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1. 发明申请

WO2004094702A8 MULTI-CHEMISTRY PLATING SYSTEM 审中-公开
标题翻译：多化学镀层系统
公开(公告)号：WO2004094702A8
公开(公告)日：2005-12-29
申请号：PCT/US2004012012
申请日：2004-04-16
申请人： APPLIED MATERIALS INC , YANG MICHAEL X , XI MING , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
发明人： YANG MICHAEL X , XI MING , ELLWANGER RUSSELL C , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
IPC分类号： B08B3/02 , C25D5/00 , C25D7/12 , C25D17/00 , C25D21/00 , C25D21/08 , H01L21/00 , H01L21/68 , H01L21/683 , H01L21/687 , C25D
CPC分类号： H01L21/67167 , B08B3/02 , C25D5/003 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/02 , C25D21/08 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/68 , H01L21/6838 , H01L21/68707
摘要： Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
摘要翻译：本发明的实施方案通常提供电化学电镀系统。所述电镀系统包括基板装载站，所述基板装载站定位成与主机处理平台连通，至少一个位于所述主机上的基板电镀单元，位于所述主机上的至少一个基板斜面清洁单元，以及与主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

2. 发明申请

WO2004094702A3 MULTI-CHEMISTRY PLATING SYSTEM 审中-公开
标题翻译：多化学镀层系统
公开(公告)号：WO2004094702A3
公开(公告)日：2006-11-30
申请号：PCT/US2004012012
申请日：2004-04-16
申请人： APPLIED MATERIALS INC , YANG MICHAEL X , XI MING , ELLWANGER RUSSELL C , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
发明人： YANG MICHAEL X , XI MING , ELLWANGER RUSSELL C , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
IPC分类号： C25D7/12 , B08B3/02 , C25D5/00 , C25D17/00 , C25D17/02 , C25D19/00 , C25D21/00 , C25D21/08 , H01L21/00 , H01L21/68 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67167 , B08B3/02 , C25D5/003 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/02 , C25D21/08 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/68 , H01L21/6838 , H01L21/68707
摘要： Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
摘要翻译：本发明的实施方案通常提供电化学电镀系统。电镀系统包括位于与主机处理平台连通的基板装载站，位于主框架上的至少一个基板镀覆单元，位于主机上的至少一个基板斜面清洁单元，以及与主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

3. 发明申请

WO0201610A3 APPARATUS AND METHOD FOR ELECTRO CHEMICAL DEPOSITION 审中-公开
标题翻译：电化学沉积的装置和方法
公开(公告)号：WO0201610A3
公开(公告)日：2004-10-28
申请号：PCT/US0118727
申请日：2001-06-08
申请人： APPLIED MATERIALS INC
发明人： STEVENS JOSEPH J , RABINOVICH YEVGENIY , CHAO SANDY S , DENOME MARK R , D AMBRA ALLEN L , OLGADO DONALD J
IPC分类号： C25D17/00 , C25D7/12 , C25D21/14 , C25D21/18 , H01L21/288
CPC分类号： C25D21/14 , C25D7/123 , C25D17/001 , C25D21/18
摘要： A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
摘要翻译：提供了一种系统，其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。较小的流量被转移到可以在单独平台上的计量单元。在一个实施例中的计量单元包括加压流动管线。

4. 发明申请

WO2010039409A3 APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE USING PRESSURIZED FLUID 审中-公开
标题翻译：用加压流体清洗半导体衬底的装置和方法
公开(公告)号：WO2010039409A3
公开(公告)日：2010-05-20
申请号：PCT/US2009056679
申请日：2009-09-11
申请人： APPLIED MATERIALS INC , CHEN HUI , D AMBRA ALLEN L
发明人： CHEN HUI , D AMBRA ALLEN L
IPC分类号： H01L21/304 , H01L21/302
CPC分类号： H01L21/67051
摘要： Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
摘要翻译：本发明的实施例一般涉及在抛光工艺之后清洁半导体衬底的设备和方法。具体而言，本发明的实施例涉及使用加压流体来清洁衬底的装置和方法。本发明的一个实施例包括：两个辊子，用于以基本上垂直的方向支撑和旋转衬底;压力轮，用于施加力以使衬底与两个辊子接合;以及摆动喷嘴，其被构造成朝衬底分配加压流体。

5. 发明申请

WO2010039410A2 BRUSH BOX CLEANER WITH FORCE CONTROL 审中-公开
标题翻译：具有强制控制的刷子清洁器
公开(公告)号：WO2010039410A2
公开(公告)日：2010-04-08
申请号：PCT/US2009056686
申请日：2009-09-11
申请人： APPLIED MATERIALS INC , CHEN HUI , YUDOVSKY JOSEPH , D AMBRA ALLEN L
发明人： CHEN HUI , YUDOVSKY JOSEPH , D AMBRA ALLEN L
IPC分类号： H01L21/304
CPC分类号： B08B1/04 , H01L21/67046 , H01L21/67219
摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry.
摘要翻译：本发明的实施例涉及使用洗涤器刷清洁衬底的装置和方法。本发明的一个实施例提供了一种基板清洁器，包括可移动地设置在处理体积中的两个洗涤刷组件。两个洗涤器刷组件被配置为接触并清洁设置在处理体积中的基板的相对表面。衬底清洁器还包括配置成同时调节两个洗涤器刷组件的位置的定位组件，其中定位组件以镜面对称的方式对第一和第二洗刷器刷组件进行基本相同的调节量。

6. 发明申请

WO2009131945A3 HIGH THROUGHPUT CHEMICAL MECHANICAL POLISHING SYSTEM 审中-公开
标题翻译：高通量化学机械抛光系统
公开(公告)号：WO2009131945A3
公开(公告)日：2010-02-18
申请号：PCT/US2009041133
申请日：2009-04-20
申请人： APPLIED MATERIALS INC , D AMBRA ALLEN L , YILMAZ ALPAY
发明人： D AMBRA ALLEN L , YILMAZ ALPAY
IPC分类号： H01L21/304
CPC分类号： B24B37/345 , B24B27/0076 , B24B37/042 , B24B41/005
摘要： Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.
摘要翻译：提供了用于抛光基板的系统和方法的实施例。在一个实施例中，提供了包括抛光模块，清洁器和机器人的抛光系统。机器人具有足以在抛光模块和清洁器之间传送基板的运动范围。抛光模块包括至少两个抛光台，至少一个装载杯和至少四个抛光头。抛光头构造成在至少两个抛光台和至少一个装载杯之间独立地移动。

7. 发明申请

WO2009158378A2 DUAL CHAMBER MEGASONIC CLEANER 审中-公开
标题翻译：双室MEGASONIC CLEANER
公开(公告)号：WO2009158378A2
公开(公告)日：2009-12-30
申请号：PCT/US2009048390
申请日：2009-06-24
申请人： APPLIED MATERIALS INC , MARTINEZ RICARDO , D AMBRA ALLEN L , BLANK ADRIAN , BRITCHER THUY , CHEN HUI
发明人： MARTINEZ RICARDO , D AMBRA ALLEN L , BLANK ADRIAN , BRITCHER THUY , CHEN HUI
IPC分类号： H01L21/304 , H01L21/302
CPC分类号： B08B3/12 , H01L21/67051
摘要： Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided. The apparatus comprises an outer tank for collecting overflow processing fluid comprising at least one sidewall and a bottom. A first inner module adapted to contain a processing fluid is positioned partially within the outer tank. The first inner module comprises one or more roller assemblies to hold a substrate in a substantially vertical orientation. A second inner module adapted to contain a processing fluid is positioned partially within the outer tank. The second inner module comprises one or more roller assemblies adapted to hold a substrate in a substantially vertical orientation. Each inner module contains a transducer adapted to direct vibrational energy through the processing fluid toward the substrates.
摘要翻译：本文所述的实施例涉及半导体器件制造，更具体地，涉及用于同时清洁多个基板的垂直取向的双兆赫模块。在一个实施例中，提供了一种用于清洁多个基板的装置。该装置包括用于收集包括至少一个侧壁和底部的溢流处理流体的外槽。适于容纳处理流体的第一内部模块部分地位于外部容器内。第一内部模块包括一个或多个辊组件以将基板保持在基本垂直的方向。适于容纳处理流体的第二内部模块部分地位于外部罐中。第二内部模块包括一个或多个辊组件，其适于将基板保持在基本垂直的方向。每个内部模块包含适于将振动能量通过处理流体引向基板的换能器。

8. 发明申请

WO2009126823A2 A POLISHING SYSTEM HAVING A TRACK 审中-公开
标题翻译：具有轨迹的抛光系统
公开(公告)号：WO2009126823A2
公开(公告)日：2009-10-15
申请号：PCT/US2009040099
申请日：2009-04-09
申请人： APPLIED MATERIALS INC , YILMAZ ALPAY , D AMBRA ALLEN L , RANGARAJAN JAGAN , KARUPPIAH LAKSHMANAN , TEPMAN AVI
发明人： YILMAZ ALPAY , D AMBRA ALLEN L , RANGARAJAN JAGAN , KARUPPIAH LAKSHMANAN , TEPMAN AVI
IPC分类号： H01L21/304 , B24B37/04
CPC分类号： B24B37/04 , B24B41/047 , B24B45/003
摘要： Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.
摘要翻译：本文所述的实施例涉及抛光系统中的轨道系统。本文所述的一个实施例提供了一种配置成在抛光系统中传送抛光头的轨道系统。轨道系统包括支撑框架，轨道，其联接到支撑框架并且限定抛光头被配置为移动的路径，以及一个或多个托架，其构造成沿着由轨道限定的路径承载至少一个抛光头，其中所述一个或多个托架联接到所述轨道并且可以沿着所述轨道独立地移动。

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