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1. 发明申请

WO2007120530A3 INTEGRATED LIQUID TO AIR CONDUCTION MODULE 审中-公开
标题翻译：集成液体到空气导流模块
公开(公告)号：WO2007120530A3
公开(公告)日：2008-08-21
申请号：PCT/US2007008190
申请日：2007-03-30
申请人： COOLIGY INC , HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
发明人： HOM JAMES , UPADHYA GIRISH , WERNER DOUGLAS E , MUNCH MARK , TSAO PAUL , CONWAY BRUCE , ZHOU PENG , BREWER RICHARD
IPC分类号： F28F27/00
CPC分类号： H05K7/20281 , G06F1/20 , G06F2200/201 , H01L23/467 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices.
摘要翻译：公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。耦合到第一层是附接有多个空气翅片的第二层。本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。

2. 发明申请

WO2007130583A3 SCALABLE LIQUID COOLING SYSTEM WITH MODULAR RADIATORS 审中-公开
标题翻译：具有模块化散热器的可扩展液体冷却系统
公开(公告)号：WO2007130583A3
公开(公告)日：2008-12-24
申请号：PCT/US2007010853
申请日：2007-05-04
申请人： COOLIGY INC , BREWER RICHARD , CONWAY BRUCE , HOM JAMES
发明人： BREWER RICHARD , CONWAY BRUCE , HOM JAMES
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/183 , G06F1/185 , G06F2200/201
摘要： A scalable and modular cooling system is disclosed. The cooling system includes an air plenum with a plurality of expansion slots. Each expansion slot is configured to receive a modularly configured fluid-to-air heat exchanger, such as a radiator. The air plenum also include one or more air movers for blowing air through the expansion slots, and therefore through any radiators fitted within the expansion slots. For those expansion slots that are not used, a blanking plate is fitted to each unused expansion slot. Each blanking plate is modularly configured in a manner similar to the modularly configured radiators. In this manner, air bypass is substantially prevented. Each radiator is part of an independent cooling loop, used directly or indirectly to cool heat generating devices.
摘要翻译：公开了可扩展和模块化的冷却系统。冷却系统包括具有多个膨胀槽的空气增压室。每个扩展槽被配置成接收模块化配置的流体对空气热交换器，例如散热器。空气增压室还包括用于通过膨胀槽吹送空气的一个或多个空气推动器，因此通过安装在膨胀槽内的任何散热器。对于那些未使用的扩展槽，每个未使用的扩展槽都安装一个挡板。每个挡板以类似于模块化配置的散热器的方式被模块化地配置。以这种方式，基本上防止了空气旁路。每个散热器是独立冷却回路的一部分，直接或间接地用于冷却发热装置。

3. 发明申请

WO2005030091A3 STENTS AND INTRA-LUMINAL PROSTHESES CONTAINING MAP KINASE INHIBITORS 审中-公开
标题翻译：包含MAP激酶抑制剂的睾酮和内皮祖细胞
公开(公告)号：WO2005030091A3
公开(公告)日：2005-09-15
申请号：PCT/US2004031814
申请日：2004-09-27
申请人： SCIOS INC , BREWER RICHARD , SCHREINER GEORGE F
发明人： BREWER RICHARD , SCHREINER GEORGE F
IPC分类号： A61F20060101 , A61F2/00 , A61F2/02 , A61F2/06 , A61L31/16
CPC分类号： A61L31/16 , A61L2300/434
摘要： A coated stent or intra-luminal prosthesis containing a MAP kinase inhibitor controls, reduces, or prevents restenosis, inflammation, and complications associated with stent or intraluminal prosthesis implantation and/or cardiovascular disease.
摘要翻译：包含MAP激酶抑制剂的涂层支架或腔内假体控制，减少或预防与支架或管腔内假体植入和/或心血管疾病相关的再狭窄，炎症和并发症。

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