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    • 2. 发明申请
    • SILICON-BASED MEMRISTIVE DEVICE
    • 基于硅的力学装置
    • WO2010082928A1
    • 2010-07-22
    • PCT/US2009/031140
    • 2009-01-15
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.PICKETT, Matthew D.STEWART, Duncan
    • PICKETT, Matthew D.STEWART, Duncan
    • H01L27/115H01L21/8247H01L21/265
    • H01L27/101G11C13/00G11C13/0069G11C2013/009G11C2213/33G11C2213/77H01L27/2463H01L45/085H01L45/1206H01L45/1233H01L45/148
    • A memristive device (100) includes a first and a second electrode (110, 115); a silicon memristive matrix (105) interposed between the first electrode (110) and the second electrode (115); and a mobile dopant species (210, 215) within the silicon memristive matrix (105) which moves in response to a programming electrical field and remains substantially in place after the removal of the programming electrical field. A method for using a crossbar architecture (610) containing a silicon memristive matrix (105) includes: applying a programming electrical field by applying a voltage bias across a first conductor (602) and a second conductor (604); a silicon memristive matrix (105, 606) containing mobile dopants (210, 215) being interposed between the first conductor (602) and the second conductor (604), the programming voltage repositioning the mobile dopants (210, 215) within the silicon memristive matrix (105, 606); and reading a state of the silicon memristive matrix (105, 606) by applying a reading energy across the silicon memristive matrix (105, 606), the reading energy producing a measurable indication of the state of the silicon memristive matrix (105, 606).
    • 忆阻器(100)包括第一和第二电极(110,115); 插入在所述第一电极(110)和所述第二电极(115)之间的硅忆阻矩阵(105); 以及在所述硅忆阻矩阵(105)内的移动掺杂剂物质(210,215),其响应于编程电场而移动并且在去除所述编程电场之后保持基本上就位。 一种使用包含硅忆阻矩阵(105)的交叉结构(610)的方法包括:通过跨第一导体(602)和第二导体(604)施加电压偏置来施加编程电场; 包含位于第一导体(602)和第二导体(604)之间的移动掺杂剂(210,215)的硅忆阻矩阵(105,606),所述编程电压重新定位硅忆阻器内的移动掺杂剂(210,215) 矩阵(105,606); 以及通过在所述硅忆阻矩阵(105,606)上施加读取能量来读取所述硅忆阻矩阵(105,606)的状态,所述读取能量产生所述硅忆阻矩阵(105,606)的状态的可测量指示, 。
    • 5. 发明申请
    • CAPACITIVELY COUPLING LAYERS OF A MULTILAYER DEVICE
    • 多层设备的电容耦合层
    • WO2008088720A1
    • 2008-07-24
    • PCT/US2008/000367
    • 2008-01-10
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.KAMINS, Theodore, I.STEWART, DuncanQUITORIANO, Nathaniel, J.
    • KAMINS, Theodore, I.STEWART, DuncanQUITORIANO, Nathaniel, J.
    • H05K3/46
    • H01L31/02002G02B6/43H01L2924/0002H01L2924/00
    • A multilayer device (100, 200, 300, 400, 500) includes an electronic device layer (104, 204, 304, 404, 504) a first electrode (110, 210, 410, 510) associated witht electronic layer (104, 204, 304, 404, 504), an optical layer (108, 208, 308, 408, 508), a second electrode (112, 212, 412, 512) associated with the optical layer (108, 208, 308, 408, 508), and an insulator layer (106, 206, 306, 406, 506) provided between the first and second electrodes. The first and second electrodes are capacitively coupled to each other to faciliate electrical communication between the electronic device layer (104, 204, 304, 404, 504) and the optical layer (108, 208, 308, 408, 508) through transmission of an electrical signal between the first and second electrodes. The electrical signal may be transmiited through the insulator layer (106, 206, 306, 406, 506). In additional, the electronic device layer (104, 204, 304, 404, 504 and the optical layer (108, 208, 308, 408, 508) may be in electrical communication with each other through capacitive coupling of the first electrode (110, 210, 410, 510) and the second electrode (112, 212, 412, 512).
    • 多层器件(100,200,300,400,500)包括与电子层(104,204)相关联的第一电极(110,210,410,510)的电子器件层(104,204,304,404,504) ,304,404,504),光学层(108,208,308,408,508),与所述光学层(108,208,308,408,508)508相关联的第二电极(112,212,412,512) )和设置在第一和第二电极之间的绝缘体层(106,206,306,406,506)。 第一和第二电极彼此电容耦合以通过传输电子装置层(104,204,304,504)和光学层(108,208,308,408,508)之间的电通信来促进电子设备层 第一和第二电极之间的电信号。 电信号可以透过绝缘体层(106,206,306,406,506)传输。 另外,电子器件层(104,204,304,404,504)和光学层(108,208,308,408,508)可以通过第一电极(110,104)的电容耦合而彼此电连通, 210,410,510)和所述第二电极(112,212,412,512)。
    • 7. 发明申请
    • ACTIVE INTERCONNECTS AND CONTROL POINTS IN INTEGRATED CIRCUITS
    • 集成电路中的主动互连和控制点
    • WO2006115968A2
    • 2006-11-02
    • PCT/US2006/014856
    • 2006-04-19
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.WILLIAMS, R., StanleyKUEKES, Phillip, J.PERNER, Frederick, A.SNIDER, Gregory, S.STEWART, Duncan
    • WILLIAMS, R., StanleyKUEKES, Phillip, J.PERNER, Frederick, A.SNIDER, Gregory, S.STEWART, Duncan
    • H01L21/66
    • H05K7/1092H01L23/5228H01L2924/0002H01L2924/00
    • In various embodiments of the present invention, tunable resistors (1102) are introduced at the interconnect layer of the integrated circuits (102) in order to provide a means for adjusting internal voltage and/or current levels within the integrated circuit to repair defective components or to configure the integrated circuit following manufacture. For example, when certain internal components, such as transistors, do not have specified electronics characteristics due to manufacturing defects, adjustment of the variable resistances of the tunable resistors (1102) included in the interconnect layer of integrated circuits according to embodiments of the present invention can be used to adjust internal voltage and/or levels in order to ameliorate the defective components. In other cases, the tunable resistors may be used as switches to configure integrated circuit components, including individual transistors and logic gates as well as larger, hierarchically structured functional modules and domains. In some cases, components and modules may be turned off, while, in other cases, components and modules may be turned on.
    • 在本发明的各种实施例中,可调谐电阻器(1102)被引入集成电路(102)的互连层,以便提供用于调整集成电路内的内部电压和/或电流水平以修复有缺陷的部件或 配置后续制造的集成电路。 例如,当诸如晶体管的某些内部部件由于制造缺陷而没有指定的电子特性时,根据本发明的实施例调整包括在集成电路的互连层中的可调电阻器(1102)的可变电阻 可以用于调整内部电压和/或电平,以改善有缺陷的部件。 在其他情况下,可调谐电阻器可以用作开关来配置集成电路组件,包括单独的晶体管和逻辑门以及更大的分层结构的功能模块和域。 在某些情况下,可能会关闭组件和模块,而在其他情况下,可能会打开组件和模块。