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1. 发明申请

WO2007130557A3 METHODOLOGY FOR THE LIQUID COOLING OF HEAT GENERATING COMPONENTS MOUNTED ON A DAUGHTER CARD/EXPANSION CARD IN A PERSONAL COMPUTER THROUGH THE USE OF A REMOTE DRIVE BAY HEAT EXCHANGER WITH A FLEXIBLE FLUID INTERCONNECT 审中-公开
标题翻译：通过使用带有灵活流体互连的远程驱动槽热交换器，在个人计算机上的热量卡/扩展卡上安装的热发生部件的液体冷却方法
公开(公告)号：WO2007130557A3
公开(公告)日：2008-11-20
申请号：PCT/US2007010807
申请日：2007-05-04
申请人： COOLIGY INC , CONWAY BRUCE , BREWER RICHARD GRANT , TSAO PAUL , HOM JAMES , WERNER DOUGLAS E , ZHOU PENG , UPADHYA GIRISH , DATTA MADHAV , FIROUZI ALI , LANDRY FREDRIC
发明人： CONWAY BRUCE , BREWER RICHARD GRANT , TSAO PAUL , HOM JAMES , WERNER DOUGLAS E , ZHOU PENG , UPADHYA GIRISH , DATTA MADHAV , FIROUZI ALI , LANDRY FREDRIC
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H01L2924/0002 , H01L2924/00
摘要： A cooling system includes a cooling unit configured to fit within a single drive bay of a personal computer. The cooling unit includes a fluid-to-air heat exchanger, an air mover, a pump, fluid lines, and control circuitry. The cooling system also includes a cooling loop configured to be coupled to one or more heat generating devices. The cooling loop includes the pump and the fluid-to-air heat exchanger from the cooling unit, and at least one heat exchanger coupled together via flexible fluid lines. The heat exchanger is thermally coupled to the heat generating device. The cooling unit is configured to maintain noise below a specified acoustical specification. To meet this acoustical specification, the size, position, and type of the components within the cooling unit are specifically configured.
摘要翻译：冷却系统包括被配置为装配在个人计算机的单个驱动器托架内的冷却单元。冷却单元包括流体对空气热交换器，鼓风机，泵，流体管线和控制电路。冷却系统还包括被配置为联接到一个或多个发热装置的冷却回路。冷却回路包括来自冷却单元的泵和流体对空气热交换器，以及通过柔性流体管线连接在一起的至少一个热交换器。热交换器热耦合到发热装置。冷却单元被配置为将噪声保持在低于规定声学规范的范围内。为了达到这种声学规格，冷却装置内的部件的尺寸，位置和类型被特别地配置。

2. 发明申请

WO2007120530A3 INTEGRATED LIQUID TO AIR CONDUCTION MODULE 审中-公开
标题翻译：集成液体到空气导流模块
公开(公告)号：WO2007120530A3
公开(公告)日：2008-08-21
申请号：PCT/US2007008190
申请日：2007-03-30
申请人： COOLIGY INC , HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
发明人： HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
IPC分类号： F28F27/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。

3. 发明申请

WO2009114102A2 DEVICE AND METHODOLOGY FOR THE REMOVAL OF HEAT FROM AN EQUIPMENT RACK BY MEANS OF HEAT EXCHANGERS MOUNTED TO A DOOR 审中-公开
标题翻译：通过安装在门上的换热器将设备机架上的热量去除的装置和方法
公开(公告)号：WO2009114102A2
公开(公告)日：2009-09-17
申请号：PCT/US2009001423
申请日：2009-03-03
申请人： COOLIGY INC , CORREA ADRIAN , LIN TIEN CHIH ERIC , HOM JAMES , SHIOMOTO GREGORY , CHOW NORMAN , LEONG BRANDON , BREWER RICHARD GRANT , WERNER DOUGLAS E , MCMASTER MARK
发明人： CORREA ADRIAN , LIN TIEN CHIH ERIC , HOM JAMES , SHIOMOTO GREGORY , CHOW NORMAN , LEONG BRANDON , BREWER RICHARD GRANT , WERNER DOUGLAS E , MCMASTER MARK
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , E05D11/0081 , E05Y2800/10 , E05Y2900/132
摘要： A cooling door assembly includes a frame and a cooling door coupled to the frame. The cooling door includes one or more heat exchangers. The frame is configured to mount to the back of a server rack or other electronics enclosure in such a manner that the cooling door opens to allow access to the electronics servers within the server rack while maintaining a fluidic connection to an external cooling system. The frame is coupled to the external cooling system and the cooling door includes swivel joints configured to provide a fluid path between the cooling door and the frame. In this manner, the frame remains in a fixed position, while the cooling door is configured to rotate relative to the frame so as to open and close, while maintaining the fluid path through the swivel joint.
摘要翻译：冷却门组件包括框架和联接到框架的冷却门。冷却门包括一个或多个热交换器。框架被配置成以这样的方式安装到服务器机架或其他电子机柜的背面，使得冷却门打开以允许访问服务器机架内的电子服务器，同时保持与外部冷却系统的流体连接。框架联接到外部冷却系统，并且冷却门包括构造成在冷却门和框架之间提供流体路径的旋转接头。以这种方式，框架保持在固定位置，同时冷却门构造成相对于框架旋转以便打开和关闭，同时保持流体路径通过旋转接头。

4. 发明申请

WO2007120662A3 METHODOLOGY OF COOLING MULTIPLE HEAT SOURCES IN A PERSONAL COMPUTER THROUGH THE USE OF MULTIPLE FLUID-BASED HEAT EXCHANGING LOOPS COUPLED VIA MODULAR BUS-TYPE HEAT EXCHANGERS 审中-公开
标题翻译：通过使用多个基于流体的热交换器通过模块化总线式换热器来连接个人计算机中的多个热源的方法
公开(公告)号：WO2007120662A3
公开(公告)日：2008-02-21
申请号：PCT/US2007008840
申请日：2007-04-09
申请人： COOLIGY INC , BREWER RICHARD GRANT , CHOW NORMAN , HOM JAMES
发明人： BREWER RICHARD GRANT , CHOW NORMAN , HOM JAMES
IPC分类号： F28D15/00
CPC分类号： G06F1/20 , F28D15/0266 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H05K7/20772 , H01L2924/00
摘要： A cooling system is used to cool heat generating devices within a personal computer. The cooling system has a first fluid loop and an expandable array of one or more second fluid loops. For each of the second fluid loops, heat generating devices transfer heat to fluid flowing through corresponding heat exchanging devices in the loop. Heat is transferred from the fluid in each second fluid loop to a thermal bus of the first fluid loop via a thermal interface. The second fluid loop can be a pumped fluid loop or can include a heat pipe. Within the first fluid loop, a fluid is continuously pumped from the thermal bus to a fluid-to- air heat exchanging system and back to the thermal bus. Heat transferred to the thermal bus from the first fluid loop is transferred to the fluid in the second fluid loop passing through the thermal bus. The heated fluid is pumped through the fluid-to-air heat exchanging system where the heat is transferred from the fluid to the ambient. The thermal bus provides a modular, scalable cooling system which allows for the expansion of cooling capacity without breaking the fluid lines.
摘要翻译：冷却系统用于冷却个人计算机内的发热装置。冷却系统具有第一流体回路和一个或多个第二流体回路的可扩展阵列。对于每个第二流体回路，发热装置将热量传递到流过环路中相应的热交换装置的流体。热量通过热界面从每个第二流体回路中的流体转移到第一流体回路的热总线。第二流体回路可以是泵送的流体回路，或者可以包括热管。在第一流体回路内，流体从热母线连续泵送到流体与空气热交换系统并返回到热母线。从第一流体回路传递到热母线的热量被传递到通过热母线的第二流体回路中的流体。加热的流体被泵送通过流体对空气热交换系统，其中热量从流体传递到环境。热量总线提供了一个模块化，可扩展的冷却系统，可以在不破坏流体管路的情况下扩展冷却能力。

5. 发明申请

WO2007130583A3 SCALABLE LIQUID COOLING SYSTEM WITH MODULAR RADIATORS 审中-公开
标题翻译：具有模块化散热器的可扩展液体冷却系统
公开(公告)号：WO2007130583A3
公开(公告)日：2008-12-24
申请号：PCT/US2007010853
申请日：2007-05-04
申请人： COOLIGY INC , BREWER RICHARD , CONWAY BRUCE , HOM JAMES
发明人： BREWER RICHARD , CONWAY BRUCE , HOM JAMES
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/183 , G06F1/185 , G06F2200/201
摘要： A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly configured fluid-to-air heat exchanger, such as a radiator. The air plenum also include one or more air movers for blowing air through the expansion slots, and therefore through any radiators fitted within the expansion slots. For those expansion slots that are not used, a blanking plate is fitted to each unused expansion slot. Each blanking plate is modularly configured in a manner similar to the modularly configured radiators. In this manner, air bypass is substantially prevented. Each radiator is part of an independent cooling loop, used directly or indirectly to cool heat generating devices.
摘要翻译：公开了可扩展和模块化的冷却系统。冷却系统包括具有多个膨胀槽的空气增压室。每个扩展槽被配置成接收模块化配置的流体对空气热交换器，例如散热器。空气增压室还包括用于通过膨胀槽吹送空气的一个或多个空气推动器，因此通过安装在膨胀槽内的任何散热器。对于那些未使用的扩展槽，每个未使用的扩展槽都安装一个挡板。每个挡板以类似于模块化配置的散热器的方式被模块化地配置。以这种方式，基本上防止了空气旁路。每个散热器是独立冷却回路的一部分，直接或间接地用于冷却发热装置。

6. 发明申请

WO2004042304A3 METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE 审中-公开
标题翻译：用于冷却热生产装置的有效的垂直流体输送的方法和装置
公开(公告)号：WO2004042304A3
公开(公告)日：2004-08-12
申请号：PCT/US0334742
申请日：2003-10-30
申请人： COOLIGY INC
发明人： KENNETH GOODSON E , KENNY THOMAS WILLIAM JR , ZHOU PENG , UPADHYA GIRISH , MUNCH MARK , MCMASTER MARK , HOM JAMES , SHOOK JAMES GILL , CORBIN DAVID , LOVETTE JAMES
IPC分类号： F04B17/00 , F04B19/00 , F28D15/00 , F28D15/02 , F28F3/02 , F28F3/08 , F28F3/12 , F28F13/18 , G06Q20/20 , H01L23/473 , H04L29/06 , F28F7/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for cooling a heat source configured along a plane. The heat exchanger comprising an interface layer (102) that perform thermal exchange with the heat source and configured to pass fluid from a first side to a second side. The manifold layer (106) comprises a first layer in contact with the heat source and has an appropriate thermal conductivity to pass heat to the interface layer. The manifold layer further comprises a second layer coupled to the first layer and in contact with the second side to the interface layer. The first layer comprises a recess area having a heat conducting region in contact with the heat exchanging layer. The first layer includes at least one inlet and/or outlet port. The second layer includes at least one inlet and/or outlet port. At least one inlet and/or outlet port is positioned substantially parallel or perpendicular with respect to the plane.
摘要翻译：一种用于冷却沿着平面配置的热源的方法和装置。所述热交换器包括界面层（102），所述界面层与所述热源进行热交换，并被配置为将流体从第一侧传递到第二侧。歧管层（106）包括与热源接触的第一层，并具有适当的导热性以将热量传递到界面层。歧管层还包括耦合到第一层并与第二侧接触到界面层的第二层。第一层包括具有与热交换层接触的导热区域的凹部区域。第一层包括至少一个入口和/或出口。第二层包括至少一个入口和/或出口。至少一个入口端口和/或出口端口相对于该平面基本平行或垂直地定位。

7. 发明申请

WO2004042305A3 OPTIMAL SPREADER SYSTEM, DEVICE AND METHOD FOR FLUID COOLED MICRO-SCALED HEAT EXCHANGE 审中-公开
标题翻译：用于流体冷却微型热交换器的最优扩散器系统，装置和方法
公开(公告)号：WO2004042305A3
公开(公告)日：2004-07-08
申请号：PCT/US0334755
申请日：2003-10-30
申请人： COOLIGY INC
发明人： UPADHYA GIRISH , HERMS RICHARD , ZHOU PENG , GOODSON KENNETH , HOM JAMES
IPC分类号： F04B17/00 , F04B19/00 , F28D15/02 , F28F3/02 , F28F3/12 , H01L23/473 , H05K7/20 , F28F7/00
CPC分类号： F28F3/02 , F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F2210/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with specific materials and ranges of dimensions, to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels, but in alternate embodiments, comprises a micro-porous structure, or micro-pillars, or is comprised from the group of microchannels, a micro-porous structure, and micro-pillars.
摘要翻译：公开了一种用于流体冷却微型热交换器的装置，方法和系统。流体冷却微型热交换器利用具有特定材料和尺寸范围的微尺度区域和扩散器区域，以从热源产生每单位体积的高散热和传递面积。微尺度区域优选包含微通道，但在替代实施方案中，微通道包含微孔结构或微柱，或者由微通道，微孔结构和微柱组成。

8. 发明申请

WO2004042306A3 METHOD AND APPARATUS FOR ACHIEVING TEMPERATURE UNIFORMITY AND HOT SPOT COOLING IN A HEAT PRODUCING DEVICE 审中-公开
标题翻译：在制热装置中实现温度均匀性和热点冷却的方法和装置
公开(公告)号：WO2004042306A3
公开(公告)日：2004-11-11
申请号：PCT/US0334874
申请日：2003-10-30
申请人： COOLIGY INC
发明人： GOODSON KENNETH , KENNY THOMAS , ZHOU PENG , UPADHYA GIRISH , MUNCH MARK , MCMASTER MARK , HOM JAMES
IPC分类号： B21D53/02 , F04B19/00 , F28F7/00 , F28F13/18 , F28F19/02 , G05D23/00 , H01L23/427 , H01L23/473
CPC分类号： F28F3/048 , F04B19/006 , F28D15/00 , F28F3/12 , F28F2260/02 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
摘要翻译：一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。通过优化和控制热交换器中的流体和热电阻来最小化温差。对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

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