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    • 4. 发明申请
    • MULTI-SPOT SCANNING SYSTEM AND METHOD
    • 多点扫描系统和方法
    • WO2009111407A3
    • 2009-11-26
    • PCT/US2009035749
    • 2009-03-02
    • KLA TENCOR CORPZHAO GUOHENGRUNYON REXVAEZ-IRAVANI MEHDI
    • ZHAO GUOHENGRUNYON REXVAEZ-IRAVANI MEHDI
    • H01L21/66
    • G01N21/9501G01N21/8806G01N2201/10G01N2201/104G02B26/123Y10S359/90
    • A multi-spot scanning technique using a spot array having a predetermined gap between spots can advantageously provide scalability to a large number of spots as well as the elimination of cross-talk between channels. The multi-spot scanning technique can select a number of spots for the spot array (1D or 2D), determine a separation between the spots to minimize crosstalk, and perform a scan on a wafer using the spot array and a full field of view (FOV). Performing the scan includes performing a plurality of scan line cycles, wherein each scan line cycle can fill in gaps left by previous scan line cycles. This 'delay and fill' scan allows large spacing between spots, thereby eliminating cross-talk at the detector plane. In one embodiment, the scan is begun and ended outside a desired scan area on the wafer to ensure full scan coverage.
    • 使用在点之间具有预定间隙的点阵列的多点扫描技术可以有利地为大量点提供可缩放性以及消除信道之间的串扰。 多点扫描技术可以为点阵列(1D或2D)选择多个点,确定点之间的分隔以最小化串扰,并且使用点阵列和全视场在晶片上执行扫描( FOV)。 执行扫描包括执行多个扫描线周期,其中每个扫描线周期可以填充先前扫描线周期留下的间隙。 这种“延迟和填充”扫描允许点之间具有大的间距,从而消除检测器平面处的串扰。 在一个实施例中,扫描在晶片上的期望扫描区域之外开始并结束,以确保全扫描覆盖。
    • 8. 发明申请
    • REFERENCED INSPECTION DEVICE
    • 参考检验设备
    • WO2009151984A3
    • 2010-03-18
    • PCT/US2009045704
    • 2009-05-29
    • KLA TENCOR CORPDOYLE PAULZHAO GUOHENGBELYAEV ALEXANDERRUNYON J REX
    • DOYLE PAULZHAO GUOHENGBELYAEV ALEXANDERRUNYON J REX
    • H01L21/66
    • H01L21/6838
    • A tool for investigating a substrate, where the tool has a tool head for investigating the substrate, a chuck for disposing an upper surface of the substrate in proximity to the tool head, and an air bearing disposed on the tool head adjacent the substrate. The air bearing has a pressure source and a vacuum source, where the vacuum source draws the substrate toward the air bearing and the pressure source prevents the substrate from physically contacting the air bearing. The pressure source and the vacuum source work in cooperation to dispose the upper surface of the substrate at a known distance from the tool head. By using the air bearing as part of the tool in this manner, registration of the substrate to the tool head is accomplished relative to the upper surface of the substrate, not the back side of the substrate.
    • 一种用于调查基板的工具,其中该工具具有用于检查基板的工具头,用于将基板的上表面设置在工具头附近的卡盘以及设置在与基板相邻的工具头上的空气轴承。 空气轴承具有压力源和真空源,其中真空源将基板拉向空气轴承,并且压力源防止基板物理接触空气轴承。 压力源和真空源协同工作,将衬底的上表面设置在与工具头一段已知距离处。 通过以这种方式使用空气轴承作为工具的一部分,基板相对于基板的上表面而不是基板的背面完成对准工具头。
    • 9. 发明申请
    • IN-SITU METALIZATION MONITORING USING EDDY CURRENT MEASUREMENTS AND OPTICAL MEASUREMENTS
    • 使用EDDY电流测量和光学测量的现场金属化监测
    • WO0146684A9
    • 2002-05-23
    • PCT/US0035358
    • 2000-12-22
    • KLA TENCOR CORPLEHMAN KURT RLEE SHING MJOHNSON WALTFIELDEN JOHNZHAO GUOHENGNIKOONAHAD MEHRDAD
    • LEHMAN KURT RLEE SHING MJOHNSON WALTFIELDEN JOHNZHAO GUOHENGNIKOONAHAD MEHRDAD
    • G01B7/06B24B37/013B24B49/10G01B7/00G01B11/06G01N27/72
    • B24B37/013B24B49/105G01N27/72
    • Disclosed is a method of obtaining information in-situ regarding a film of a sample using an eddy probe during a process for removing the film. The eddy probe has at least one sensing coil. An AC voltage is applied to the sensing coil(s) of the eddy probe. One or more first signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate the film of the sample. One or more second signals are measured in the sensing coil(s) of the eddy probe when the sensing coil(s) are positioned proximate to a reference material having a fixed composition and/or distance from the sensing coil. The first signals are calibrated based on the second signals so that undesired gain and/or phase changes within the first signals are corrected. A property value of the film is determined based on the calibrated first signals. An apparatus for performing the above described method is also disclosed. Additionally, a chemical mechanical polishing (CMP) system for polishing a sample with a polishing agent and monitoring the sample is disclosed. The CMP system includes a polishing table, a sample carrier arranged to hold the sample over the polishing table, and an eddy probe.
    • 公开了一种在除去膜的过程中使用涡流探针在原位获取样品的膜的方法。 涡流探头具有至少一个感测线圈。 交流电压被施加到涡流探头的感测线圈上。 当感测线圈靠近样品的膜定位时,在涡流探针的感测线圈中测量一个或多个第一信号。 当感测线圈靠近具有与感测线圈的固定成分和/或距离的参考材料定位时,在涡流探针的感测线圈中测量一个或多个第二信号。 第一信号基于第二信号进行校准,从而校正第一信号内的不期望的增益和/或相位变化。 基于校准的第一信号确定胶片的属性值。 还公开了一种用于执行上述方法的装置。 此外,公开了一种用抛光剂抛光样品并监测样品的化学机械抛光(CMP)系统。 CMP系统包括抛光台,布置成将样品保持在抛光台上的样品载体和涡流探针。