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    • 9. 发明申请
    • FORMATION OF A SILICON OXYNITRIDE LAYER ON A HIGH-K DIELECTRIC MATERIAL
    • 在高K电介质材料上形成硅氧烷层
    • WO2005117087A1
    • 2005-12-08
    • PCT/US2005/016690
    • 2005-05-12
    • APPLIED MATERIALS, INC.NARWANKAR, Pravin K.HIGASHI, Gregg
    • NARWANKAR, Pravin K.HIGASHI, Gregg
    • H01L21/314
    • H01L21/3141C23C16/401H01L21/3143
    • Embodiments of the invention provide methods for depositing a capping layer on a dielectric layer disposed on a substrate. In one example, a process includes exposing a substrate to a deposition process to form a dielectric layer thereon, exposing the substrate to sequential pulses of a silicon precursor and an oxidizing gas to form a silicon-containing layer on the dielectric layer during a deposition process, exposing the substrate to a nitridation process to form a capping layer thereon and exposing the substrate to an annealing process for a predetermined time. The capping layer may a thickness of about 5 Å or less. In one example, the oxidizing gas contains water vapor derived from a hydrogen source gas and an oxygen source gas processed by a water vapor generator containing a catalyst. In another example, the deposition, nitridation and annealing processes occur in the same process chamber.
    • 本发明的实施例提供了在设置在基底上的电介质层上沉积覆盖层的方法。 在一个实例中,一种方法包括将衬底暴露于沉积工艺以在其上形成介电层,将衬底暴露于硅前体和氧化气体的顺序脉冲,以在沉积过程中在电介质层上形成含硅层 将衬底暴露于氮化工艺以在其上形成覆盖层,并将衬底暴露于退火过程达预定时间。 封盖层可以具有大约或更小的厚度。 在一个实例中,氧化气体含有源自氢源气体的水蒸汽和由含有催化剂的水蒸气发生器处理的氧源气体。 在另一个实例中,沉积,氮化和退火过程发生在相同的处理室中。