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1. 发明申请

WO2008134501A1 ELECTRICAL CONNECTOR FOR USE IN SOLDERING OPERATIONS 审中-公开
标题翻译：用于焊接操作的电气连接器
公开(公告)号：WO2008134501A1
公开(公告)日：2008-11-06
申请号：PCT/US2008/061555
申请日：2008-04-25
申请人： TEKA INTERCONNECTIONS SYSTEMS, INC. , ZANOLLI, James, R. , CACHINA, Joseph, S.
发明人： ZANOLLI, James, R. , CACHINA, Joseph, S.
IPC分类号： H01R4/02
CPC分类号： B23K1/0016 , B23K2201/38 , B23K2201/40 , H01R4/027 , H01R4/028 , H01R12/52 , H05K3/3442 , H05K3/3478 , H05K3/366 , H05K2201/10424 , Y10S439/951
摘要： An electrical connector for electrically connecting a first electronic circuit to a second electronic circuit includes a housing that includes a plurality of solder retention channels that hold a plurality of solder segments in a vertical orientation such that at least a vertical surface and one end of each solder segment are exposed. The solder retention channels are formed in first and second opposing rows with an open space formed therebetween. The exposed vertical surfaces of the solder segments face one another.
摘要翻译：用于将第一电子电路电连接到第二电子电路的电连接器包括壳体，该壳体包括多个焊接保持通道，其保持垂直取向的多个焊料段，使得每个焊料的至少垂直表面和一端段被暴露。焊料保持通道形成在第一和第二相对的行中，其间形成有开放空间。焊接段的暴露的垂直表面彼此面对。

2. 发明申请

WO2001022785A1 SOLDER-BEARING WAFER FOR USE IN SOLDERING OPERATIONS 审中-公开
标题翻译：用于焊接操作的焊接轴承
公开(公告)号：WO2001022785A1
公开(公告)日：2001-03-29
申请号：PCT/US2000/026160
申请日：2000-09-20
申请人： NAS INTERPLEX INDUSTRIES INC. , CACHINA, Joseph, S. , ZANOLLI, James, R.
发明人： CACHINA, Joseph, S. , ZANOLLI, James, R.
IPC分类号： H05K1/16
CPC分类号： H01R43/0263 , B23K3/08 , H01R43/0235 , H05K3/3405 , H05K3/3447 , H05K3/3478 , H05K2201/09036 , H05K2201/10189 , H05K2201/10378 , H05K2201/10424 , H05K2203/0338 , H05K2203/0415
摘要： A solder-bearing wafer (100) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and a second surface opposing the first surface. The first surface has grooves (115, 117) formed therein and includes lengths of solder (130) disposed within the grooves. Upon heating of the solder and placement of the wafer between the first and second devices, the two devices are connected.
摘要翻译：提供了用于将第一电子设备连接到第二电子设备的焊接轴承晶片（100）。晶片包括具有第一表面和与第一表面相对的第二表面的基底主体。第一表面具有形成在其中的凹槽（115,117），并且包括布置在凹槽内的焊料长度（130）。在加热焊料和将晶片放置在第一和第二器件之间时，两个器件被连接。

3. 发明申请

WO1997016870A1 SOLDER-HOLDING CLIPS FOR APPLYING SOLDER TO CONNECTORS 审中-公开
标题翻译：用于将焊接应用于连接器的焊接夹具
公开(公告)号：WO1997016870A1
公开(公告)日：1997-05-09
申请号：PCT/US1996017704
申请日：1996-11-01
申请人： NORTH AMERICAN SPECIALTIES CORPORATION , CACHINA, Joseph , SEIDLER, Jack , ZANOLLI, James, R.
发明人： NORTH AMERICAN SPECIALTIES CORPORATION
IPC分类号： H01R09/09
CPC分类号： B23K35/0244 , H01R4/024 , H01R43/0235 , H01R43/0256 , H01R43/16 , H05K3/3447 , H05K3/3478 , H05K2201/10189 , H05K2201/10984 , H05K2203/0415 , Y10T29/49149 , Y10T29/49204
摘要： An array and method of forming an array of solder-holding clips (17) is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins (33) of an electrical device, for soldering such pins (33) directly to the conductive pads (41) or internally plated holes (35) of a substrate, or to provide a lead connecting such pins (33) to a substrate.
摘要翻译：提供了形成焊料保持夹（17）阵列的阵列和方法，其适用于通过自动渐进冲压技术制造，并且用于组合应用于电气装置的相应阵列的端子销（33），用于焊接引脚（33）直接连接到衬底的导电焊盘（41）或内部电镀孔（35），或者提供将这种引脚（33）连接到衬底的引线。

4. 发明申请

WO2010105086A1 CONTACT WITH TUBULAR SOLDER MEMBER 审中-公开
标题翻译：与管状焊接员联系
公开(公告)号：WO2010105086A1
公开(公告)日：2010-09-16
申请号：PCT/US2010/027027
申请日：2010-03-11
申请人： INTERPLEX INDUSTRIES, INC. , CACHINA, Joseph, S. , ZANOLLI, James, R.
发明人： CACHINA, Joseph, S. , ZANOLLI, James, R.
IPC分类号： B23K35/14
CPC分类号： B23K35/0244 , H01R12/52 , H01R43/0256
摘要： An electrical connector configured to be electrically connected to a substrate. The electrical connector includes a housing with a plurality of electrical contact terminals disposed on a connection surface thereof. Each electrical contact terminal includes an elongate tail portion extending from the connection surface. The elongate tail portion of each electrical contact terminal is disposed in a central opening of a tubular reflowable element. The tail portion may optionally include a stress or tension relief mechanism. The tubular reflowable element extends beyond a free end of the elongate tail portion away from the connection surface. The electrical contact terminals are configured to be disposed in the vicinity of a corresponding substrate terminal such that the reflowable element of each electrical contact terminal electrically connects the contact terminal to the corresponding substrate terminal.
摘要翻译：一种电连接器，其构造成电连接到基板。电连接器包括具有设置在其连接表面上的多个电接触端子的壳体。每个电接触端子包括从连接表面延伸的细长尾部。每个电接触端子的细长尾部设置在管状可回流元件的中心开口中。尾部可以可选地包括应力或张力释放机构。管状可回流元件延伸超过细长尾部远离连接表面的自由端。电接触端子被配置为设置在相应的基板端子附近，使得每个电接触端子的可回流元件将接触端子电连接到相应的基板端子。

5. 发明申请

WO2009086508A1 SOLDER WIRE CONSTRUCTION 审中-公开
标题翻译：焊丝结构
公开(公告)号：WO2009086508A1
公开(公告)日：2009-07-09
申请号：PCT/US2008/088422
申请日：2008-12-29
申请人： INTERPLEX NAS, INC. , SEIDLER, Jack , ZANOLLI, James, R. , CACHINA, Joseph, S.
发明人： SEIDLER, Jack , ZANOLLI, James, R. , CACHINA, Joseph, S.
IPC分类号： B23K31/02 , H01L23/52
CPC分类号： B23K3/087 , B23K2201/38 , H01L2224/48137 , H05K1/142 , H05K3/3405 , H05K3/3478 , H05K3/366 , H05K2201/10287 , H05K2201/10424 , H05K2203/0415 , Y10T29/49144
摘要： A solder construction carrier device for connecting electrical components including a carrier with a plurality of compartments and a solder construction disposed in each of the plurality of compartments. Each solder construction includes a conductive wire and a solder component disposed adjacent to the conductive wire.
摘要翻译：一种焊接构造载体装置，用于连接包括具有多个隔室的载体的电气部件和设置在多个隔室中的每个隔室中的焊接结构。每个焊料构造包括导电线和邻近导电线设置的焊料组分。

6. 发明申请

WO0122785A9 SOLDER-BEARING WAFER FOR USE IN SOLDERING OPERATIONS 审中-公开
标题翻译：用于焊接操作的焊接轴承
公开(公告)号：WO0122785A9
公开(公告)日：2002-11-28
申请号：PCT/US0026160
申请日：2000-09-20
申请人： NAS INTERPLEX IND INC , CACHINA JOSEPH S , ZANOLLI JAMES R
发明人： CACHINA JOSEPH S , ZANOLLI JAMES R
IPC分类号： B23K3/08 , H01R43/02 , H05K3/34 , H05K1/16
CPC分类号： H01R43/0263 , B23K3/08 , H01R43/0235 , H05K3/3405 , H05K3/3447 , H05K3/3478 , H05K2201/09036 , H05K2201/10189 , H05K2201/10378 , H05K2201/10424 , H05K2203/0338 , H05K2203/0415
摘要： A solder-bearing wafer (100) is provided which is used to connect a first electronic device to a second electronic device. The wafer includes a substrate body having a first surface and a second surface opposing the first surface. The first surface has grooves (115, 117) formed therein and includes lengths of solder (130) disposed within the grooves. Upon heating of the solder and placement of the wafer between the first and second devices, the two devices are connected.
摘要翻译：提供了用于将第一电子设备连接到第二电子设备的焊接轴承晶片（100）。晶片包括具有第一表面和与第一表面相对的第二表面的基底主体。第一表面具有形成在其中的凹槽（115,117），并且包括布置在凹槽内的焊料长度（130）。在加热焊料和将晶片放置在第一和第二器件之间时，两个器件被连接。

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