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1. 发明申请

WO2013162697A1 METHOD AND APPARATUS FOR SUBSTRATE SUPPORT WITH MULTI-ZONE HEATING 审中-公开
标题翻译：用于多层加热的基板支撑的方法和装置
公开(公告)号：WO2013162697A1
公开(公告)日：2013-10-31
申请号：PCT/US2013/027824
申请日：2013-02-26
申请人： APPLIED MATERIALS, INC. , YANG, Yao-Hung , OH, Jeonghoon , HOOSHDARAN, Frank F. , CHO, Tom K. , HOU, Tao
发明人： YANG, Yao-Hung , OH, Jeonghoon , HOOSHDARAN, Frank F. , CHO, Tom K. , HOU, Tao
IPC分类号： H01L21/683 , H01L21/205 , H05B3/20 , C23C16/46
CPC分类号： H05B3/12 , H01L21/67103 , H01L21/67248 , H05B1/0233
摘要： Methods and substrate processing systems are provided for controlling substrate heating efficiency and generating a desired temperature profile on the surface of a substrate when the substrate is disposed on a substrate support surface of a substrate support assembly. The substrate support assembly is provided with minimum software control and hardware requirement and includes a heating element comprised of multiple heating elements sections. The heating element is connected to a power source for adjusting the temperature outputs of the multiple heating element sections and providing adjustable multi-heating zones and desired temperature distribution over the substrate support surface of the substrate support assembly within a process chamber.
摘要翻译：提供了方法和衬底处理系统，用于当衬底设置在衬底支撑组件的衬底支撑表面上时，用于控制衬底加热效率并在衬底的表面上产生期望的温度分布。基板支撑组件具有最小的软件控制和硬件要求，并且包括由多个加热元件部分组成的加热元件。加热元件连接到用于调节多个加热元件部分的温度输出的电源并且在处理室内的基板支撑组件的基板支撑表面上提供可调节的多加热区域和期望的温度分布。

2. 发明申请

WO2011009007A2 IMPROVED LIFT PIN GUIDES 审中-公开
标题翻译：改进的提升引脚指南
公开(公告)号：WO2011009007A2
公开(公告)日：2011-01-20
申请号：PCT/US2010042199
申请日：2010-07-15
申请人： APPLIED MATERIALS INC , PAI UDAY , LOPEZ OSCAR , OH JEONGHOON , CHO TOM K , WHITE JOHN M , JAMES SILJA , POLYAK ALEXANDER S
发明人： PAI UDAY , LOPEZ OSCAR , OH JEONGHOON , CHO TOM K , WHITE JOHN M , JAMES SILJA , POLYAK ALEXANDER S
IPC分类号： H01L21/68 , G02F1/13 , H01L21/205
CPC分类号： H01L21/68742 , C23C14/50 , C23C16/4586
摘要： Lift pin guides include bearing elements with rollers having liners comprised of a material that provides both self lubrication and cushioning in order to prevent lift pin binding and extend the life of the lift pins and the lift pin guides. In one embodiment, each lift pin guide includes an upper bearing element near the upper surface of a substrate support and a lower bearing element disposed a distance beneath the substrate support in order to reduce stresses experienced by the lift pin. The lift pin guides may be used in a vacuum deposition chamber adapted to deposit materials onto substrates to form electronic devices such as thin film transistors, organic light emitting diodes, photovoltaic devices or solar cells, including chemical vapor deposition chambers and physical vapor deposition chambers. The lift pin guides may also be used in load lock chambers, etching chambers or other applications where lift pins are utilized.
摘要翻译：升降销引导件包括具有滚子的轴承元件，滚子具有由既提供自润滑又提供缓冲的材料组成的衬垫，以防止提升销结合并延长提升销和提升销引导件的寿命。在一个实施例中，每个提升销引导件包括靠近衬底支撑件的上表面的上支撑元件和布置在衬底支撑件下方一段距离处的下支撑元件，以便减少提升销所经受的应力。提升销引导件可以用于真空沉积室中，该真空沉积室适于将材料沉积到基底上以形成电子装置，例如薄膜晶体管，有机发光二极管，光伏装置或太阳能电池，包括化学气相沉积室和物理气相沉积室。升降杆引导件也可用于负载锁定室，蚀刻室或使用升降杆的其他应用场合。

3. 发明申请

WO2009012444A1 RETAINING RING WITH SHAPED PROFILE 审中-公开
标题翻译：具有形状轮廓的保持环
公开(公告)号：WO2009012444A1
公开(公告)日：2009-01-22
申请号：PCT/US2008/070463
申请日：2008-07-18
申请人： APPLIED MATERIALS, INC. , PRABHU, Gopalakrishna B. , YUAN, Yin , OH, Jeonghoon , MENK, Gregory E.
发明人： PRABHU, Gopalakrishna B. , YUAN, Yin , OH, Jeonghoon , MENK, Gregory E.
IPC分类号： B24B37/04 , B24B41/06
CPC分类号： B24B37/32 , H01L21/68721 , Y10T292/205
摘要： Retaining rings with curved or chamfered surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved or chamfered surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.
摘要翻译：描述具有弯曲或倒角表面的保持环。当在抛光过程中使用保持环时，弯曲表面可防止固定磨料抛光垫的损坏。弯曲或倒角的表面位于环的底表面上，例如沿着形成在环的底部的通道的外径和/或沿着通道的侧壁。

4. 发明申请

WO2007143566A3 FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP 审中-公开
标题翻译：快速底板装载在无膜渗透步骤的抛光头上
公开(公告)号：WO2007143566A3
公开(公告)日：2008-09-18
申请号：PCT/US2007070243
申请日：2007-06-01
申请人： APPLIED MATERIALS INC , CHEN HUNG CHIH , OH JEONGHOON , NAGENGAST ANDREW , ZUNIGA STEVEN M
发明人： CHEN HUNG CHIH , OH JEONGHOON , NAGENGAST ANDREW , ZUNIGA STEVEN M
IPC分类号： B23B31/30
CPC分类号： H01L21/6838 , B24B37/30 , H01L21/67005 , Y10T29/5313 , Y10T279/11
摘要： The present invention relates to an apparatus and method for improving and speeding up a substrate loading process. The apparatus (200) includes a base member (208) having a bottom surface (209) with a plurality of recesses (210) formed therein and passages (224,225) formed within to pump a control gas in or out. The apparatus also includes a flexible membrane (205) that forms a center chamber (206) and an edge chamber (207) that may be inflated and deflated independently. A substrate support (201) is used to load a substrate (202) on the apparatus.
摘要翻译：本发明涉及一种用于改善和加速衬底加载过程的装置和方法。设备（200）包括具有形成在其中的多个凹部（210）的底表面（209）的底部构件（208）和形成在其中以便将控制气体输入或输出的通道（224,225）。该装置还包括形成可以独立地充气和放气的中心室（206）和边缘室（207）的柔性膜（205）。衬底支撑件（201）用于将衬底（202）装载在设备上。

5. 发明申请

WO2007143566A2 FAST SUBSTRATE LOADING ON POLISHING HEAD WITHOUT MEMBRANE INFLATION STEP 审中-公开
标题翻译：快速底板装载在无膜渗透步骤的抛光头上
公开(公告)号：WO2007143566A2
公开(公告)日：2007-12-13
申请号：PCT/US2007/070243
申请日：2007-06-01
申请人： APPLIED MATERIALS, INC. , CHEN, Hung Chih , OH, Jeonghoon , NAGENGAST, Andrew , ZUNIGA, Steven, M.
发明人： CHEN, Hung Chih , OH, Jeonghoon , NAGENGAST, Andrew , ZUNIGA, Steven, M.
IPC分类号： H05K13/04
CPC分类号： H01L21/6838 , B24B37/30 , H01L21/67005 , Y10T29/5313 , Y10T279/11
摘要： The present invention relates to an apparatus and method for improving and speeding up substrate loading process. One embodiment provides a method for vacuum chucking a substrate. The method comprises venting a center chamber of a flexible membrane configured for mounting the substrate, moving the substrate such that a backside of the substrate is in full contact with the flexible membrane, and vacuuming the center chamber to vacuum chuck the backside of the substrate to the flexible membrane.
摘要翻译：本发明涉及一种用于改善和加速基板加载过程的装置和方法。一个实施例提供了用于真空吸附衬底的方法。该方法包括将配置用于安装衬底的柔性膜的中心室排出，移动衬底，使得衬底的背面与柔性膜完全接触，并且抽真空中心室以真空吸附衬底的背面至柔性膜。

6. 发明申请

WO2013162774A1 METHOD AND APPARATUS FOR INDEPENDENT WAFER HANDLING 审中-公开
标题翻译：用于独立水处理的方法和装置
公开(公告)号：WO2013162774A1
公开(公告)日：2013-10-31
申请号：PCT/US2013/032542
申请日：2013-03-15
申请人： APPLIED MATERIALS, INC. , YANG, Yao-Hung , OH, Jeonghoon , HOOSHDARAN, Frank F. , CHO, Tom K. , HOU, Tao , GUO, Yuanhung
发明人： YANG, Yao-Hung , OH, Jeonghoon , HOOSHDARAN, Frank F. , CHO, Tom K. , HOU, Tao , GUO, Yuanhung
IPC分类号： H01L21/683 , H01L21/677
CPC分类号： H01L21/67739 , H01L21/67742 , H01L21/67748 , H01L21/683 , H01L21/68742
摘要： A substrate processing system with independent substrate placement capability to two or more substrate support assemblies is provided. Two different sets of fixed-length lift pins are disposed on two or more substrate support lift pin assemblies of two or more process chambers, where the length of each lift pin in one process chamber is different from the length of each lift pin in another process chamber. The substrate processing system includes simplified mechanical substrate support lift pin mechanisms and minimum accessory parts cooperating with a substrate transfer mechanism (e.g., a transfer robot) for efficient and independent loading, unloading, and transfer of one or more substrates between two or more processing regions in a twin chamber or between two or more process chambers. A method for positioning one or more substrates to be loaded, unloaded, or processed independently or simultaneously in two or more processing regions or process chambers is provided.
摘要翻译：提供了一种对两个或更多个基板支撑组件具有独立的基板放置能力的基板处理系统。两个不同组的固定长度提升销设置在两个或更多个处理室的两个或更多个基板支撑提升销组件上，其中一个处理室中的每个提升销的长度在另一个过程中与每个提升销的长度不同室。基板处理系统包括简化的机械基板支撑提升销机构和与基板传送机构（例如，传送机器人）协作的最小附件部件，用于在两个或多个处理区域之间有效且独立地加载，卸载和传送一个或多个基板在双室中或两个或更多个处理室之间。提供了一种用于定位要在两个或更多个处理区域或处理室中单独或同时加载，卸载或处理的一个或多个基板的方法。

7. 发明申请

WO2011008805A3 PROCESSING CHAMBER WITH TRANSLATING WEAR PLATE FOR LIFT PIN 审中-公开
标题翻译：带升降磨损板的升降室
公开(公告)号：WO2011008805A3
公开(公告)日：2011-05-05
申请号：PCT/US2010041895
申请日：2010-07-14
申请人： APPLIED MATERIALS INC , WHITE JOHN M , OH JEONGHOON , CHO TOM K , JAMES SILJA , PAI UDAY , LOPEZ OSCAR , POLYAK ALEXANDER S
发明人： WHITE JOHN M , OH JEONGHOON , CHO TOM K , JAMES SILJA , PAI UDAY , LOPEZ OSCAR , POLYAK ALEXANDER S
IPC分类号： H01L21/68 , G02F1/13 , H01L21/02 , H01L21/683
CPC分类号： H01L21/68742
摘要： Embodiments of a method and apparatus for processing large area substrates including a translational wear plate and/or bushing assembly are provided for reducing the stress on a lift pin used to space substrates from a substrate support in a processing or other type of chamber. In another embodiment, an apparatus for processing substrates includes processing chamber comprising a substrate support disposed in a chamber body. A bushing assembly is disposed in the substrate support. A lift pin is disposed through the bushing assembly. A wear plate is provided that is coupled to the chamber body and aligned with the lift pin. The wear plate is movable laterally relative to a centerline of the chamber body to accommodate lateral motion of the lift pin when contacting the wear plate.
摘要翻译：提供了用于处理包括平移磨损板和/或衬套组件的大面积衬底的方法和装置的实施例，用于减小用于在衬底支撑件上在处理室或其他类型的室中间隔衬底的提升销上的应力。在另一个实施例中，一种用于处理基板的装置包括处理室，该处理室包括设置在室体中的基板支撑件衬套组件设置在衬底支撑件中。升降销穿过套管组件布置。提供磨损板，该磨损板联接到腔体并与升降销对齐。耐磨板可相对于腔室主体的中心线横向移动，以在接触耐磨板时适应提升销的横向运动。

8. 发明申请

WO2011008805A2 PROCESSING CHAMBER WITH TRANSLATING WEAR PLATE FOR LIFT PIN 审中-公开
标题翻译：加工室用翻转式打码机
公开(公告)号：WO2011008805A2
公开(公告)日：2011-01-20
申请号：PCT/US2010/041895
申请日：2010-07-14
申请人： APPLIED MATERIALS, INC. , WHITE, John, M. , OH, Jeonghoon , CHO, Tom, K. , JAMES, Silja , PAI, Uday , LOPEZ, Oscar , POLYAK, Alexander, S.
发明人： WHITE, John, M. , OH, Jeonghoon , CHO, Tom, K. , JAMES, Silja , PAI, Uday , LOPEZ, Oscar , POLYAK, Alexander, S.
IPC分类号： H01L21/68 , H01L21/683 , H01L21/02 , G02F1/13
CPC分类号： H01L21/68742
摘要： Embodiments of a method and apparatus for processing large area substrates including a translational wear plate and/or bushing assembly are provided for reducing the stress on a lift pin used to space substrates from a substrate support in a processing or other type of chamber. In another embodiment, an apparatus for processing substrates includes processing chamber comprising a substrate support disposed in a chamber body. A bushing assembly is disposed in the substrate support. A lift pin is disposed through the bushing assembly. A wear plate is provided that is coupled to the chamber body and aligned with the lift pin. The wear plate is movable laterally relative to a centerline of the chamber body to accommodate lateral motion of the lift pin when contacting the wear plate.
摘要翻译：提供了用于处理包括平移耐磨板和/或衬套组件的大面积衬底的方法和装置的实施例，用于减小用于将衬底从处理或其它类型的室中的衬底支撑件定位的升降销上的应力。在另一个实施例中，一种用于处理衬底的设备包括处理室，其包括设置在室主体中的衬底支撑件。衬套组件设置在衬底支撑件中。提升销设置穿过套管组件。提供了耐磨板，其连接到腔室主体并与提升销对准。耐磨板相对于室主体的中心线横向运动，以在接触耐磨板时适应提升销的横向运动。

9. 发明申请

WO2009120804A2 IMPROVED PAD PROPERTIES USING NANOPARTICLE ADDITIVES 审中-公开
标题翻译：使用纳米颗粒添加剂改进垫层性能
公开(公告)号：WO2009120804A2
公开(公告)日：2009-10-01
申请号：PCT/US2009038296
申请日：2009-03-25
申请人： APPLIED MATERIALS INC , M SAAD HICHEM , KARUPPIAH LAKSHMANAN , CHEN HUNG , OH JEONGHOON , LUM ROBERT , TSAI STAN , CONCEICAO CASSIO , BHATNAGGAR ASHISH , PERRY MICHAEL , NARENDRNATH KADTHALA , SHACHAM-DIAMAND YOSI
发明人： M SAAD HICHEM , KARUPPIAH LAKSHMANAN , CHEN HUNG , OH JEONGHOON , LUM ROBERT , TSAI STAN , CONCEICAO CASSIO , BHATNAGGAR ASHISH , PERRY MICHAEL , NARENDRNATH KADTHALA , SHACHAM-DIAMAND YOSI
IPC分类号： H01L21/304 , B24D11/00
CPC分类号： B24B37/24
摘要： A method for forming a polishing media and an article of manufacture is described. The article of manufacture may be formed into a polishing article. The polishing article includes a polymer base material and a plurality of nano-scale structures disposed in or on the polymer base material.
摘要翻译：描述了用于形成抛光介质和制造物品的方法。制品可以形成为抛光制品。抛光制品包括聚合物基材和设置在聚合物基材中或其上的多个纳米级结构。

10. 发明申请

WO2005049274A3 RETAINING RING WITH SHAPED SURFACE 审中-公开
公开(公告)号：WO2005049274A3
公开(公告)日：2005-11-03
申请号：PCT/US2004038083
申请日：2004-11-12
申请人： APPLIED MATERIALS INC , CHEN HUNG CHIH , ZUNIGA STEVEN M , GARRETSON CHARLES C , MCALLISTER DOUGLAS R , MEYER STACY , LIN JIAN , HUEY SIDNEY P , OH JEONGHOON , DOAN TRUNG T , SCHMIDT JEFFREY , WOHLERT MARTIN S , HUGHES KERRY F , WANG JAMES C , LU DANNY CAM TOAN , DELAMENIE ROMAIN BEAU , BALAGANI VENKATA R , ALLEN ADEN MARTIN , FONG MICHAEL JON
发明人： CHEN HUNG CHIH , ZUNIGA STEVEN M , GARRETSON CHARLES C , MCALLISTER DOUGLAS R , MEYER STACY , LIN JIAN , HUEY SIDNEY P , OH JEONGHOON , DOAN TRUNG T , SCHMIDT JEFFREY , WOHLERT MARTIN S , HUGHES KERRY F , WANG JAMES C , LU DANNY CAM TOAN , DELAMENIE ROMAIN BEAU , BALAGANI VENKATA R , ALLEN ADEN MARTIN , FONG MICHAEL JON
IPC分类号： B24B37/32 , B24B37/04
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portion. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

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