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1. 发明申请

WO2004094702A3 MULTI-CHEMISTRY PLATING SYSTEM 审中-公开
标题翻译：多化学镀层系统
公开(公告)号：WO2004094702A3
公开(公告)日：2006-11-30
申请号：PCT/US2004012012
申请日：2004-04-16
申请人： APPLIED MATERIALS INC , YANG MICHAEL X , XI MING , ELLWANGER RUSSELL C , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
发明人： YANG MICHAEL X , XI MING , ELLWANGER RUSSELL C , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
IPC分类号： C25D7/12 , B08B3/02 , C25D5/00 , C25D17/00 , C25D17/02 , C25D19/00 , C25D21/00 , C25D21/08 , H01L21/00 , H01L21/68 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67167 , B08B3/02 , C25D5/003 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/02 , C25D21/08 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/68 , H01L21/6838 , H01L21/68707
摘要： Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
摘要翻译：本发明的实施方案通常提供电化学电镀系统。电镀系统包括位于与主机处理平台连通的基板装载站，位于主框架上的至少一个基板镀覆单元，位于主机上的至少一个基板斜面清洁单元，以及与主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

2. 发明申请

WO2004094702A8 MULTI-CHEMISTRY PLATING SYSTEM 审中-公开
标题翻译：多化学镀层系统
公开(公告)号：WO2004094702A8
公开(公告)日：2005-12-29
申请号：PCT/US2004012012
申请日：2004-04-16
申请人： APPLIED MATERIALS INC , YANG MICHAEL X , XI MING , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
发明人： YANG MICHAEL X , XI MING , ELLWANGER RUSSELL C , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
IPC分类号： B08B3/02 , C25D5/00 , C25D7/12 , C25D17/00 , C25D21/00 , C25D21/08 , H01L21/00 , H01L21/68 , H01L21/683 , H01L21/687 , C25D
CPC分类号： H01L21/67167 , B08B3/02 , C25D5/003 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/02 , C25D21/08 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/68 , H01L21/6838 , H01L21/68707
摘要： Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
摘要翻译：本发明的实施方案通常提供电化学电镀系统。所述电镀系统包括基板装载站，所述基板装载站定位成与主机处理平台连通，至少一个位于所述主机上的基板电镀单元，位于所述主机上的至少一个基板斜面清洁单元，以及与主机和加载站中的至少一个，层叠基板退火站中的每个室具有加热板，冷却板和基板传送机器人。

3. 发明申请

WO03017337A9 SHIELD FOR CAPTURING FLUIDS DISPLACED FROM A SUBSTRATE 审中-公开
标题翻译：用于捕获从基板排出的液体的屏蔽
公开(公告)号：WO03017337A9
公开(公告)日：2004-04-29
申请号：PCT/US0225685
申请日：2002-08-13
申请人： APPLIED MATERIALS INC
发明人： DONOSO BERNARDO
IPC分类号： B08B3/02 , H01L21/00
CPC分类号： H01L21/6708 , B08B3/02 , H01L21/67051
摘要： In a first aspect, a system is provided that includes (1) a substrate support (104) adapted to hold and rotate a substrate (5); (2) a source of fluid adapted to supply fluid to a surface of a substrate (5) held by the substrate support (104); and (3) a shield (116) positioned to capture fluid supplied by the source of fluid and displaced from a substrate (5) held and rotated by the substrate support (104). The shield (116) includes a radiused surface (204) adapted to carry the captured fluid away from the substrate (5) held by the substrate support (104). Apparatus and methods in accordance with this and other aspects also are provided.
摘要翻译：在第一方面，提供了一种系统，其包括（1）适于保持和旋转衬底（5）的衬底支撑件（104）; （2）适于将流体供应到由所述基板支撑件（104）保持的基板（5）的表面的流体源; 以及（3）定位成捕获由流体源供应并从由基板支撑件（104）保持和旋转的基板（5）移位的流体的屏蔽件（116）。护罩（116）包括适于将被捕获的流体远离由衬底支撑件（104）保持的衬底（5）运送的圆角表面（204）。还提供了根据这个和其它方面的装置和方法。

4. 发明申请

WO03017338A3 WAFER CHUCK WITH PLUNGER 审中-公开
标题翻译：带有柱塞的晶片夹头
公开(公告)号：WO03017338A3
公开(公告)日：2003-08-14
申请号：PCT/US0225847
申请日：2002-08-14
申请人： APPLIED MATERIALS INC
发明人： DONOSO BERNARDO , MOK YEUK-FAI EDWIN
IPC分类号： B25B11/00 , H01L21/683 , H01L21/687 , H01L21/00 , H01L21/68
CPC分类号： H01L21/6831 , B25B11/005 , H01L21/6838 , H01L21/68785 , Y10T279/11
摘要： A wafer chuck is provided, having a wafer chucking surface, and a plunger consisting either of a body that extends at least partially along the outer perimeter of the wafer chucking surface, or a plurality of pins positioned outside the wafer chucking surface. The plunger may be normally biased to extend past the wafer chucking surface and/or may be adapted not to rotate with the wafer chucking surface. The plunger bias may be achieved via one or more vacuum bellows.
摘要翻译：晶片卡盘设置，具有晶片卡紧表面和柱塞组成，要么沿着晶片夹持面的外周，或多个位于晶片夹持表面的外侧销至少部分地延伸的本体的。柱塞可以通常被偏置以延伸越过晶片夹持表面和/或可以适于不与晶片夹持表面一起旋转。柱塞偏压可以通过一个或多个真空波纹管来实现。

5. 发明申请

WO0205333A3 DUAL POST CENTRIFUGAL WAFER CLIP FOR SPIN RINSE DRY UNIT 审中-公开
标题翻译：用于旋转干燥单元的双离心离心卷片
公开(公告)号：WO0205333A3
公开(公告)日：2002-05-30
申请号：PCT/US0141255
申请日：2001-07-03
申请人： APPLIED MATERIALS INC
发明人： DONOSO BERNARDO , STEVENS JOSEPH J , OLGADO DONALD J , KO ALEXANDER SOU-KANG
IPC分类号： H01L21/00 , H01L21/687
CPC分类号： H01L21/68728 , H01L21/67034 , Y10T29/49998
摘要： An apparatus and associated method for securing a wafer to a SRD spider, the SRD spider has a plurality of spider arms. The apparatus includes a plurality of spaced surfaces disposed on a distal end of one of the spider arms, each of the surfaces being spaced perpendicularly from the longitudinal axis of the spider arm. In one aspect, the two surfaces are positioned to limit production of a wedging force between that spaced surface and the wafer. In one embodiment, a post at least partially defines each one of the plurality of spaced surfaces.
摘要翻译：一种用于将晶片固定到SRD蜘蛛的装置和相关方法，SRD蜘蛛具有多个蜘蛛臂。该装置包括设置在一个蜘蛛臂的远端上的多个间隔表面，每个表面与该蜘蛛臂的纵向轴线垂直地间隔开。在一个方面，两个表面被定位成限制在该间隔表面和晶片之间的楔入力的产生。在一个实施例中，柱至少部分地限定多个间隔开的表面中的每一个。

6. 发明申请

WO03017339A2 METHOD AND APPARATUS FOR POSITONING A WAFER CHUCK 审中-公开
标题翻译：用于定位晶片夹头的方法和设备
公开(公告)号：WO03017339A2
公开(公告)日：2003-02-27
申请号：PCT/US0225851
申请日：2002-08-14
申请人： APPLIED MATERIALS INC
发明人： DONOSO BERNARDO
IPC分类号： H01L21/68 , H01L21/00
CPC分类号： H01L21/68
摘要： A wafer chuck comprises a wafer chucking surface, a fixable rotary which allows the wafer chucking surface to rotate to adjust and fix pitch, and a planar joint which allows the wafer chucking surface to translate and fix position in order to center the wafer chucking surface with respect to another surface. An inventive assembly comprises a wafer chucking surface, and a wafer exchange surface, opposite the wafer chucking surface. The wafer exchange surface is mounted via a fixable rotary joint and a planar joint and allows the wafer exchange surface to rotate and to translate so as to fix the pitch and position of the wafer exchange surface to level and center the wafer exchange surface relative to the wafer chucking surface. Alternatively the fixable rotary and/or planar joints may be coupled to the wafer chucking surface. A calibration jig having rough and fine centering pins may be included.
摘要翻译：晶片卡盘包括晶片卡盘表面，允许晶片卡盘表面旋转以调节和固定节距的可固定旋转器，以及允许晶片卡盘表面平移和固定位置以使晶片卡盘表面居中尊重另一面。本发明的组件包括晶片夹持表面和与晶片夹持表面相对的晶片交换表面。晶片交换表面通过可固定的旋转接头和平面接头安装，并且允许晶片交换表面旋转和平移以便固定晶片交换表面的间距和位置以使晶片交换表面相对于晶圆夹持表面。或者，可固定的旋转和/或平面接头可以连接到晶片夹持表面。可以包括具有粗调和精调定位销的校准夹具。

7. 发明申请

WO0229862A3 INTEGRATED SEMICONDUCTOR SUBSTRATE BEVEL CLEANING APPARATUS AND METHOD 审中-公开
标题翻译：集成半导体衬底水平清洁装置和方法
公开(公告)号：WO0229862A3
公开(公告)日：2003-01-23
申请号：PCT/US0142412
申请日：2001-10-01
申请人： APPLIED MATERIALS INC
发明人： MOK YEUK-FAI EDWIN , KO ALEXANDER , DONOSO BERNARDO , STEVENS JOSEPH J
IPC分类号： H01L21/00
CPC分类号： H01L21/67161 , H01L21/67051 , H01L21/6708 , H01L21/67207 , H01L21/67219 , H01L21/6723
摘要： An integrated semiconductor substrate bevel cleaning system that enables transfer of substrates through the bevel cleaner either with or without substrate processing within the bevel cleaner. The invention provides an integrated bevel cleaning apparatus comprising a transfer position, a rinsing position and an etching position.
摘要翻译：一种集成半导体衬底斜面清洁系统，其能够在斜面清洁器内进行衬底处理或不进行衬底处理，从而能够将衬底传送通过斜面清本发明提供一种包括转印位置，漂洗位置和蚀刻位置的整体式斜面清洁设备。

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