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    • 6. 发明申请
    • ELECTRONIC DEVICE
    • 电子设备
    • WO2007004137A3
    • 2007-07-05
    • PCT/IB2006052152
    • 2006-06-28
    • KONINKL PHILIPS ELECTRONICS NVDEKKER RONALDROOZEBOOM FREDDYNOTTEN PETERKEMMEREN ANTONIUS L A M
    • DEKKER RONALDROOZEBOOM FREDDYNOTTEN PETERKEMMEREN ANTONIUS L A M
    • H01L23/538H01L23/482
    • H03H9/0547H01L25/16H01L27/14618H01L31/0203H01L2924/0002H03H9/105H01L2924/00
    • The electronic device comprises a semiconductor substrate (10) with at a first side (l)a circuit of semiconductor elements (20). The substrate (10) is present between a carrier (40) and an encapsulation (70), so that the first side (1) of the substrate (10) faces the carrier (40). The circuit of semiconductor elements (20) is coupled with conductor tracks (25) to a metallization (82) in a groove (80) in the encapsulation (70), which metallization (82) extends to terminals (90) at an outside of the encapsulation (70). At least one further electrical element (120) is defined between the first side (1) of the semiconductor substrate (10) and the encapsulation (70). This further element (120) is provided with at least one conductor track (65) extending to the metallization (82) in the groove (80) so as to incorporate the further element (120) in the circuit of semiconductor elements (20) on the first side (1) of the substrate (10).
    • 该电子器件包括半导体衬底(10),该衬底在第一侧(1)具有半导体元件(20)的电路。 衬底(10)存在于载体(40)和封装(70)之间,使得衬底(10)的第一侧(1)面对载体(40)。 半导体元件(20)的电路与印制导线(25)耦合到封装(70)中的凹槽(80)中的金属化部分(82),该金属化部分(82)延伸到端子(90) 封装(70)。 在半导体衬底(10)的第一侧(1)和封装(70)之间限定至少一个另外的电气元件(120)。 该另外的元件120设置有延伸到凹槽80中的金属化部82的至少一个导体轨道65,以便将另一元件120结合到半导体元件20的电路中, 衬底(10)的第一侧(1)。
    • 9. 发明申请
    • PRODUCING A COVERED THROUGH SUBSTRATE VIA USING A TEMPORARY CAP LAYER
    • 通过使用临时盖层产生覆盖的基底
    • WO2007054867A3
    • 2007-08-09
    • PCT/IB2006054082
    • 2006-11-03
    • NXP BVKLOOTWIJK JOHAN HKEMMEREN ANTONIUS L A MDEKKER RONALDVAN GRUNSVEN ERIC C EROOZEBOOM FREDDY
    • KLOOTWIJK JOHAN HKEMMEREN ANTONIUS L A MDEKKER RONALDVAN GRUNSVEN ERIC C EROOZEBOOM FREDDY
    • H01L21/768
    • H01L21/76898H01L21/764H01L23/481H01L2924/0002H01L2924/00
    • The present invention relates to a method for producing a substrate with at least one covered via that electrically and preferably also thermally connects a first substrate side with an opposite second substrate side. The processing involves forming a trench on a the first substrate side remains and covering the trench with a permanent layer on top of a temporary, sacrificial cap-layer, which is decomposed in a thermal process step. The method of the invention provides alternative ways to remove decomposition products of the sacrificial cap-layer material without remaining traces or contamination even in the presence of the permanent layer. This is, according to a first aspect of the invention, achieved by providing the substrate trench with an overcoat layer that has holes. The holes in the overcoat layer leave room for the removal of the decomposition products of the cap-layer material. According to the second aspect of the invention, opening the covered trench from the second substrate side and allowing the cap-layer material to be removed through that opening provides a solution. Both methods of the present invention are based on the common idea of using a temporary cap-layer even in a situation where the substrate opening is permanently covered before the removal of the temporary cap-layer.
    • 本发明涉及一种用于制造具有至少一个覆盖过孔的基板的方法,所述至少一个覆盖过孔电且优选还将第一基板侧与相对的第二基板侧热连接。 该处理包括在第一衬底侧上形成沟槽,并且在永久层上覆盖沟槽,该永久层位于在热处理步骤中分解的临时牺牲帽层的顶部上。 本发明的方法提供了替代方法,即使在存在永久层的情况下也不会留下痕迹或污染物,以去除牺牲帽层材料的分解产物。 根据本发明的第一方面,这是通过向衬底沟槽提供具有孔的覆盖层来实现的。 覆盖层中的孔留下了去除覆盖层材料的分解产物的空间。 根据本发明的第二方面,从第二衬底侧打开被覆盖的沟槽并允许通过该开口移除帽层材料提供了一种解决方案。 本发明的两种方法都基于即使在去除临时盖层之前衬底开口被永久覆盖的情况下使用临时盖层的常见思想。