专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2003100137A2 ACID PLATING BATH AND METHOD FOR THE ELECTOLYTIC DEPOSITION OF SATIN NICKEL DEPOSITS 审中-公开
标题翻译：酸性镀锌浴和沉淀镍沉积物的电镀沉积方法
公开(公告)号：WO2003100137A2
公开(公告)日：2003-12-04
申请号：PCT/EP2003/005134
申请日：2003-05-15
申请人： ATOTECH DEUTSCHLAND GMBH , DAHMS, Wolfgang , SCHULZ, Klaus-Dieter , MORITZ, Thomas
发明人： DAHMS, Wolfgang , SCHULZ, Klaus-Dieter , MORITZ, Thomas
IPC分类号： C25D3/12
CPC分类号： B65B35/24 , B65B59/00 , C25D3/12
摘要： The plating bath for the deposition of satin nickel deposits according to the present invention contains at least one quaternary ammonium compound and at least one polyether, the at least one polyether having at least one strongly hydrophobic side chain. As compared to prior art plating baths, this acid plating bath has the advantage that it enables a long period of operation or heating and cooling cycles or filtration cycles, makes it possible to perform the filtration needed for continually operating the bath without using active carbon, requires a lower concentration of nickel than prior art baths to produce the satin gloss finish and has a reduced sensitivity to wetting agents that have been dragged in.
摘要翻译：用于沉积根据本发明的缎纹镍沉积物的镀浴含有至少一种季铵化合物和至少一种聚醚，所述至少一种聚醚具有至少一个强疏水侧链。与现有技术的电镀浴相比，该酸性电镀浴的优点是能够长时间的操作或加热和冷却循环或过滤循环，使得可以进行连续操作浴而不使用活性炭所需的过滤，需要比现有技术浴更低的镍浓度以产生缎光泽光洁度，并且对被拖入的润湿剂的敏感性降低。

2. 发明申请

WO1997019206A1 PROCESS FOR THE ELECTROLYTIC DEPOSITION OF METAL LAYERS 审中-公开
标题翻译：法金属层电解分离
公开(公告)号：WO1997019206A1
公开(公告)日：1997-05-29
申请号：PCT/EP1996005140
申请日：1996-11-21
申请人： ATOTECH DEUTSCHLAND GMBH , DAHMS, Wolfgang , MEYER, Heinrich , KRETSCHMER, Stefan
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C25D05/18
CPC分类号： C25D3/38 , C25D5/18 , H05K3/241 , Y10S205/92
摘要： The invention relates to a process for the electrolytic deposition of metal layers, in particular copper layers, of specific physico-mechanical and optical characteristics and of even thickness. With known processes using dissolving anodes and direct current, only an uneven metal layer distribution can be achieved on articles of complex shape. The problem of uneven layer thickness at different points on article surfaces can be alleviated by using a pulsed current or pulsed voltage process, but this does not solve the other problem of continually changing geometry during deposition as the anodes dissolve. This problem can be eliminated by using non-dissolving anodes. To ensure adequate anode stability and a high lustre of the layers even at points on the workpiece surface where the metal is deposited with high current density, compounds of an electrochemically reversible redox system must be added to the deposition solution.
摘要翻译：本发明涉及一种用于金属层，特别是铜层，具有均匀的层厚度一定的物理 - 机械性能和光学性能的电解沉积的方法。根据使用可溶性阳极和施加直流知的方法，金属分布的唯一的非均匀层可在复杂形状的工件来实现。使用脉冲电流或脉冲电压的方法，虽然该问题可以减少在这些层在材料表面的不同位置具有不同的厚度。但没有进一步的问题是由连续阳极的溶解沉积过程中变化的几何关系来解决。这可以通过使用不溶性阳极被消除。为了确保亦在其中金属沉积有高的电流密度的工件表面的位置处的膜的阳极和高光泽度的足够的稳定性，有必要添加一种电化学可逆的氧化还原系统的沉积化合物。

3. 发明申请

WO1992007116A1 ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE 审中-公开
标题翻译：用于铜镀层的酸浴和使用这种类型的浴用于本用途的方法
公开(公告)号：WO1992007116A1
公开(公告)日：1992-04-30
申请号：PCT/DE1991000811
申请日：1991-10-11
申请人： SCHERING AKTIENGESELLSCHAFT , DAHMS, Wolfgang , WESTPHAL, Horst
发明人： SCHERING AKTIENGESELLSCHAFT
IPC分类号： C25D03/38
CPC分类号： C25D3/38
摘要： The invention concerns an aqueous acid copper-electroplating bath and the use of the bath for the electrolytic deposition of copper.

4. 发明申请

WO2005049584A1 ACIDIC BATH FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT CONTAINING HALOGENATED OR PSEUDOHALOGENATED MONOMERIC PHENAZINIUM COMPOUNDS 审中-公开
标题翻译：用于电沉积含有羟基化或单酯化单体化合物的铜沉积物的酸性浴
公开(公告)号：WO2005049584A1
公开(公告)日：2005-06-02
申请号：PCT/EP2004/012851
申请日：2004-11-09
申请人： ATOTECH DEUTSCHLAND GMBH , GRIESER, Olanda , GRIESER, Christopher , BRUNNER, Heiko , DAHMS, Wolfgang
发明人： BRUNNER, Heiko , DAHMS, Wolfgang
IPC分类号： C07D241/46
CPC分类号： C25D3/38 , C07D241/46
摘要： For manufacturing particularly uniform and mirror bright copper coatings that are leveled and ductile as well using a relatively high current density, halogenated or pseudohalogenated monomeric pheanzinium compounds or a purity at least 85 mole-% and having the general chemical formula (I) are utilized in which R 1 , R 2 , R 3 , R 4 . R 5 , R 6 , R 7 , R 7’’ , R 8 , R 9 , X and A¯have the significations denoted in the claims. The compounds are prepared by diazotizing a suited starting compound prior to halogenating or pseudohalogenating it in the presence of mineral acid, diazotization means and halide or pseudohalide, with the reaction steps being run in one single vessel.
摘要翻译：对于使用相对高的电流密度制造特别均匀的和镜面光亮的铜涂层，使用卤化或假卤化单体pheanzinium化合物或纯度至少为85摩尔％并具有一般化学式（I）的化学式其中R 1，R 2，R 3，R 4。 R 5，R 6，R 7，R 7“，R 8，R 9，X和A具有权利要求中记载的含义。在无机酸，重氮化装置和卤化物或拟卤化物存在下卤化或假卤化之前，通过重氮化合适的起始化合物来制备化合物，反应步骤在一个单一的容器中进行。

5. 发明申请

WO2005014891A2 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION 审中-公开
标题翻译：酸性溶液和电解沉积铜涂层的方法，如同使用溶液
公开(公告)号：WO2005014891A2
公开(公告)日：2005-02-17
申请号：PCT/EP2004/008492
申请日：2004-07-28
申请人： ATOTECH DEUTSCHLAND GMBH , DAHMS, Wolfgang , FELS, Carl, Christian , BAUER, Günther
发明人： DAHMS, Wolfgang , FELS, Carl, Christian , BAUER, Günther
IPC分类号： C25D3/38
CPC分类号： C25D3/38
摘要： The aqueous acidic solution for electrolytically depositing high polish, decorative bright, smooth and level copper coatings on large area metal or plastic parts contains a) at least one oxygen-containing, high molecular additive and b) at least one water soluble sulfur compound, wherein the solution additionally contains c) at least one aromatic halogen derivative having the general formula (I), wherein R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are each independently radicals selected from the group comprising hydrogen, aldehyde, acetyl, hydroxy, hydroxyalkyl having 1 - 4 carbon atoms, alkyl having 1 - 4 carbon atoms and halogen, with the proviso that the number of residues R 1 , R 2 , R 3 , R 4 , R 5 and R 6 which are halogen ranges from 1 to 5.
摘要翻译：用于在大面积金属或塑料部件上电解沉积高抛光，光亮和平滑的铜涂层的酸性水溶液含有a）至少一种含氧高分子添加剂和b）至少一种水溶性硫化合物，其中溶液另外含有c）至少一种具有通式（I）的芳族卤素衍生物，其中R 1，R 2，R 3，R 4，R 5和R 6各自独立地选自氢，醛，乙酰基，羟基，羟烷基具有1-4个碳原子的烷基，具有1-4个碳原子的烷基和卤素，条件是卤素的残基R 1，R 2，R 3，R 4，R 5和R 6的数目为1至5。

6. 发明申请

WO2003100137A3 ACID PLATING BATH AND METHOD FOR THE ELECTOLYTIC DEPOSITION OF SATIN NICKEL DEPOSITS 审中-公开
公开(公告)号：WO2003100137A3
公开(公告)日：2003-12-04
申请号：PCT/EP2003/005134
申请日：2003-05-15
申请人： ATOTECH DEUTSCHLAND GMBH , DAHMS, Wolfgang , SCHULZ, Klaus-Dieter , MORITZ, Thomas
发明人： DAHMS, Wolfgang , SCHULZ, Klaus-Dieter , MORITZ, Thomas
IPC分类号： C25D3/12
摘要： The plating bath for the deposition of satin nickel deposits according to the present invention contains at least one quaternary ammonium compound and at least one polyether, the at least one polyether having at least one strongly hydrophobic side chain. As compared to prior art plating baths, this acid plating bath has the advantage that it enables a long period of operation or heating and cooling cycles or filtration cycles, makes it possible to perform the filtration needed for continually operating the bath without using active carbon, requires a lower concentration of nickel than prior art baths to produce the satin gloss finish and has a reduced sensitivity to wetting agents that have been dragged in.

7. 发明申请

WO1998026114A1 PROCESS FOR THE ELECTROLYTIC DEPOSITION OF COPPER LAYERS 审中-公开
标题翻译：方法覆铜层电解沉积
公开(公告)号：WO1998026114A1
公开(公告)日：1998-06-18
申请号：PCT/EP1997006786
申请日：1997-12-04
申请人： ATOTECH DEUTSCHLAND GMBH , SENGE, Gerd , DAHMS, Wolfgang
发明人： ATOTECH DEUTSCHLAND GMBH
IPC分类号： C25D03/38
CPC分类号： C25D3/38 , C25D3/58 , C25D5/18 , H05K3/241 , H05K3/423
摘要： A process for the electrolytic deposition of copper layers, in particular on printed circuit boards, has the following steps: an electroconductive substrate and anodes which are dissolved during electrolytic deposition are brought into contact with a deposition bath which contains copper ions, compounds which increase the electroconductivity of the deposition bath, additives for influencing the material properties of the copper layers, additional compounds of an electrochemically reversible redox system, and additives or mixtures of additives. The substrate and the anodes are connected to a current supply and the copper layers are deposited on the substrate by a pulsed current or pulsed voltage process. This process allows metallic layers with good optical and mechanical properties to be deposited even after only a short stay in the bath.
摘要翻译：对于铜层的电解沉积，特别是在印刷电路板上，其包括以下步骤的方法被用于：导电基底和溶解电解沉积的阳极被带到与镀浴接触，铜离子的电镀液，所述沉积浴的电导率增加的化合物，包含用于影响铜层的材料性质，电化学可逆的氧化还原系统的另外的化合物和溶剂或溶剂混合物的添加剂。所述基板和所述阳极连接到电源。铜层是由脉冲电流或脉冲电压方法沉积在衬底上。当该方法的金属层可以以良好的光学和机械材料特性的槽的短训练期间之后进行沉积。

8. 发明申请

WO1991016474A1 ACID NICKEL BATHS CONTAINING 1-(2-SULFOETHYL)-PYRIDINIUM BETAINE 审中-公开
标题翻译：含有1-（2-三氟甲基） - 吡啶并[
公开(公告)号：WO1991016474A1
公开(公告)日：1991-10-31
申请号：PCT/DE1991000336
申请日：1991-04-22
申请人： SCHERING AKTIENGESELLSCHAFT , DAHMS, Wolfgang
发明人： SCHERING AKTIENGESELLSCHAFT
IPC分类号： C25D03/18
CPC分类号： C25D3/18
摘要： The invention concerns acid nickel baths containing 1-(2-sulfoethyl)- pyridinium betaine.
摘要翻译：本发明涉及含有1-（2-磺乙基） - 吡啶鎓甜菜碱的酸性镍浴。

9. 发明申请

WO2006094755A8 POLYVINYLAMMONIUM COMPOUND, METHOD OF MANUFACTURING SAME, ACIDIC SOLUTION CONTAINING SAID COMPOUND AND METHOD OF ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT 审中-公开
标题翻译：聚乙烯亚胺化合物，其制备方法，含有化合物的酸溶液和电沉积铜沉积的方法
公开(公告)号：WO2006094755A8
公开(公告)日：2007-04-19
申请号：PCT/EP2006002064
申请日：2006-03-01
申请人： ATOTECH DEUTSCHLAND GMBH , GRIESER OLANDA , GRIESER CHRISTOPHER , DAHMS WOLFGANG , HARTMANN PHILIP
发明人： DAHMS WOLFGANG , HARTMANN PHILIP , GRIESER UDO
IPC分类号： C08F26/02 , B44C1/00 , C08F8/02 , C08F8/12 , C08F8/44 , C25D3/38 , C25D7/12 , H05K3/42
CPC分类号： C25D3/38 , C08F8/02 , C08F8/44 , C08F226/02 , C08F2800/10 , H05K3/423
摘要： The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyvinylammonium compound corresponding to the general chemical formula (I): as well as to polyvinylammonium compounds of the general chemical formula (I), wherein one of the monomer units or both having indices I and m are present in the neutral form.
摘要翻译：本发明涉及一种聚乙烯铵化合物，涉及一种制备所述化合物的方法，至少含有所述聚乙烯基铵化合物的酸性水溶液用于电沉积铜沉积物以及使用所述酸性水溶液电沉积铜沉积物的方法对应于一般化学式（I）的所述聚乙烯基铵化合物：以及一般化学式（I）的聚乙烯基铵化合物，其中一个单体单元或两个具有指数I和m的两者均以中性形式存在。

10. 发明申请

WO2005014891A3 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION 审中-公开
标题翻译：用于电解沉积铜涂层以及使用所述溶液的水性，酸性溶液和方法
公开(公告)号：WO2005014891A3
公开(公告)日：2005-05-26
申请号：PCT/EP2004008492
申请日：2004-07-28
申请人： ATOTECH DEUTSCHLAND GMBH , DAHMS WOLFGANG , FELS CARL CHRISTIAN , BAUER GUENTHER
发明人： DAHMS WOLFGANG , FELS CARL CHRISTIAN , BAUER GUENTHER
IPC分类号： C25D3/38
CPC分类号： C25D3/38
摘要： The aqueous acidic solution for electrolytically depositing high polish, decorative bright, smooth and level copper coatings on large area metal or plastic parts contains a) at least one oxygen-containing, high molecular additive and b) at least one water soluble sulfur compound, wherein the solution additionally contains c) at least one aromatic halogen derivative having the general formula (I), wherein R1, R2, R3, R4, R5 and R6 are each independently radicals selected from the group comprising hydrogen, aldehyde, acetyl, hydroxy, hydroxyalkyl having 1 - 4 carbon atoms, alkyl having 1 - 4 carbon atoms and halogen, with the proviso that the number of residues R1, R2, R3, R4, R5 and R6 which are halogen ranges from 1 to 5.
摘要翻译：用于在大面积金属或塑料部件上电解沉积高抛光，装饰光亮，光滑和水平的铜涂层的酸性水溶液含有a）至少一种含氧高分子添加剂和b）至少一种水溶性硫化合物，其中该溶液另外含有c）至少一种具有通式（I）的芳族卤素衍生物，其中R1，R2，R3，R4，R5和R6各自独立地选自氢，醛，乙酰基，羟基，羟烷基具有1-4个碳原子的烷基，具有1-4个碳原子的烷基和卤素，条件是卤素的残基R 1，R 2，R 3，R 4，R 5和R 6的数目为1至5。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式