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    • 1. 发明申请
    • OCCUPANCY SENSOR
    • OCCUPANCY传感器
    • WO2010136919A1
    • 2010-12-02
    • PCT/IB2010/052020
    • 2010-05-07
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.PASVEER, Willem, F., P.HAARTSEN, Jaap, R.NIESSEN, Rogier, A., H.
    • PASVEER, Willem, F., P.HAARTSEN, Jaap, R.NIESSEN, Rogier, A., H.
    • H05B37/02H01L27/14
    • H05B37/0227H01L31/02019H01L31/04H01L31/101H01L31/18
    • A method for manufacturing a sensor device (100; 200; 300; 400) comprising a thermal sensor (23), a battery (33), an antenna (34), an electronic circuitry (22) and a solar cell (43) together integrally in one semiconductor carrier (10), the method comprising the steps of: - providing a silicon wafer (10) with two main surfaces (11, 12); a first functional layer (20) is manufactured in one main surface (11), comprising a thermal sensor portion (21) and comprising electronic circuitry (22) arranged in a non-overlapping relationship with the thermal sensor portion; a second functional layer (30) containing a battery (33) and an antenna (34) is arranged in a non-overlapping relationship with the thermal sensor portion; a third functional layer (40) containing one or more solar cells (43) is arranged in a non-overlapping relationship with the thermal sensor portion; the portion of the wafer underneath the thermal sensor portion (21) is removed.
    • 一种用于制造传感器装置(100; 200; 300; 400)的方法,包括热传感器(23),电池(33),天线(34),电子电路(22)和太阳能电池(43) 一体地在一个半导体载体(10)中,所述方法包括以下步骤: - 提供具有两个主表面(11,12)的硅晶片(10); 在一个主表面(11)中制造第一功能层(20),包括热传感器部分(21)并且包括以与热传感器部分不重叠的关系布置的电子电路(22) 包含电池(33)和天线(34)的第二功能层(30)以与热传感器部分不重叠的关系布置; 包含一个或多个太阳能电池(43)的第三功能层(40)以与热传感器部分不重叠的关系布置; 去除热传感器部分(21)下面的晶片部分。