material are oriented parallel to each other.
    • 多晶半导体材料薄膜,制造该方法中有用的薄膜和定向/过冷模具的方法,以及包括该薄膜或由薄膜制备的电子装置。 取向/过冷模具包括第一取向/过冷表面,该第一取向/过冷模具配置有基本表面,该基础表面基本上由低成核效力材料组成,并具有多个接触点,至少一些 多个接触点基本上由用于取向晶体生长和控制取向/过冷表面上的成核位置的位置的单晶半导体材料组成,并且多个接触点的任何其余部分基本上由用于控制热的低成核效应材料组成 转移而不起核化作用; 并且其中基本上由单晶半导体材料组成的接触点总数的至少80%的晶格彼此平行取向。
    • 7. 发明申请
    • SILICON RIBBON GROWTH DENDRITE THICKNESS CONTROL SYSTEM
    • 硅胶生长深度厚度控制系统
    • WO0046430A2
    • 2000-08-10
    • PCT/US9902254
    • 1999-02-02
    • EBARA SOLAR INC
    • EASOZ JOHN RMUNSHOWER BARRY
    • C30B29/06C30B15/00C30B15/22C30B15/26C30B29/64C30B
    • C30B15/007C30B15/22C30B15/26C30B15/34C30B29/06
    • A method and system for controlling the thickness of a pair of dendrites in a dendritic silicon web growth process to improve dendritic silicon web production. An image of each dendrite in a web emerging from a silicon melt in a furnace is produced by a pair of cameras focused on the dendrite pair. The dendrite images are digitized, the average thickness of the dendrites is calculated, and compared to set point parameters. The average difference between the dendrite thicknesses and the set point parameters is used to control the overall furnace temperature, while the differences between the thickness of each pair are used to control the lateral temperature distribution in the furnace in order to maintain the dendrite thickness within predetermined limits. The method can be used in a closed loop configuration to automatically control the furnace temperature and lateral temperature distribution; or in an open loop configuration to provide visible feedback information to an operator who manually adjusts the furnace temperature conditions.
    • 一种用于控制树枝状硅纤维网生长过程中一对枝状物的厚度以改善树枝状硅纤维网生产的方法和系统。 在熔炉中从硅熔体中出现的网中的每个枝晶的图像由聚焦在枝晶对上的一对照相机产生。 将枝晶图像数字化,计算枝晶的平均厚度,并与设定点参数进行比较。 使用枝晶厚度和设定点参数之间的平均差异来控制整体炉温,而每对厚度之间的差异用于控制炉中的侧向温度分布,以便将枝晶厚度保持在预定的范围内 限制。 该方法可用于闭环配置,自动控制炉温和横向温度分布; 或以开环结构提供可手动调节炉温条件的操作者的可见反馈信息。
    • 10. 发明申请
    • MAKING SEMICONDUCTOR BODIES FROM MOLTEN MATERIAL USING A FREE-STANDING INTERPOSER SHEET
    • 使用自由插入片材制作材料的半导体器件
    • WO2012075306A2
    • 2012-06-07
    • PCT/US2011/062914
    • 2011-12-01
    • 1366 TECHNOLOGIES INC.JONCZYK, RalfSACHS, Emanuel, M.
    • JONCZYK, RalfSACHS, Emanuel, M.
    • H01L21/28
    • H01L31/182C04B41/4539C04B41/5096C30B11/002C30B15/00C30B15/007C30B15/32C30B29/06H01L21/02002H01L21/02532H01L31/1804Y02E10/546Y02P70/521
    • An interposer sheet can be used for making semiconductor bodies, such as of silicon, such as for solar cell use. It is free-standing, very thin, flexible, porous and able to withstand the chemical and thermal environment of molten semiconductor without degradation. It is typically of a ceramic material, such as silica, silicon nitride, silicon oxynitride, silicon oxycarbide, silicon carbide, silicon carbonitride, silicon oxycarbonitride and others. It is provided between a forming surface of a mold sheet, and the molten material from which a semiconductor body will be formed. It may be secured to the forming surface or deposited upon the melt. The interposer sheet suppresses grain nucleation, and limits heat flow from the melt. It promotes separation of the semiconductor body from the forming surface. It can be fabricated before its use. Because free-standing and not adhered to the forming surface, problems of mismatch of CTE are minimized. The interposer sheet and semiconductor body are free to expand and contract relatively independently of the forming surface.
    • 插入片可用于制造诸如硅的半导体本体,例如用于太阳能电池。 它是独立的,非常薄的,柔性的,多孔的并且能够耐受熔融半导体的化学和热环境而不降解。 它通常是陶瓷材料,例如二氧化硅,氮化硅,氮氧化硅,碳氧化硅,碳化硅,碳氮化硅,碳氮氧化硅等。 设置在模板的成形表面和将形成半导体本体的熔融材料之间。 它可以固定到成形表面或沉积在熔体上。 插入片抑制晶粒成核,并限制来自熔体的热流。 它促进半导体主体与成形表面的分离。 它可以在使用之前进行制造。 由于独立且不粘附到成型表面,CTE的失配问题被最小化。 插入片和半导体本体相对于成形表面相对自由地膨胀和收缩。