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1. 发明申请

WO2009131945A3 HIGH THROUGHPUT CHEMICAL MECHANICAL POLISHING SYSTEM 审中-公开
标题翻译：高通量化学机械抛光系统
公开(公告)号：WO2009131945A3
公开(公告)日：2010-02-18
申请号：PCT/US2009041133
申请日：2009-04-20
申请人： APPLIED MATERIALS INC , D AMBRA ALLEN L , YILMAZ ALPAY
发明人： D AMBRA ALLEN L , YILMAZ ALPAY
IPC分类号： H01L21/304
CPC分类号： B24B37/345 , B24B27/0076 , B24B37/042 , B24B41/005
摘要： Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.
摘要翻译：提供了用于抛光基板的系统和方法的实施例。在一个实施例中，提供了包括抛光模块，清洁器和机器人的抛光系统。机器人具有足以在抛光模块和清洁器之间传送基板的运动范围。抛光模块包括至少两个抛光台，至少一个装载杯和至少四个抛光头。抛光头构造成在至少两个抛光台和至少一个装载杯之间独立地移动。

2. 发明申请

WO2009126823A2 A POLISHING SYSTEM HAVING A TRACK 审中-公开
标题翻译：具有轨迹的抛光系统
公开(公告)号：WO2009126823A2
公开(公告)日：2009-10-15
申请号：PCT/US2009040099
申请日：2009-04-09
申请人： APPLIED MATERIALS INC , YILMAZ ALPAY , D AMBRA ALLEN L , RANGARAJAN JAGAN , KARUPPIAH LAKSHMANAN , TEPMAN AVI
发明人： YILMAZ ALPAY , D AMBRA ALLEN L , RANGARAJAN JAGAN , KARUPPIAH LAKSHMANAN , TEPMAN AVI
IPC分类号： H01L21/304 , B24B37/04
CPC分类号： B24B37/04 , B24B41/047 , B24B45/003
摘要： Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.
摘要翻译：本文所述的实施例涉及抛光系统中的轨道系统。本文所述的一个实施例提供了一种配置成在抛光系统中传送抛光头的轨道系统。轨道系统包括支撑框架，轨道，其联接到支撑框架并且限定抛光头被配置为移动的路径，以及一个或多个托架，其构造成沿着由轨道限定的路径承载至少一个抛光头，其中所述一个或多个托架联接到所述轨道并且可以沿着所述轨道独立地移动。

3. 发明申请

WO2008008822A3 CONDITIONING DISK HAVING UNIFORM STRUCTURES 审中-公开
标题翻译：具有均匀结构的调节盘
公开(公告)号：WO2008008822A3
公开(公告)日：2008-07-03
申请号：PCT/US2007073239
申请日：2007-07-11
申请人： APPLIED MATERIALS INC , YILMAZ ALPAY , OZGUN OMER , ALONZO GERALD J , KARUPPIAH LAKSHMANAN , CHANG SHOU SUNG , MANENS ANTOINE , SAKATA CLINTON
发明人： YILMAZ ALPAY , OZGUN OMER , ALONZO GERALD J , KARUPPIAH LAKSHMANAN , CHANG SHOU SUNG , MANENS ANTOINE , SAKATA CLINTON
IPC分类号： B24B53/00
CPC分类号： B24B53/017
摘要： A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate, and an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.
摘要翻译：描述了用于调节导电抛光材料的方法和设备。在一个实施例中，垫修整器包括适于联接到调节头组件的垫板，垫板包括具有第一侧和相对的第二侧的刚性盘，第二侧具有与垫的中心线垂直的方向以及环形构件，其具有粘附到所述背板的所述第二侧的基部，其中所述环形构件限定与所述第二侧相对的调节表面，所述调节表面相对于所述第二侧的平面径向倾斜。

4. 发明申请

WO2010002595A3 MODULAR BASE-PLATE SEMICONDUCTOR POLISHER ARCHITECTURE 审中-公开
标题翻译：模块化基板半导体抛光体系结构
公开(公告)号：WO2010002595A3
公开(公告)日：2010-05-06
申请号：PCT/US2009047689
申请日：2009-06-17
申请人： APPLIED MATERIALS INC , YILMAZ ALPAY
发明人： YILMAZ ALPAY
IPC分类号： H01L21/304
CPC分类号： B24B37/345
摘要： The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system.
摘要翻译：本发明一般涉及一种抛光系统。特别地，本发明涉及具有一个或多个模块化抛光站的抛光装置和可移动地连接到传送系统的多个抛光头。

5. 发明申请

WO2006071406A2 METHOD FOR SEQUENCING SUBSTRATES 审中-公开
标题翻译：测序基质的方法
公开(公告)号：WO2006071406A2
公开(公告)日：2006-07-06
申请号：PCT/US2005042169
申请日：2005-11-16
申请人： APPLIED MATERIALS INC , YILMAZ ALPAY , ALONZO GERALD
发明人： YILMAZ ALPAY , ALONZO GERALD
IPC分类号： H01L21/00
CPC分类号： H01L21/67276 , H01L21/67778
摘要： Methods for transferring substrates in a system with a factory interface robot between at least one FOUP, a buffer coupled to a parasitic device and an inbound and outbound transfer station coupled to a processing tool are provided. In one embodiment, a method for transferring substrates includes transferring a first substrate on an end effector of a robot from a FOUP to a buffer station serving a parasitic device, moving the substrate from the buffer station into the parasitic device, picking up a second substrate on the end effector, compensating for a residence time of the first substrate in the parasitic device, transferring the second substrate to parasitic device from the end effector to the buffer station serving the parasitic device, and picking up the first substrate from the buffer station.
摘要翻译：提供了用于在具有至少一个FOUP，耦合到寄生装置的缓冲器和耦合到处理工具的入站和出站传输站之间的工厂接口机器人的系统中传输衬底的方法。在一个实施例中，一种用于传送基板的方法包括：将机器人的末端执行器上的第一基板从FOUP传送到用作寄生设备的缓冲站;将基板从缓冲站移动到寄生设备中;拾取第二基板在末端执行器上补偿第一衬底在寄生装置中的停留时间;将第二衬底从寄生装置转移到端部执行器到缓冲台，为寄生装置提供服务;以及从缓冲站拾取第一衬底。

6. 发明申请

WO2010019339A3 METHOD FOR AN IMPROVED CHEMICAL MECHANICAL POLISHING SYSTEM 审中-公开
标题翻译：一种改进的化学机械抛光系统的方法
公开(公告)号：WO2010019339A3
公开(公告)日：2010-06-03
申请号：PCT/US2009050663
申请日：2009-07-15
申请人： APPLIED MATERIALS INC , WANG YULIN , NANGOY ROY , YILMAZ ALPAY
发明人： WANG YULIN , NANGOY ROY , YILMAZ ALPAY
IPC分类号： H01L21/304
CPC分类号： H01L21/3212 , B24B37/042 , B24B53/017
摘要： A method for polishing a substrate on a pad large enough to accommodate polishing at least two substrates simultaneously The method includes simultaneously pressing a first substrate and a second substrate against a single polishing surface of a polishing module, providing polishing fluid from a first fluid delivery arm in front of the first substrate while the first substrate is pressed against the polishing surface, providing polishing fluid from a second fluid delivery arm at a location in front of the second substrate while the second substrate is pressed against the polishing surface, conditioning the polishing surface with a first conditioner at a location behind the first substrate while the first substrate is pressed against the polishing surface, and conditioning the polishing surface with a second conditioner at a location behind the second substrate while the second substrate is pressed against the polishing surface.
摘要翻译：一种用于抛光垫上的衬底的方法，该衬底足够大以允许同时抛光至少两个衬底。该方法包括：将第一衬底和第二衬底同时压靠抛光模块的单个抛光表面，从第一流体递送臂在第一衬底被压靠在抛光表面上的同时在第一衬底的前方，在第二衬底被压靠在抛光表面上的同时，在第二衬底前方的位置处从第二流体递送臂提供抛光流体，调节抛光表面当第一衬底被压靠在抛光表面上时，在第一衬底后面的位置处具有第一调节器，并且在第二衬底被压靠在抛光表面上的同时，在第二衬底后面的位置处用第二调节器调节抛光表面。

7. 发明申请

WO2007094869A2 ELECTROCHEMICAL METHOD FOR ECMP POLISHING PAD CONDITIONING 审中-公开
标题翻译：用于ECMP抛光垫调节的电化学方法
公开(公告)号：WO2007094869A2
公开(公告)日：2007-08-23
申请号：PCT/US2006060346
申请日：2006-10-30
申请人： APPLIED MATERIALS INC , WANG YOU , TSAI STAN D , KARUPPIAH LAKSH , DIAO JIE , JIA RENHE , YILMAZ ALPAY
发明人： WANG YOU , TSAI STAN D , KARUPPIAH LAKSH , DIAO JIE , JIA RENHE , YILMAZ ALPAY
CPC分类号： B23H5/08 , B24B37/042 , B24B37/046 , B24B53/017 , C25F1/00 , H01L21/32125
摘要： A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.
摘要翻译：提供了一种调节Ecmp垫的方法。在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬垫组件的顶表面和电极之间提供电偏置电压，以及电化学去除衬垫顶表面的污染物。

8. 发明申请

WO2010059645A3 METHOD AND APPARATUS FOR LINEAR PAD CONDITIONING 审中-公开
标题翻译：线性条件调节的方法和装置
公开(公告)号：WO2010059645A3
公开(公告)日：2010-08-26
申请号：PCT/US2009064855
申请日：2009-11-17
申请人： APPLIED MATERIALS INC , YILMAZ ALPAY , GOLUBOVSKY EDWARD , RANGARAJAN JAGAN
发明人： YILMAZ ALPAY , GOLUBOVSKY EDWARD , RANGARAJAN JAGAN
IPC分类号： H01L21/304
CPC分类号： B24B53/017
摘要： A method and apparatus for conditioning a polishing pad is described. The apparatus includes a base coupled to a platform, a first arm member having a first end coupled to the base, and a second arm member having a first end pivotably coupled to a second end of the first arm member and a conditioning disk coupled to a second end opposite the first end. The method includes rotating a polishing pad, urging a rotating conditioning disk against a polishing surface of the polishing pad, and moving the conditioning disk in a linear direction relative to the rotating polishing pad to perform a conditioning process.
摘要翻译：描述了一种用于调节抛光垫的方法和装置。该装置包括联接到平台的基座，具有联接到基座的第一端的第一臂构件和第二臂构件，第二臂构件具有可枢转地联接到第一臂构件的第二端的第一端和联接到第一臂构件的调节盘第二端与第一端相对。该方法包括旋转抛光垫，将旋转的调节盘推向抛光垫的抛光表面，并相对于旋转的抛光垫沿直线方向移动调节盘以执行调节处理。

9. 发明申请

WO2010019264A3 CHEMICAL MECHANICAL POLISHER HAVING MOVABLE SLURRY DISPENSERS AND METHOD 审中-公开
标题翻译：具有可移动浆料分配器的化学机械抛光剂和方法
公开(公告)号：WO2010019264A3
公开(公告)日：2010-05-20
申请号：PCT/US2009004667
申请日：2009-08-14
申请人： APPLIED MATERIALS INC , WANG YULIN , YILMAZ ALPAY
发明人： WANG YULIN , YILMAZ ALPAY
IPC分类号： H01L21/304 , B24B37/04
CPC分类号： B24B37/04 , B24B57/02
摘要： A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, first and second substrate carriers that are each capable of holding a substrate against the polishing pad and first and second movable slurry dispansers. The movable slurry dispenser comprises (i) an arm comprising a pivoting end and a distal end, (ii) at least one slurry dispensing nozzle on the distal end, and (iii) a dispenser drive capable of rotating the arm about the pivoting end to swing the slurry dispensing nozzle at the distal end to dispense slurry across the polishing platen. In another version, the movable slurry dispenser comprises a hinged arm having a plurality of sections that are joined at one or more hinge joints, a pivoting end and a distal end, and at least one slurry dispensing nozzle located at or near the distal end.
摘要翻译：化学机械抛光机包括能够支撑抛光垫的研磨台板，能够将基板保持在抛光垫上的第一和第二基板载体，以及第一和第二可动浆料分配器。可移动浆料分配器包括（i）包括枢转端和远端的臂，（ii）远端上的至少一个浆料分配喷嘴，以及（iii）能够将臂围绕枢转端旋转的分配器驱动器在远端摆动浆料分配喷嘴以将浆料分配在抛光台板上。在另一种形式中，可移动浆料分配器包括具有多个部分的铰接臂，所述多个部分在一个或多个铰链接头，枢转端和远端处连接，以及至少一个位于远端处或附近的浆料分配喷嘴。

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