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1. 发明申请

WO2008005392A3 RESERVOIR FOR LIQUID COOLING SYSTEMS USED TO PROVIDE MAKE-UP FLUID AND TRAP GAS BUBBLES 审中-公开
标题翻译：液体冷却系统用于提供加油液和气体气体的储存器
公开(公告)号：WO2008005392A3
公开(公告)日：2008-12-04
申请号：PCT/US2007015250
申请日：2007-06-28
申请人： COOLIGY INC , LANDRY FREDRIC , CONWAY BRUCE R , BREWER RICHARD GRANT , CHOW NORMAN , ZHOU PENG , LIN ERIC
发明人： LANDRY FREDRIC , CONWAY BRUCE R , BREWER RICHARD GRANT , CHOW NORMAN , ZHOU PENG , LIN ERIC
IPC分类号： H05K7/20
CPC分类号： H05K7/20272 , F28D15/00 , G06F1/20 , G06F2200/201
摘要： A fluid compensation apparatus is configured to provide replacement fluid to a fluid-based cooling loop, while removing dissolved gas or gas in gross bubbles from the cooling loop. Removal or reduction of gas from the cooling loop reduces or prevents pump vapor lock. The removed gas is retained within the fluid compensation apparatus. The fluid compensation apparatus is configured to prevent the trapped gas from being re-introduced to the fluid-based cooling loop, regardless of the orientation of the fluid compensation apparatus. Additionally, the fluid compensation apparatus is configured to remove gas from and add fluid to the cooling loop with limited or no pressure drop between the inlet port and the outlet port of the fluid compensation apparatus. As a result, the pump does not require additional power to compensate for such a pressure differential.
摘要翻译：液体补偿装置被配置为向基于流体的冷却回路提供更换流体，同时从冷却回路中除去大气泡中的溶解气体或气体。从冷却回路中去除或还原气体会降低或防止泵蒸气锁定。去除的气体保留在流体补偿装置内。流体补偿装置被配置为防止被捕获的气体被重新引入基于流体的冷却回路，而与流体补偿装置的取向无关。此外，流体补偿装置构造成在流体补偿装置的入口和出口之间有限或没有压力降，从而从中除去气体并向流体补充流体。因此，泵不需要额外的功率来补偿这种压力差。

2. 发明申请

WO2007130557A3 METHODOLOGY FOR THE LIQUID COOLING OF HEAT GENERATING COMPONENTS MOUNTED ON A DAUGHTER CARD/EXPANSION CARD IN A PERSONAL COMPUTER THROUGH THE USE OF A REMOTE DRIVE BAY HEAT EXCHANGER WITH A FLEXIBLE FLUID INTERCONNECT 审中-公开
标题翻译：通过使用带有灵活流体互连的远程驱动槽热交换器，在个人计算机上的热量卡/扩展卡上安装的热发生部件的液体冷却方法
公开(公告)号：WO2007130557A3
公开(公告)日：2008-11-20
申请号：PCT/US2007010807
申请日：2007-05-04
申请人： COOLIGY INC , CONWAY BRUCE , BREWER RICHARD GRANT , TSAO PAUL , HOM JAMES , WERNER DOUGLAS E , ZHOU PENG , UPADHYA GIRISH , DATTA MADHAV , FIROUZI ALI , LANDRY FREDRIC
发明人： CONWAY BRUCE , BREWER RICHARD GRANT , TSAO PAUL , HOM JAMES , WERNER DOUGLAS E , ZHOU PENG , UPADHYA GIRISH , DATTA MADHAV , FIROUZI ALI , LANDRY FREDRIC
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

3. 发明申请

WO2007089865A2 A RE-WORKABLE METALLIC TIM FOR EFFICIENT HEAT EXCHANGE 审中-公开
标题翻译：有效热交换器的可重用金属时刻
公开(公告)号：WO2007089865A2
公开(公告)日：2007-08-09
申请号：PCT/US2007002689
申请日：2007-01-30
申请人： COOLIGY INC , MADHAV DATTA , ZHOU PENG , HOME JAMES , MUNCH MARK , MCMASTER MARK
发明人： MADHAV DATTA , ZHOU PENG , HOME JAMES , MUNCH MARK , MCMASTER MARK
IPC分类号： H05K7/20
CPC分类号： H01L23/3736 , H01L23/3735 , H01L23/473 , H01L2224/73253
摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TlM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also resuable.
摘要翻译：热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。热源优选为耦合到电路板的集成电路。金属TIM优选包含铟。金属TIM由单独的金属TIM箔或金属材料的沉积层组成。金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。一旦分解，热交换器和金属TIM箔可以再次使用。如果将金属TlM沉积在热交换器上，则拆卸产生也可再生的热交换子组件。

4. 发明申请

WO2004070304A2 REMOVEABLE HEAT SPREADER SUPPORT MECHANISM AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：可拆卸散热器支撑机构及其制造方法
公开(公告)号：WO2004070304A2
公开(公告)日：2004-08-19
申请号：PCT/US2004001044
申请日：2004-01-14
申请人： COOLIGY INC , UPADHYA GIRISH , MUNCH MARK , ZHOU PENG , GOODSON KENNETH , KENNY THOMAS W JR
发明人： UPADHYA GIRISH , MUNCH MARK , ZHOU PENG , GOODSON KENNETH , KENNY THOMAS W JR
IPC分类号： F28F20060101 , F28F7/00 , H05K7/20 , F28F
CPC分类号： H01L23/36 , H01L23/10 , H01L2924/0002 , H01L2924/00
摘要： A mounting assembly comprises a rigid support bracket configured to substantially surround a heat source. The rigid support bracket is coupled to a circuit board. The mounting assembly also comprises a removable lid that is coupled to the rigid support bracket and configured to provide selective access to the heat source. The mounting assembly further comprises a heat exchanger coupled to the heat source, wherein the heat exchanger is positioned between the heat source and the removable lid. The removable lid is preferably configured and has a desired stiffness to urge the heat exchanger in contact by a substantially constant force with the heat source and prevents unwanted movement of the heat source. Further, the support bracket structure is configured to transfer the substantially constant force over a relatively large surface area on the circuit board thereby protecting the heat source from bending, breaking or collapsing from the substantially constant force. The removable lid is preferably made of a material, including but not limited to copper, which accommodates a desired amount of heat transfer from an area within the support bracket.
摘要翻译：安装组件包括构造成基本上围绕热源的刚性支撑支架。刚性支撑托架连接到电路板。安装组件还包括可拆卸盖，其被连接到刚性支撑托架并且构造成提供对热源的选择性接近。安装组件还包括耦合到热源的热交换器，其中热交换器位于热源和可移除盖之间。可移动盖优选地构造并且具有期望的刚度，以通过与热源的基本上恒定的力来促使热交换器接触，并且防止热源的不期望的移动。此外，支撑托架结构构造成在电路板上相对较大的表面积上传递基本上恒定的力，从而保护热源免受基本恒定的力的弯曲，破坏或塌陷。可移除盖优选地由包括但不限于铜的材料制成，其适应从支撑托架内的区域的期望量的热传递。

5. 发明申请

WO2007120530A3 INTEGRATED LIQUID TO AIR CONDUCTION MODULE 审中-公开
标题翻译：集成液体到空气导流模块
公开(公告)号：WO2007120530A3
公开(公告)日：2008-08-21
申请号：PCT/US2007008190
申请日：2007-03-30
申请人： COOLIGY INC , HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
发明人： HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
IPC分类号： F28F27/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。

6. 发明申请

WO2005122661A2 APPARATUS AND METHOD OF EFFICIENT FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效流体输送装置和方法
公开(公告)号：WO2005122661A2
公开(公告)日：2005-12-22
申请号：PCT/US2005016680
申请日：2005-05-12
申请人： COOLIGY INC , BREWER RICHARD G , UPADHYA GINSH , ZHOU PENG , MCMASTER MARK , TSAO PAUL
发明人： BREWER RICHARD G , UPADHYA GINSH , ZHOU PENG , MCMASTER MARK , TSAO PAUL
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.
摘要翻译：热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。热交换器包括热量从热源传递到流体的界面层。歧管层耦合到界面层。歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。上层可以包括多个突出特征和多孔结构中的至少一个。优选地，多孔结构沿着界面层设置。

7. 发明申请

WO2006074353A3 HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICROHEAT EXCHANGERS 审中-公开
标题翻译：高表面积比例结构及其在MICROHEAT交换器中的集成
公开(公告)号：WO2006074353A3
公开(公告)日：2007-10-18
申请号：PCT/US2006000434
申请日：2006-01-06
申请人： COOLIGY INC , DATTA MADHAV , MCMASTER MARK , BREWER RICK , ZHOU PENG , TSAO PAUL , UPADHAYA GIRISH , MUNCH MARK
发明人： DATTA MADHAV , MCMASTER MARK , BREWER RICK , ZHOU PENG , TSAO PAUL , UPADHAYA GIRISH , MUNCH MARK
IPC分类号： F28F3/14 , B21D39/06 , B21D53/00 , B23P15/26
CPC分类号： F28F7/02 , F28F3/086 , F28F2260/02
摘要： An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
摘要翻译：公开了一种制造用于热交换器的微结构的结构和方法。热交换器包括歧管层和微结构区域。歧管层包括将流体输送到微结构化区域的结构。微结构区域由多个由热导层形成的窗口层形成，多个微孔通过该导热层通过湿蚀刻工艺形成。然后将多个窗口层耦合在一起以形成复合微结构。

8. 发明申请

WO2007064404A2 MICROFLUIDIC PUMP AND VALVE STRUCTURES AND FABRICATION METHODS 审中-公开
标题翻译：微流体泵和阀结构与制造方法
公开(公告)号：WO2007064404A2
公开(公告)日：2007-06-07
申请号：PCT/US2006039135
申请日：2006-10-03
申请人： KIONIX CORP , YOUNG LICOLN , ZHOU PENG
发明人： YOUNG LICOLN , ZHOU PENG
IPC分类号： B01L3/00 , B32B27/00 , F04B43/04 , F04B53/10
CPC分类号： F16K7/12 , B01F5/0683 , B01F5/0688 , B01F11/0071 , B01F13/0059 , B01F2215/0034 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2200/12 , B01L2300/0816 , B01L2300/0861 , B01L2300/0867 , B01L2300/0887 , B01L2400/0481 , B01L2400/0487 , B01L2400/06 , B01L2400/0638 , B01L2400/0655 , B01L2400/084 , B29C65/4895 , B29C66/004 , B29C66/54 , B29C66/5412 , B29C66/71 , B29K2025/00 , B29K2025/04 , B29K2033/08 , B29K2069/00 , B29K2101/12 , B29L2031/7496 , B29L2031/7506 , B29L2031/756 , B81B3/0021 , B81B2201/036 , B81B2201/054 , B81B2203/0127 , B81C1/00103 , B81C1/00158 , F04B43/028 , F04B43/043 , F04B43/06 , F15C1/08 , F16K99/0001 , F16K99/0015 , F16K99/0021 , F16K99/0034 , F16K99/0055 , F16K99/0057 , F16K99/0059 , F16K2099/0074 , F16K2099/0076 , F16K2099/0078 , F16K2099/008 , F16K2099/0084 , F16K2099/0094 , Y10T29/49405 , Y10T137/212 , Y10T137/2202 , Y10T137/2218 , Y10T137/8593 , Y10T137/85978 , Y10T156/1002 , Y10T156/1043 , B29K2033/12 , B29K2025/06
摘要： Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.
摘要翻译：塑料微流体结构具有基本上刚性的膜片，其在松弛状态之间起作用，其中隔膜抵靠衬底的表面，以及致动状态，其中隔膜移动离开衬底。从以下描述可以看出，用这种隔膜形成的微流体结构提供易于制造和坚固的系统，以及易于制造的部件，例如阀和泵。

9. 发明申请

WO2012115926A3 MICROFLUIDIC DEVICE-BASED NUCLEIC ACID PURIFICATION METHOD 审中-公开
标题翻译：基于微流体装置的核酸净化方法
公开(公告)号：WO2012115926A3
公开(公告)日：2013-03-21
申请号：PCT/US2012025861
申请日：2012-02-21
申请人： RHEONIX INC , YOUNG LINCOLN C , ZHOU PENG , SPIZZ GWENDOLYN , YASMIN RUBINA
发明人： YOUNG LINCOLN C , ZHOU PENG , SPIZZ GWENDOLYN , YASMIN RUBINA
IPC分类号： C12N15/10 , C12Q1/68
CPC分类号： C12N15/1013 , C12Q1/6806
摘要： A method is provided for purifying nucleic acid from a sample in a microfluidic device. The method can be used to purify nucleic acids from any source known in the art that comprises nucleic acids, such as prokaryotic or eukaryotic organisms, viruses, cell, tissues, organs, etc. In a specific example, the tissue is whole blood. The method for purifying nucleic acid may run fully automated in the microfluidic device.
摘要翻译：提供了一种用于从微流体装置中的样品中纯化核酸的方法。该方法可用于从本领域已知的任何来源纯化核酸，其包含核酸，例如原核或真核生物，病毒，细胞，组织，器官等。在具体实例中，组织是全血。纯化核酸的方法可以在微流体装置中完全自动化。

10. 发明申请

WO2007064404A8 MICROFLUIDIC MEMBRANE PUMP AND VALVE 审中-公开
标题翻译：微流体膜泵和阀
公开(公告)号：WO2007064404A8
公开(公告)日：2008-04-24
申请号：PCT/US2006039135
申请日：2006-10-03
申请人： KIONIX INC , YOUNG LINCOLN , ZHOU PENG
发明人： YOUNG LINCOLN , ZHOU PENG
IPC分类号： B01L3/00 , B32B27/00 , F04B43/04 , F04B53/10
CPC分类号： F16K7/12 , B01F5/0683 , B01F5/0688 , B01F11/0071 , B01F13/0059 , B01F2215/0034 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L2200/12 , B01L2300/0816 , B01L2300/0861 , B01L2300/0867 , B01L2300/0887 , B01L2400/0481 , B01L2400/0487 , B01L2400/06 , B01L2400/0638 , B01L2400/0655 , B01L2400/084 , B29C65/4895 , B29C66/004 , B29C66/54 , B29C66/5412 , B29C66/71 , B29K2025/00 , B29K2025/04 , B29K2033/08 , B29K2069/00 , B29K2101/12 , B29L2031/7496 , B29L2031/7506 , B29L2031/756 , B81B3/0021 , B81B2201/036 , B81B2201/054 , B81B2203/0127 , B81C1/00103 , B81C1/00158 , F04B43/028 , F04B43/043 , F04B43/06 , F15C1/08 , F16K99/0001 , F16K99/0015 , F16K99/0021 , F16K99/0034 , F16K99/0055 , F16K99/0057 , F16K99/0059 , F16K2099/0074 , F16K2099/0076 , F16K2099/0078 , F16K2099/008 , F16K2099/0084 , F16K2099/0094 , Y10T29/49405 , Y10T137/212 , Y10T137/2202 , Y10T137/2218 , Y10T137/8593 , Y10T137/85978 , Y10T156/1002 , Y10T156/1043 , B29K2033/12 , B29K2025/06
摘要： Plastic microfluidic structures having a substantially rigid diaphragm that actuates between a relaxed state wherein the diaphragm sits against the surface of a substrate and an actuated state wherein the diaphragm is moved away from the substrate. As will be seen from the following description, the microfluidic structures formed with this diaphragm provide easy to manufacture and robust systems, as well readily made components such as valves and pumps.
摘要翻译：塑料微流体结构具有基本上刚性的膜片，其在松弛状态之间起作用，其中隔膜抵靠衬底的表面，以及致动状态，其中隔膜移动离开衬底。从以下描述可以看出，用这种隔膜形成的微流体结构提供易于制造和坚固的系统，以及易于制造的部件，例如阀和泵。

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