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1. 发明申请

WO1996016768A1 PROCESS FOR BONDING WIRES TO OXIDATION-SENSITIVE METAL SUBSTRATES WHICH CAN BE SOLDERED 审中-公开
标题翻译：方法电线对氧化敏感的，焊接的金属基材粘结
公开(公告)号：WO1996016768A1
公开(公告)日：1996-06-06
申请号：PCT/DE1995001755
申请日：1995-11-28
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER, Heinrich , RUDOLF, Frank
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： B23K35/363
CPC分类号： H01L24/85 , C23F11/149 , H01L21/4875 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48247 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/78316 , H01L2224/78321 , H01L2224/85205 , H01L2224/85395 , H01L2224/85447 , H01L2924/01006 , H01L2924/01007 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01016 , H01L2924/0102 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/15747 , H01L2924/19041 , H01L2924/19043 , H01L2924/351 , H01R43/0207 , H05K3/282 , H01L2924/00014 , H01L2924/00 , H01L2924/2076
摘要： In order to bond unhoused semiconductor circuits (chips) electroconductively on circuit boards, the surfaces of the copper structures are generally coated with a nickel layer which is then coated with a layer of gold in order to be able to produce wire connections between the circuit and the conductive structures on the circuit board. The connection between the wire and the connection sites on the circuit, on the one hand, and the conductive structures on the circuit board, on the other, is formed by pressure welding, in particular ultrasound bonding. A novel process by means of which organic protective layers are deposited on the copper surfaces on the circuit board prevents the formation of oxide layers and other impurities on the copper surfaces and thus permits direct connection of the wire by ultrasound bonding to the copper surfaces without impairing the ability of the surfaces to be soldered.
摘要翻译：用于在印刷电路板上的导电接触未封装半导体电路（芯片）中，铜结构的表面通常涂以使电路和具有镍和覆金层上的电路板上的导体图案之间的导线连接。导线和，一方面在电路上的连接位点，并在另一侧的电路基板上的导体图案之间的连接是通过压焊工艺形成，特别是超声波接合方法。一种新方法被沉积在电路板的铜表面上的有机保护层，可以防止氧化膜和其它杂质的铜表面上的形成，从而使导线的通过超声波焊接到铜表面不具有表面的可焊性的直接连接被削弱。

2. 发明申请

WO1997000598A1 CONNECTION SUBSTRATE 审中-公开
标题翻译：连接衬底
公开(公告)号：WO1997000598A1
公开(公告)日：1997-01-03
申请号：PCT/CH1996000218
申请日：1996-06-06
申请人： DYCONEX PATENTE AG , ATOTECH DEUTSCHLAND GMBH , CIBA SC HOLDING AG , FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , TECHNISCHE UNIVERSITÄT DRESDEN , BARTE, Hans-Jürg , LOSERT, Ewald , MEYER, Heinrich , RÖHRS, Günter , RUDOLF, Frank , SCHEEL, Wolfgang , SCHMIDT, Walter , ZUR NIEDEN, Theis
发明人： DYCONEX PATENTE AG , ATOTECH DEUTSCHLAND GMBH , CIBA SC HOLDING AG , FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. , TECHNISCHE UNIVERSITÄT DRESDEN
IPC分类号： H05K01/00
CPC分类号： H05K3/284 , H01L23/50 , H01L23/5385 , H01L25/065 , H01L25/162 , H01L2224/16225 , H05K1/0203 , H05K1/189 , H05K3/0058 , H05K2201/0209 , H05K2201/042 , H05K2201/046 , H05K2201/2009 , H05K2203/1316 , Y10S428/901 , Y10T29/49128 , Y10T29/49155
摘要： The proposed method of producing multifunctional multilayered connection substrates involves the following: the connection substrate is built up function by function from the various components, i.e. signal conducting substrate components (19), power supply substrate components (2), thermal substrate components (20), mechanical substrate components (7), and the arrangement of the components (4) and component-bearing substrate components as interdependent functions or modules, are designed and optimised separately before finally being assigned to spatially separated functional areas (inner/outer) of the circuit. The construction process involves connecting the modules to a circuit which forms the connection substrate. The substrate components with fine, compact, flexible and cool elements are assigned to the inner areas of the circuit, while those substrate components with coarse, rigid and warm elements and/or components are assigned to the outer areas of the circuit; a stiffening support material is applied in the outer area in such a way as to give the circuit a mechanical support structure which is designed to have rigid sections which merge into flexible sections. The circuit can be folded and/or wound according to the rigid and flexible sections. The mechanical support structure can be formed by separately manufactured device housing components or by the device housing.
摘要翻译：对于生产具有多种功能的多层互连衬底的方法，是使连接基板的功能的结构通过信号导电基底部件（19），stromversorgende基板份（2），热基底部件（20），机械基底部件（7），以及各部件的布置分开进行（4）或支撑基板份组分分开规划为相互依赖的功能或单独优化模块和最后空间上分开的功能区域（内部/外部）由模块在连接到所述互连衬底体现整体电路中发生分配给整个电路，该结构。基板的与细的，致密的，灵活的和冷却元件的片被分配给整个电路的内部区域，与粗，刚性和温暖的元件和/或与整个电路的外部区域相关联的部件，和一种硬化的载体材料的衬底部分是在外部区域可以被设计，使得电路被赋予机械载体结构，所述载体结构被局部地在越过，总电路根据折叠和/或缠绕在刚性和柔性部分的设计刚性和柔性的区域。机械支撑结构可以通过单独制造设备壳体部件或由装置壳体而形成。

3. 发明申请

WO1997039163A1 PROCESS FOR MANUFACTURING INDUCTIVE COUNTING SYSTEMS 审中-公开
标题翻译：用于生产电感的工作计数系统
公开(公告)号：WO1997039163A1
公开(公告)日：1997-10-23
申请号：PCT/EP1997000845
申请日：1997-02-21
申请人： ATOTECH DEUTSCHLAND GMBH , KOHNLE, Franz , MEYER, Heinrich , URRUTIA DESMAISON, Gonzalo
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C23C18/16
CPC分类号： H05K3/184 , C23C18/1605 , C23C18/1653 , G06K19/067
摘要： A process for manufacturing inductive counting systems by generating a conductive structure on a non-electroconductive substrate includes a step during which a suitable catalyst for the currentless deposition of metals is applied on the non-electroconductive substrate, and usual preliminary and subsequent treatment steps.
摘要翻译：公开的是用于制造电感操作的计数系统，以形成一个非导电基板上的导体结构，包括应用适合的金属催化剂的非导电衬底上的无电沉积以及常规预处理和后处理步骤的步骤的处理。

4. 发明申请

WO1997019206A1 PROCESS FOR THE ELECTROLYTIC DEPOSITION OF METAL LAYERS 审中-公开
标题翻译：法金属层电解分离
公开(公告)号：WO1997019206A1
公开(公告)日：1997-05-29
申请号：PCT/EP1996005140
申请日：1996-11-21
申请人： ATOTECH DEUTSCHLAND GMBH , DAHMS, Wolfgang , MEYER, Heinrich , KRETSCHMER, Stefan
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C25D05/18
CPC分类号： C25D3/38 , C25D5/18 , H05K3/241 , Y10S205/92
摘要： The invention relates to a process for the electrolytic deposition of metal layers, in particular copper layers, of specific physico-mechanical and optical characteristics and of even thickness. With known processes using dissolving anodes and direct current, only an uneven metal layer distribution can be achieved on articles of complex shape. The problem of uneven layer thickness at different points on article surfaces can be alleviated by using a pulsed current or pulsed voltage process, but this does not solve the other problem of continually changing geometry during deposition as the anodes dissolve. This problem can be eliminated by using non-dissolving anodes. To ensure adequate anode stability and a high lustre of the layers even at points on the workpiece surface where the metal is deposited with high current density, compounds of an electrochemically reversible redox system must be added to the deposition solution.
摘要翻译：本发明涉及一种用于金属层，特别是铜层，具有均匀的层厚度一定的物理 - 机械性能和光学性能的电解沉积的方法。根据使用可溶性阳极和施加直流知的方法，金属分布的唯一的非均匀层可在复杂形状的工件来实现。使用脉冲电流或脉冲电压的方法，虽然该问题可以减少在这些层在材料表面的不同位置具有不同的厚度。但没有进一步的问题是由连续阳极的溶解沉积过程中变化的几何关系来解决。这可以通过使用不溶性阳极被消除。为了确保亦在其中金属沉积有高的电流密度的工件表面的位置处的膜的阳极和高光泽度的足够的稳定性，有必要添加一种电化学可逆的氧化还原系统的沉积化合物。

5. 发明申请

WO1997020254A1 PHOTOSENSITIVE COMPOSITION 审中-公开
标题翻译：光敏成分
公开(公告)号：WO1997020254A1
公开(公告)日：1997-06-05
申请号：PCT/EP1996005313
申请日：1996-11-27
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER, Heinrich , URRUTIA DESMAISON, Gonzalo , MEUNIER, Gilles , PIRRI, Rosangela , VERZARO, Francis
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： G03F07/039
CPC分类号： G03F7/039 , C08K5/42 , G03F7/0045 , H05K3/0076 , H05K3/064 , C08L33/062
摘要： The invention relates to photosensitive compositions capable of being developed as positives. Conventional compositions are either insufficiently photosensitive or unsuitable for use on copper surfaces such as those in printed circuit boards, since the exposed regions of the composition layer cannot be completely removed during development and create problems in the subsequent metal-coating or etching operations. These drawbacks are not found with the claimed photosensitive compositions. Various compositions are described containing photo-acid generators and a polymer resin containing acid-cleavable side groups and formed by polymerisation of at least three different acrylate or methacrylate monomers.
摘要翻译：本发明涉及一种正型感光性组合物显影。常规组合物或者不表现出足够的光敏性，或它们可用于在铜表面上，如印刷电路板的使用，不适合的，因为该组合物的层的显影过程中曝光的区域不能被完全去除，从而导致在随后的电镀或蚀刻的问题。在本发明中，光敏组合物中，这些缺点都没有观察到。它描述了含有光产酸剂和具有酸可裂解侧基的聚合物树脂，它是由至少三种不同的丙烯酸酯或甲基丙烯酸酯单体的聚合而形成的各种组合物。

6. 发明申请

WO1993011881A1 METHOD OF COATING SURFACES WITH FINELY PARTICULATE MATERIALS 审中-公开
标题翻译：用精细颗粒材料涂覆表面的方法
公开(公告)号：WO1993011881A1
公开(公告)日：1993-06-24
申请号：PCT/DE1992000788
申请日：1992-09-11
申请人： ATOTECH DEUTSCHLAND GMBH , BESENHARD, Jürgen, Otto , CLAUSSEN, Olaf , GAUSMANN, Hans-Peter , MEYER, Heinrich
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： B05D07/00
CPC分类号： B05D7/5483 , B05D1/18 , B05D3/005 , B05D5/12 , B05D7/142 , C23C18/1635 , C23C18/1844 , C23C18/2086 , C25D5/54 , H01B1/22 , H01B1/24 , H05K3/424 , H05K2201/0323
摘要： The invention concerns a method of coating preferably electrically non-conducting surfaces with preferably electrically conducting finely particulate materials by dipping the article to be coated into the following baths in succession: a) an aqueous solution of polymers (pre-dip solution), b) an aqueous dispersion of the finely particulate material, the dispersion also containing surfactants to prevent sedimentation and a salt to ensure the controlled destabilization of the dispersion. Coating with electrically conducting particles, such as graphite or carbon black, can be carried out in preparation for the galvanic deposition of a metal.

7. 发明申请

WO1996012392A1 PROCESS FOR MANUFACTURING ELECTRICAL CIRCUIT BASES 审中-公开
标题翻译：制造方法电气电路载体
公开(公告)号：WO1996012392A1
公开(公告)日：1996-04-25
申请号：PCT/DE1995001500
申请日：1995-10-18
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER, Heinrich
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： H05K03/00
CPC分类号： H05K3/388 , C23C16/18 , C23C18/30
摘要： To manufacture electrical circuit bases with extremely fine conducting paths, laminates without metal foil coverings are used as the initial materials; to produce the holes, a temporary metal layer is applied to the laminate surfaces, that metal layer is structured and etched and removed from the laminate surfaces once the holes have been etched in the laminate. A foundation metal layer is then deposited on the laminate surfaces, including the hole walls, to create the conducting paths; this is done by the glow discharge decomposition of volatile metal compounds. Further metal layers are applied to those layers without current and/or electrolytically. The metal layers are structured using photomask techniques.
摘要翻译：未设置金属箔层压板用作起始材料具有非常细的导线的制造电路的载体，暂时施加金属层施加到所述层叠体的表面，以产生孔，这些图案化，蚀刻，并且在层压体背面的叠层体表面的孔的蚀刻之后去除。随后，基底金属层是通过层压板表面包括孔壁，以形成导电迹线对辉光放电的装置分解的挥发性金属化合物沉积。在这些层中更多个金属层被通电和/或电解施加。金属层通过光掩模技术构成。

8. 发明申请

WO1994004591A1 SOLUTION FOR COATING NON CONDUCTORS WITH CONDUCTIVE POLYMERS AND THEIR METALLIZATION PROCESS 审中-公开
标题翻译：解涂层FOR金属化导电聚合物和方法而不是领导者
公开(公告)号：WO1994004591A1
公开(公告)日：1994-03-03
申请号：PCT/DE1993000780
申请日：1993-08-20
申请人： ATOTECH DEUTSCHLAND GMBH , RAGGE, Andrea , MEYER, Heinrich , URRUTIO DESMAISON, Gonzalo
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C08G61/12
CPC分类号： H05K3/424 , C08G61/123 , C08G73/0206 , C25D5/54 , H05K3/427 , H05K2201/0329 , H05K2203/0796 , Y10S205/92 , Y10S205/925
摘要： A solution and a process are disclosed for metallising nonconductors by means of conductive polymers which contain water-soluble polymers besides the aromatic compounds required to produce the conductive polymers. As water-soluble polymers homopolymers or copolymers are used.

9. 发明申请

WO1997011209A2 PROCESS AND DEVICE FOR TREATING HOLES OR RECESSES IN WORKPIECES WITH LIQUID TREATMENT AGENTS 审中-公开
标题翻译：方法和装置用于治疗延长孔工件或很好地液体处理基金
公开(公告)号：WO1997011209A2
公开(公告)日：1997-03-27
申请号：PCT/DE1996001716
申请日：1996-09-06
申请人： ATOTECH DEUTSCHLAND GMBH , DURST, Franz , BRENN, Günter , SCHÄFER, Michael , MEYER, Heinrich , STREUP, Heribert
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C25D00/00
CPC分类号： C25D5/08 , B08B3/02 , B08B3/022 , H05K3/0088
摘要： Treating, for example cleaning, holes or recesses in workpieces is problematic when the holes or recesses are less than 0.5 mm wide, and in particular when they do not extend through the workpiece (blind holes). Known processes do not allow gas bubbles that adhere to the side walls of such holes to be removed nor liquids inside the holes to be effectively exchanged. The disclosed process allows the liquid inside the hole to be effectively exchanged by the liquid outside the holes. For that purpose, the liquid treatment medium is injected into the holes as a jet with a smaller diameter than the holes. Also disclosed is a device for carrying out this process with a nozzle with one or more outlets of less than 0.5 mm diameter, a liquid supply unit for pumping liquid treatment medium through the nozzle outlets, and a filtering unit in communication with the outlets and the supply unit for removing particles from the treatment medium.
摘要翻译：的处理，例如孔或凹部的在工件的清洗是有问题的，如果孔或凹陷具有小于0.5mm的开口宽度，特别是如果它不穿过所述工件（盲孔）。通过已知的方法附着于这样的孔的侧壁，气泡可以不被去除或孔利用Dende液体内不能有效地交换。本发明的方法中，包含在孔和位于所述孔的外侧的液体的有效交换是可能的。为了这个目的，所述液体处理剂被注射作为射流成直径比该孔的较小的孔。用于执行该方法的装置，它进一步描述了通过喷嘴具有直径低于0.5mm，液体供给部，通过该液体处理剂通过喷嘴出口孔泵送装置的一个或多个喷嘴出口孔，并与所述孔和所述供给部用于从处理剂中除去粒子的过滤器相关单元的特征。

10. 发明申请

WO1996012051A1 PROCESS FOR SEPARATING METAL COATINGS 审中-公开
标题翻译：用于金属层的分离
公开(公告)号：WO1996012051A1
公开(公告)日：1996-04-25
申请号：PCT/DE1995001501
申请日：1995-10-18
申请人： ATOTECH DEUTSCHLAND GMBH , MEYER, Heinrich , SCHULZ, Ralf
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C23C18/30
CPC分类号： C23C16/18 , C23C18/30 , H05K3/388
摘要： The electronic industry makes use of polyimide substrates with copper coatings which are produced by the decomposition of metal organic compounds by means of a glow discharge process followed by the currentless metallisation of the metal film produced. When the first metal coating is separated, carbon-containing coatings are produced without the addition of oxygen which have low conductivity and little catalytic activity. If only alkaline metallising baths are used, adherent metal coatings are indeed initially deposited on the polyimide surfaces but the adhesion of the metal coating on the polyimide is seriously degraded on contact between the metal and aqueous alkaline solutions. If work is conducted in an oxygen atmosphere, palladium coatings are produced which must subsequently be reduced. Such coatings provide little or no adhesion if they are exposed to chemical or electrochemical process solutions. When mixtures of oxygen-containing compounds and inert gas are used in metal separation in the glow discharge, low-oxygen and carbon coatings are produced. In addition, the reduction in the adhesion on contact between the metallised substrate and aqueous-alkaline solutions can be avoided by the use of acid or neutral currentless metallising baths to produce the second metal coating. This process makes it possible for the first time to produce high-density circuit carriers from unmetallised polyimide foils.
摘要翻译：对于与铜层的电子工业聚酰亚胺基材的用途是已知的通过由辉光放电，将所得的金属膜的随后的无电解镀敷的手段分解有机金属化合物产生的。在出现沉积具有低导电性和低的催化活性，第一金属层的含碳层不加氧气在这种情况下。是专门用于金属化的碱性浴，虽然最初粘附金属层在聚酰亚胺表面上沉积金属层到聚酰亚胺的粘接强度，但是，在与水性碱溶液的金属的接触相当损害。在氧气氛中工作时，引起了需要随后还原钯层。这样的层在暴露于化学或电化学处理解决方案提供很少或没有粘合性。通过使用含氧化合物的混合物，和惰性气体中，在氧和碳层中的辉光放电金属沉积中产生。此外，可避免在当与通过使用酸性或中性电金属化的，以产生所述第二金属层中的含水碱性溶液中金属化基板的接触的粘合强度的降低。该过程打开了首次生产基于未金属化的聚酰亚胺膜的高密度互连的设备。

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