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    • 4. 发明申请
    • PARAMETRIC PROFILING USING OPTICAL SPECTROSCOPIC SYSTEMS
    • 使用光学光谱系统的参数分析
    • WO03054475A2
    • 2003-07-03
    • PCT/US0241151
    • 2002-12-19
    • KLA TENCOR CORP
    • SHCHEGROV ANDREI VFABRIKANT ANATOLYNIKOONAHAD MEHRDADLEVY ADYWACK DANIEL CBAREKET NOAHMIEHER WALTERDZIURA TED
    • G01N21/21G01N21/47G01N21/95G01N21/956G03F7/20G01B11/06G01B11/24G01B11/30H01L21/66
    • G03F7/70616G01N21/211G01N21/47G01N21/4788G01N21/9501G01N21/956G01N21/95607G01N2021/213G03F7/70625G03F7/70641
    • A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at values of the parameters. Film layers over or under the periodic structure may also be taken into account. Different radiation parameters such as the reflectivities Rs, Rp and ellipsometric parameters may be used in measuring the diffracting structures and the associated films. Some of the radiation parameters may be more sensitive to a change in the parameter value of the profile or of the films then other radiation parameters. One or more radiation parameters that are more sensitive to such changes may be selected in the above-described optimization process to arrive at a more accurate measurement. The above-described techniques may be supplied to a track/stepper and etcher to control the lithographic and etching processes in order to compensate for any errors in the profile parameters.
    • 构建种子轮廓的画廊,并且使用半导体器件的制造工艺知识来选择与轮廓相关联的初始参数值。 也可以使用制造过程知识来选择最佳种子轮廓和最佳初始参数值集合作为优化过程的起始点,由此将与模型预测的轮廓的参数值相关联的数据与测量数据进行比较,以便 达到参数的值。 也可以考虑在周期性结构之上或之下的膜层。 可以使用诸如反射率Rs,Rp和椭偏参数的不同辐射参数来测量衍射结构和相关膜。 一些辐射参数可能对轮廓或膜的参数值的变化对其他辐射参数更敏感。 可以在上述优化过程中选择对这种变化更敏感的一个或多个辐射参数,以获得更准确的测量。 可以将上述技术提供给轨道/步进器和蚀刻器以控制光刻和蚀刻工艺,以便补偿轮廓参数中的任何误差。
    • 8. 发明申请
    • SYSTEMS AND METHODS FOR MITIGATING VARIANCES ON A PATTERNED WAFER USING A PREDICTION MODEL
    • 使用预测模型减少图形波形上的变量的系统和方法
    • WO2006113145A2
    • 2006-10-26
    • PCT/US2006012846
    • 2006-04-07
    • KLA TENCOR TECH CORPWATSON STERLING GLEVY ADYMACK CHRIS ASTOKOWSKI STANLEY ESAIDIN ZAIN K
    • WATSON STERLING GLEVY ADYMACK CHRIS ASTOKOWSKI STANLEY ESAIDIN ZAIN K
    • G06F17/50G03F1/00
    • G03F1/84G03F1/36Y10S430/146
    • Disclosed are systems and methods for mitigating variances (e.g., critical dimension variances) on a patterned wafer are provided. In general, variances of a patterned wafer are predicted using one or more reticle fabrication and/or wafer processing models. The predicted variances are used to modify selected transparent portions of the reticle that is to be used to produce the patterned wafer. In a specific implementation, an optical beam, such as a femto-second laser, is applied to the reticle at a plurality of embedded positions, and the optical beam is configured to form specific volumes of altered optical properties within the transparent material of the reticle at the specified positions. These reticle volumes that are created at specific positions of the reticle result in varying amounts of light transmission or dose through the reticle at such specific positions so as to mitigate the identified variances on a wafer that is patterned using the modified reticle.
    • 公开了用于减轻图案化晶片上的方差(例如,临界尺寸方差)的系统和方法。 通常,使用一个或多个掩模版制造和/或晶片处理模型预测图案化晶片的变化。 预测的方差用于修改用于产生图案化晶片的掩模版的所选透明部分。 在具体实现中,诸如毫微微秒激光器的光束在多个嵌入位置被施加到掩模版,并且光束被配置为在掩模版的透明材料内形成改变的光学特性的特定体积 在指定位置。 在掩模版的特定位置处产生的这些掩模版体积在这样的特定位置处导致通过掩模版的光透射或剂量的变化量,以便减轻使用修改的掩模版图案化的晶片上识别的方差。
    • 10. 发明申请
    • TEST STRUCTURES AND METHODS FOR MONITORING OR CONTROLLING A SEMICONDUCTOR FABRICATION PROCESS
    • 用于监测或控制半导体制造工艺的测试结构和方法
    • WO2006012388A3
    • 2006-12-14
    • PCT/US2005025821
    • 2005-07-22
    • KLA TENCOR TECH CORPMONAHAN KEVINEICHELBERGER BRADLEVY ADY
    • MONAHAN KEVINEICHELBERGER BRADLEVY ADY
    • G03F7/20
    • G03F7/70633G03F7/70625G03F7/70641G03F7/70683H01L22/34H01L2924/0002H01L2924/00
    • Various test structures and methods for monitoring or controlling a semiconductor fabrication process are provided. One test structure formed on a wafer as a monitor for a lithography process includes a bright field target (30) that includes first grating structures (32) . The test structure also includes a dark field target (34) that includes second grating structures (36) . The first and second grating structures have one or more characteristics that are substantially the same as one or more characteristics of device structures formed on the wafer. In addition, the test structure includes a phase shift target (38) having characteristics that are substantially the same as the characteristics of the bright field or dark field target except that grating structures (40) of the phase shift target are shifted in optical phase from the first or second grating structures. One or more characteristics of the targets can be measured and used to determine parameter (s) of the lithography process .
    • 提供了用于监测或控制半导体制造工艺的各种测试结构和方法。 在作为光刻处理的监视器的晶片上形成的一个测试结构包括包括第一光栅结构(32)的明场目标(30)。 测试结构还包括包括第二光栅结构(36)的暗场靶(34)。 第一和第二光栅结构具有与形成在晶片上的器件结构的一个或多个特性基本上相同的一个或多个特性。 此外,测试结构包括具有与亮场或暗场目标的特性基本相同的特性的相移目标(38),除了相移目标物的光栅结构(40)在光学相位 第一或第二光栅结构。 可以测量目标的一个或多个特征并用于确定光刻工艺的参数。