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1. 发明申请

WO2004107374A2 OPENABLE ONE-PIECE ELECTRICAL RF SHIELD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：可开发的一体式电气射频屏蔽及其制造方法
公开(公告)号：WO2004107374A2
公开(公告)日：2004-12-09
申请号：PCT/US2004/016993
申请日：2004-05-28
申请人： INTERPLEX NAS, INC. , SEIDLER, Jack
发明人： SEIDLER, Jack
IPC分类号： H01H
CPC分类号： H05K9/0026
摘要： An easily openable one-piece RF interference shield and method of manufacturing the same is cost efficient and easily adapted for use with existing substantially open bottom region, and a hingeably connected top cover portion, having a top cover latch and disposed along the top edge of one of the sidewalls. The top cover portion of the shield is adapted to hinge toward another one of the sidewalls such that the top cover latch engages a hole disposed on the other sidewall being engaged and completing a protective enclosure about electrical components and preventing those components from causing electromagnetic interferences. The RF shield of the present invention allows for easy opening of the top cover portion to provide access to the enclosure for rework or repair of the electrical components covered by the shield, without having to unsolder the unit from a substrate containing the electrical components. The plurality of sidewalls include a first mating sidewall that is connected to a first intermediate sidewall, the first intermediate sidewall being connected to a second intermediate sidewall, and the second intermediate sidewall being connected to a second mating sidewall.
摘要翻译：易于打开的单件式RF干涉屏蔽及其制造方法具有成本效益并且易于适用于现有的基本上开放的底部区域，以及铰链式连接的顶盖部分，其具有顶盖闩锁并沿着一个侧壁。护罩的顶盖部分适于朝向另一个侧壁铰接，使得顶盖闩锁接合设置在另一个侧壁上的孔，并接合并围绕电气部件完成保护外壳，并防止这些部件引起电磁干扰。本发明的RF屏蔽件允许容易地打开顶盖部分以提供对外壳的通路，以便对由屏蔽件覆盖的电气部件进行返修或修复，而不必将该单元从包含电气部件的基板去除。多个侧壁包括连接到第一中间侧壁的第一配合侧壁，第一中间侧壁连接到第二中间侧壁，第二中间侧壁连接到第二配合侧壁。

2. 发明申请

WO2009086508A1 SOLDER WIRE CONSTRUCTION 审中-公开
标题翻译：焊丝结构
公开(公告)号：WO2009086508A1
公开(公告)日：2009-07-09
申请号：PCT/US2008/088422
申请日：2008-12-29
申请人： INTERPLEX NAS, INC. , SEIDLER, Jack , ZANOLLI, James, R. , CACHINA, Joseph, S.
发明人： SEIDLER, Jack , ZANOLLI, James, R. , CACHINA, Joseph, S.
IPC分类号： B23K31/02 , H01L23/52
CPC分类号： B23K3/087 , B23K2201/38 , H01L2224/48137 , H05K1/142 , H05K3/3405 , H05K3/3478 , H05K3/366 , H05K2201/10287 , H05K2201/10424 , H05K2203/0415 , Y10T29/49144
摘要： A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.
摘要翻译：一种焊接构造载体装置，用于连接包括具有多个隔室的载体的电气部件和设置在多个隔室中的每个隔室中的焊接结构。每个焊料构造包括导电线和邻近导电线设置的焊料组分。

3. 发明申请

WO2005013425A1 ONE-PIECE STAMPED COMPRESSIBLE SPRING PIN 审中-公开
标题翻译：单面压印可压缩弹簧针
公开(公告)号：WO2005013425A1
公开(公告)日：2005-02-10
申请号：PCT/US2004/025034
申请日：2004-07-30
申请人： INTERPLEX NAS, INC. , SEIDLER, Jack
发明人： SEIDLER, Jack
IPC分类号： H01R4/48
CPC分类号： H01R43/16 , H01R13/08
摘要： A one-piece, stamped compressible spring pin is described. The spring pin is formed by stamping a predetermined shape from a single piece of sheet metal. The spring pin comprises outer shells, a central pin, and a base which are all integrally formed. The central pin extends perpendicular from the base and is formed to create a means for imparting spring characteristics to the pin. The outer shells extend from the base and are cup shaped. The outer shells are bent along a line adjacent the base to surround the central pin.
摘要翻译：描述了一体式冲压的可压缩弹簧销。弹簧销通过从单片金属板冲压预定的形状而形成。弹簧销包括外壳，中心销和基座，它们都是整体形成的。中心销从基座垂直延伸并形成以产生用于向销施加弹簧特性的装置。外壳从基座延伸并且是杯形的。外壳沿着与基座相邻的线弯曲以围绕中心销。

4. 发明申请

WO2003061894A1 SOLDER-BEARING COMPONENTS INCLUDING A SOLDER-BEARING ELECTROMAGNETIC SHIELD AND METHOD OF RETAINING A SOLDER MASS THEREIN 审中-公开
标题翻译：包括焊接电磁屏蔽的焊接轴承部件及其保持焊料质量的方法
公开(公告)号：WO2003061894A1
公开(公告)日：2003-07-31
申请号：PCT/US2003/002270
申请日：2003-01-24
申请人： NAS INTERPLEX INDUSTRIES, INC. , SEIDLER, Jack
发明人： SEIDLER, Jack
IPC分类号： B23K9/235
CPC分类号： B23K37/06 , B23K1/0016 , B23K35/0222 , B23K2201/40 , H05K3/341 , H05K3/3426 , H05K9/0022 , H05K2201/10371 , H05K2201/1084 , H05K2201/10984 , H05K2203/0415 , Y02P70/613
摘要： A method of retaining a solder mass within a solder-bearing component is provided and includes the steps of: (a) forming a plurality of fingers in the solder-bearing component at one edge thereof, with each finger being defined by a pair of slots formed in the solder-bearing component; and (b) interleaving a solder mass between the fingers such that the solder mass is securely held by the fingers. The solder-bearing component includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
摘要翻译：提供了一种在焊料支承部件内保持焊料质量的方法，包括以下步骤：（a）在其一个边缘处在焊料支承部件中形成多个指状物，每个手指由一对槽限定形成在焊接轴承部件中; 和（b）在指状物之间插入焊料块，使得焊料质量被手指牢固地保持。焊料支承部件包括任何数量的不同类型的部件，其中由此保持焊料质量，例如引线，端子，连接器，电磁屏蔽等。

5. 发明申请

WO2014107507A3 CONTAINER LID AND VALVE 审中-公开
公开(公告)号：WO2014107507A3
公开(公告)日：2014-07-10
申请号：PCT/US2014/010067
申请日：2014-01-02
申请人： COLONERI, Antonio, F. , SEIDLER, Jack
发明人： COLONERI, Antonio, F. , SEIDLER, Jack
IPC分类号： B65D43/00 , B65D43/10 , B65D43/16
摘要： A lid configured for use with a fluid container is provided. The lid includes a body member including an outer periphery configured to couple to a rim of a fluid container. The body member includes a pair of apertures extending therethrough. A valve operably coupled to the body member includes a pair of protuberances configured to selectively engage the pair of apertures. The pair of protuberances configured such that depression of one protuberances moves the pair of protuberances out of sealed engagement with the pair of apertures for dispensing a fluid contained within the fluid container.

6. 发明申请

WO2010108011A2 PLANAR CONTACT WITH SOLDER 审中-公开
标题翻译：与SOLDER的平面接触
公开(公告)号：WO2010108011A2
公开(公告)日：2010-09-23
申请号：PCT/US2010/027827
申请日：2010-03-18
申请人： 1/2INTERPLEX INDUSTRIES, INC. , SEIDLER, Jack
发明人： SEIDLER, Jack
IPC分类号： H01R33/76 , H01R4/24 , G01R31/26
CPC分类号： H05K3/00 , B23K35/0244 , H01R12/57 , H01R12/707 , H01R43/0235 , H05K3/3426 , H05K3/3478 , H05K3/3489 , H05K2201/0311 , H05K2201/10704 , H05K2201/10795 , H05K2201/1084 , H05K2201/10924 , H05K2201/10984 , H05K2203/0405 , H05K2203/0415 , Y02P70/613 , Y10T29/49147
摘要： A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
摘要翻译：
一种将可回流元件固定在电触点上的方法。该方法包括提供具有多个电触点的条，每个触点包括触点本体和远离触点本体延伸的尾部。接触件的尾部然后设置在细长的可回流焊构件附近。细长的可回流构件被推到多个触点的尾部上。随后，将细长的可回流构件切割成多个单独的可回流元件，每个可回流元件对应于其中一个尾部。与连接到其上的可回流元件的电触点与条分离。

7. 发明申请

WO2003085697A2 SOLDER-BEARING ARTICLES AND METHOD OF RETAINING A SOLDER MASS THEREON 审中-公开
标题翻译：焊接轴承和保持焊接质量的方法
公开(公告)号：WO2003085697A2
公开(公告)日：2003-10-16
申请号：PCT/US2003/010149
申请日：2003-04-01
申请人： NAS INTERPLEX INC. , SEIDLER, Jack , ZHITOMIRSKY, Aleksandr
发明人： SEIDLER, Jack , ZHITOMIRSKY, Aleksandr
IPC分类号： H01L
CPC分类号： B23K3/0607 , B23K3/0638 , B23K2201/40 , H01L2224/1302 , H01L2224/16105 , H01L2224/16155 , H01L2924/0002 , H05K3/3405 , H05K3/341 , H05K3/3426 , H05K2201/10371 , H05K2201/10386 , H05K2201/1084 , H05K2201/10984 , H05K2203/0195 , H05K2203/0405 , Y02P70/613 , H01L2924/00 , H01L2924/00012
摘要： A method of retaining a solder mass to a solder-bearing article is provided and includes the steps of: (a) forming a plurality of openings in the solder-bearing article; (b) disposing a length of solder mass over at least some of the plurality of openings; and forming a plurality of solder rivets along the length of the solder mass. The solder rivets serve to retain the length of solder mass to the solder-bearing article. The solder-bearing article includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
摘要翻译：提供了将焊料块保持在焊料轴承制品上的方法，包括以下步骤：（a）在所述含锡制品中形成多个开口; （b）在所述多个开口中的至少一些开口处设置长度的焊料块; 以及沿焊料块的长度形成多个焊接铆钉。焊接铆钉用于将焊料质量的长度保持在焊接轴承制品上。焊接轴承制品包括任何数量的不同类型的组件，其中保持焊料块，例如引线，端子，连接器，电磁屏蔽等

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