会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • MOS-GATED POWER DEVICE HAVING SEGMENTED TRENCH AND EXTENDED DOPING ZONE AND PROCESS FOR FORMING SAME
    • 具有分段式铁路和扩展区域的MOS选通电力装置及其形成方法
    • WO0237569A9
    • 2002-12-05
    • PCT/US0131840
    • 2001-10-11
    • FAIRCHILD SEMICONDUCTOR
    • KOCON CHRISTOPHER BGREBS THOMAS ECUMBO JOSEPH LRIDLEY RODNEY S
    • H01L29/749H01L21/331H01L21/336H01L29/06H01L29/10H01L29/423H01L29/739H01L29/78H01L29/00
    • H01L29/66348H01L29/0619H01L29/0634H01L29/0653H01L29/1095H01L29/42368H01L29/7397H01L29/749H01L29/7813H01L2924/0002H01L2924/00
    • A trench MOS-gated device comprises a doped monocrystalline semiconductor substrate that includes an upper layer and is of a first conduction type. An extended trench in the substrate in the upper layer comprises two segments having differing widths relative to one another: a bottom segment of lesser width filled with a dielectric material, and an upper segment of greater width lined with a dielectric material and substantially filled with a conductive material, the filled upper segment of the trench forming a gate region. An extended doped zone of a second opposite conduction type extends from an upper surface into the upper layer of the substrate only on one side of the trench, and a doped well region of the second conduction type overlying a drain zone of the first conduction type is disposed in the upper layer on the opposite side of the trench. The drain zone is substantially insulated from the extended zone by the dielectric-filled bottom segment of the trench. A heavily doped source region of the first conduction type and a heavily doped body region of the second conduction type is disposed at the upper surface of the well region only on the side of said trench opposite doped extended zone. An interlevel dielectric layer is disposed on the upper surface overlying the gate and source regions, and a metal layer disposed on the upper surface of the upper layer and the interlevel dielectric layer is in electrical contact with the source and body regions and the extended zone. A process for constructing a trench MOS-gated device comprises: forming in a semiconductor substrate an extended trench that comprises an upper segment and a bottom segment, wherein the bottom segment has a lesser width relative to a greater width of the trench upper segment and extends to a depth corresponding to the total depth of the extended trench. The bottom segment of the trench is substantially filled with dielectric material. The trench upper segment has a floor and sidewalls comprising dielectric material and is substantially filled with a conductive material to form a gate region. A heavily doped source region of the first conduction type and a heavily doped body region of the second conduction type are formed in a surface well region on the side of the extended trench opposite an extended doped zone.
    • 沟槽MOS门控器件包括掺杂的单晶半导体衬底,其包括上层并且是第一导电类型。 在上层中的衬底中的延伸沟槽包括相对于彼此具有不同宽度的两个区段:填充有介电材料的较小宽度的底部区段和宽度较大的上部区段,其内衬有电介质材料并基本上填充有 导电材料,填充的沟槽的上部段形成栅极区域。 第二相对导电类型的扩展掺杂区仅在沟槽的一侧从上表面延伸到衬底的上层,并且覆盖第一导电类型的漏极区的第二导电类型的掺杂阱区是 设置在沟槽相对侧的上层中。 漏极区域通过沟槽的电介质填充的底部区段与延伸区域基本绝缘。 第一导电类型的重掺杂源极区域和第二导电类型的重掺杂体区域仅在阱区域相对的掺杂延伸区域的侧面上设置在阱区域的上表面。 层叠电介质层设置在覆盖栅极和源极区域的上表面上,并且设置在上层的上表面上的金属层和层间电介质层与源区和主体区域以及延伸区域电接触。 用于构造沟槽MOS门控器件的工艺包括:在半导体衬底中形成包括上部段和底部段的延伸沟槽,其中底部区段相对于沟槽上段的较大宽度具有较小的宽度,并且延伸 达到对应于延伸沟槽的总深度的深度。 沟槽的底部段基本上被介电材料填充。 沟槽上段具有包括电介质材料的底板和侧壁,并且基本上填充有导电材料以形成栅极区域。 第一导电类型的重掺杂源极区域和第二导电类型的重掺杂体区域形成在与延伸掺杂区域相对的延伸沟槽侧的表面阱区域中。
    • 4. 发明申请
    • MOS-GATED POWER DEVICE WITH DOPED POLYSILICON BODY AND PROCESS FOR FORMING SAME
    • 具有掺杂多晶硅体的MOS栅极电源装置及其形成方法
    • WO02058159A3
    • 2003-08-28
    • PCT/US0144374
    • 2001-11-28
    • FAIRCHILD SEMICONDUCTOR
    • KOCON CHRISTOPHER BRIDLEY RODNEY SGREBS THOMAS E
    • H01L21/336H01L29/04H01L29/10H01L29/739H01L29/78
    • H01L29/7816H01L29/04H01L29/1095H01L29/7395H01L29/7801H01L29/7813Y10S438/914
    • An improved MOS-gated power device on a substrate having an upper layer, said substrate comprising in said upper layer doped monocrystalline silicon of a first conduction type and including a doped well region of a second conduction type, said substrate further comprising at least one heavily doped source region of said first conduction type disposed in said well region at an upper surface of said upper layer, a gate region comprising a conductive material electrically insulated from said source region by a dielectric material, a patterned interlevel dielectric layer on said upper surface overlying said gate amd source regions, and a heavily doped drain region of sqaid first conduction type; wherein the improvement comprises: At least one body region of said second conduction type disposed in said well region at said upper surface of said substrate, said body region comprising heavily doped polysilicon.
    • 一种在具有上层的衬底上的改进的MOS门控功率器件,所述衬底包括在第一导电类型的所述上层掺杂单晶硅中,并且包括第二导电类型的掺杂阱区,所述衬底还包括至少一个大的 在所述上层的上表面处设置在所述阱区中的所述第一导电类型的掺杂源极区,包括通过电介质材料与所述源极区域电绝缘的导电材料的栅极区域,所述上表面上的图案化层间电介质层 所述栅极源极区和均匀第一导电类型的重掺杂漏极区; 其中所述改进包括:所述第二导电类型的至少一个体区设置在所述衬底的所述上表面处的所述阱区中,所述体区包括重掺杂多晶硅。
    • 8. 发明申请
    • MOS-GATED POWER DEVICE WITH DOPED POLYSILICON BODY AND PROCESS FOR FORMING SAME
    • 具有掺杂多晶硅体的MOS栅极电源装置及其形成方法
    • WO02058159A9
    • 2003-04-17
    • PCT/US0144374
    • 2001-11-28
    • FAIRCHILD SEMICONDUCTOR
    • KOCON CHRISTOPHER BRIDLEY RODNEY SGREBS THOMAS E
    • H01L21/336H01L29/04H01L29/10H01L29/739H01L29/78
    • H01L29/7816H01L29/04H01L29/1095H01L29/7395H01L29/7801H01L29/7813Y10S438/914
    • An improved MOS-gated power device comprises a substrate having an upper layer of doped monocrystalline silicon of a first conduction type that includes a doped well region of a second conduction type. The substrate further comprises at least one heavily doped source region of the first conduction type disposed in the well region at an upper surface of the upper layer, a gate region comprising a conductive material electrically insulated from the source region by a dielectric material, a patterned interlevel dielectric layer on the upper surface overlying the gate and source regions, and a heavily doped drain region of the first conduction type. The improvement comprises: body regions comprising heavily doped polysilicon of the second conduction type disposed in the well region at the upper surface of the monocrystalline silicon substrate. A process for forming an improved MOS-gated power device comprises: providing a substrate having an upper layer of doped monocrystalline silicon of a first conduction type that includes a doped well region of a second conduction type. The substrate further comprises a heavily doped source regions of the first conduction type disposed in the well region at an upper surface of the upper layer, a gate region comprising a conductive material electrically insulated from the source region by a dielectric material, heavily doped drain region of the first conduction type, a patterned interlevel dielectric layer on the upper surface overlying the gate and source regions. The process further comprises: forming a body mask on the substrate, and selectively removing portions of the source region and underlying well region remotely disposed from the gate region, thereby forming at least one body hollow in the substrate; removing the body mask, and forming a blanket layer of heavily doped polysilicon of the the second conduction type that overlies the substrate and interlevel dielectric layer aned fills the body hollow; selectively removing portions of the polysilicon blanket layer from the source region and interlevel dielectric layer, leaving heavily doped polysilicon filling the body hollow and thereby forming a body region; depositing over the upper surface and interlevel dielectric layer a source metal in electrical contact with the source and body regions; and forming a drain metal layer in contact with the drain region in the substrate.
    • 改进的MOS门控功率器件包括具有第一导电类型的掺杂单晶硅的上层的衬底,其包括第二导电类型的掺杂阱区。 衬底还包括设置在上层的上表面的阱区中的第一导电类型的至少一个重掺杂源极区,包括通过电介质材料与源极区域电绝缘的导电材料的栅极区域,图案化 覆盖栅极和源极区域的上表面上的层间电介质层,以及第一导电类型的重掺杂漏极区域。 该改进包括:设置在单晶硅衬底的上表面的阱区中的包括第二导电类型的重掺杂多晶硅的主体区域。 用于形成改进的MOS门控功率器件的工艺包括:提供具有第一导电类型的掺杂单晶硅上层的衬底,该第一导电类型的上层包括第二导电类型的掺杂阱区。 衬底还包括设置在上层的上表面处的阱区中的第一导电类型的重掺杂源极区,包括通过电介质材料与源极区域电绝缘的导电材料的栅区,重掺杂漏极区 的第一导电类型,在覆盖栅极和源极区域的上表面上的图案化层间电介质层。 所述方法还包括:在所述基底上形成人体掩模,并且选择性地去除所述源极区域和从所述栅极区域远离设置的下部阱区域的部分,从而在所述基底中形成至少一个主体中空部分; 去除身体掩模,以及形成覆盖在衬底上的第二导电类型的重掺杂多晶硅的覆盖层,并且层叠介电层填充主体空心; 选择性地从源极区和层间电介质层去除多晶硅覆盖层的部分,留下重掺杂的多晶硅,将体中空填充,从而形成体区; 在上表面和层间介质层上沉积与源极和体区电接触的源极金属; 以及形成与衬底中的漏极区域接触的漏极金属层。