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1. 发明申请

WO2020244781A1 DEPOSITION SOURCE, DEPOSITION APPARATUS AND METHOD OF DEPOSITING MATERIAL ON A SUBSTRATE 审中-公开
公开(公告)号：WO2020244781A1
公开(公告)日：2020-12-10
申请号：PCT/EP2019/064985
申请日：2019-06-07
申请人： APPLIED MATERIALS, INC. , FRANKE, Sebastian , LOPP, Andreas , MÜLLER, Andreas , BANGERT, Stefan , KELLER, Stefan , BUSCHBECK, Wolfgang
发明人： FRANKE, Sebastian , LOPP, Andreas , MÜLLER, Andreas , BANGERT, Stefan , KELLER, Stefan , BUSCHBECK, Wolfgang
IPC分类号： C23C14/24 , C23C14/34 , C23C14/56 , C23C14/35 , C23C14/54 , H01J37/34 , H01L51/52
摘要： A deposition source (100) for depositing material on a substrate (10) is described. The deposition source (100) includes a sputter source (110). Further, the deposition source (100) includes a reflector shield arrangement (120) for reflecting material provided from the sputter source towards the substrate. Further, a deposition apparatus and a method of depositing material on a substrate are described.

2. 发明申请

WO2019007515A1 APPARATUS AND METHOD FOR HOLDING A SUBSTRATE 审中-公开
公开(公告)号：WO2019007515A1
公开(公告)日：2019-01-10
申请号：PCT/EP2017/066979
申请日：2017-07-06
申请人： APPLIED MATERIALS, INC. , SCHULTHEIS, Michael Rainer , LOPP, Andreas , BUSCHBECK, Wolfgang , HENRICH, Jürgen , BANGERT, Stefan
发明人： SCHULTHEIS, Michael Rainer , LOPP, Andreas , BUSCHBECK, Wolfgang , HENRICH, Jürgen , BANGERT, Stefan
IPC分类号： C23C14/04 , H01L21/683
摘要： The present disclosure provides an apparatus (100) for holding a substrate (10) or a mask in a vacuum deposition process. The apparatus (100) includes one or more first electrodes and one or more second electrodes connectable to a first power assembly (230) and one or more third electrodes arranged between the one or more first electrodes and the one or more second electrodes and connectable to a second power assembly (240).

3. 发明申请

WO2020108743A1 DEPOSITION SOURCE FOR DEPOSITING EVAPORATED MATERIAL, DEPOSITION APPARATUS, AND METHODS THEREFOR 审中-公开
公开(公告)号：WO2020108743A1
公开(公告)日：2020-06-04
申请号：PCT/EP2018/082796
申请日：2018-11-28
申请人： APPLIED MATERIALS, INC. , SALUGU, Srinivas , MÜLLER, Andreas , FRANKE, Sebastian , LOPP, Andreas , SCHÜSSLER, Uwe , AULBACH, Julian
发明人： SALUGU, Srinivas , MÜLLER, Andreas , FRANKE, Sebastian , LOPP, Andreas , SCHÜSSLER, Uwe , AULBACH, Julian
IPC分类号： C23C14/24 , C23C14/54
摘要： A deposition source for depositing evaporated material is described. The deposition source (100) includes a distribution arrangement (110) having a plurality of outlets (111) for providing an evaporated first material (A) and an evaporated second material (B) in a main deposition direction (101). Additionally, the deposition source includes a measurement assembly (120) for measuring a first deposition rate of the evaporated first material (A) and for measuring a second deposition rate of the evaporated second material (B). The measurement assembly (120) has a main detection direction (102) being in a cross direction to the main deposition direction (101). Further, the deposition source (100) includes a separation element (130) for separating the evaporated first material (A) and the evaporated second material (B) in a cross direction to the main detection direction (102). The separation element (130) is arranged in the main detection direction (102) between the plurality of outlets (111) and the measurement assembly (120).

4. 发明申请

WO2018010770A1 SPUTTER DEPOSITION SOURCE, SPUTTER DEPOSITION APPARATUS AND METHOD OF OPERATING A SPUTTER DEPOSITION SOURCE 审中-公开
标题翻译：溅射沉积源，溅射沉积装置和操作溅射沉积源的方法
公开(公告)号：WO2018010770A1
公开(公告)日：2018-01-18
申请号：PCT/EP2016/066551
申请日：2016-07-12
申请人： APPLIED MATERIALS, INC. , LINDENBERG, Ralph , BUSCHBECK, Wolfgang , LOPP, Andreas
发明人： LINDENBERG, Ralph , BUSCHBECK, Wolfgang , LOPP, Andreas
IPC分类号： H01J37/34
摘要： According to one aspect of the present disclosure, a sputter deposition source (100) with at least one electrode assembly (120) configured for two-side sputter deposition is provided. The electrode assembly (120) comprises: a cathode (125) for providing a target material to be deposited, wherein the cathode is configured for generating a first plasma (131) on a first deposition side (10) and a second plasma (141) on a second deposition side (11) opposite to the first deposition side (10); and an anode assembly (130) with at least one first anode (132) arranged on the first deposition side (10) for influencing the first plasma and at least one second anode (142) arranged on the second deposition side (11) for influencing the second plasma. According to a second aspect, a deposition apparatus with a sputter deposition source (100) is provided. Further, methods of operating a sputter deposition source are provided.
摘要翻译：根据本公开的一个方面，提供了具有至少一个配置用于双面溅射沉积的电极组件（120）的溅射沉积源（100）。所述电极组件（120）包括：用于提供待沉积的靶材料的阴极（125），其中所述阴极被配置用于在第一沉积侧（10）和第二等离子体（141）上产生第一等离子体（131）在与所述第一沉积侧（10）相对的第二沉积侧（11）上; 和阳极组件（130），其具有布置在第一沉积侧（10）上用于影响第一等离子体的至少一个第一阳极（132）和布置在第二沉积侧（11）上的至少一个第二阳极（142），用于影响第二个等离子体。根据第二方面，提供了一种具有溅射沉积源（100）的沉积设备。此外，提供了操作溅射沉积源的方法。

5. 发明申请

WO2018108240A1 APPARATUS FOR HOLDING A SUBSTRATE IN A VACUUM DEPOSITION PROCESS, SYSTEM FOR LAYER DEPOSITION ON A SUBSTRATE, AND METHOD FOR HOLDING A SUBSTRATE 审中-公开
公开(公告)号：WO2018108240A1
公开(公告)日：2018-06-21
申请号：PCT/EP2016/080665
申请日：2016-12-12
申请人： APPLIED MATERIALS, INC. , BUSCHBECK, Wolfgang , LOPP, Andreas , HAAS, Dieter , GOPARAJU, Hemanth
发明人： BUSCHBECK, Wolfgang , LOPP, Andreas , HAAS, Dieter , GOPARAJU, Hemanth
IPC分类号： C23C14/50 , C23C16/458 , H01J37/32 , H01L21/683 , C23C14/04 , C23C16/04
摘要： The present disclosure provides an apparatus (100) for holding a substrate (10) in a vacuum deposition process. The apparatus (100) includes a support surface (112), an electrode arrangement (120) having a plurality of electrodes (122) configured to provide an attracting force acting on at least one of the substrate (10) and a mask (20), and a controller (130) configured to apply a first voltage polarity configuration and a second voltage polarity configuration different from the first voltage polarity configuration to the electrode arrangement (120), wherein the controller (130) is configured to switch between the first voltage polarity configuration and the second voltage polarity configuration.

6. 发明申请

WO2022002349A1 NOZZLE ASSEMBLY, EVAPORATION SOURCE, DEPOSITION SYSTEM AND METHOD FOR DEPOSITING AN EVAPORATED MATERIAL ONTO A SUBSTRATE 审中-公开
公开(公告)号：WO2022002349A1
公开(公告)日：2022-01-06
申请号：PCT/EP2020/068257
申请日：2020-06-29
申请人： APPLIED MATERIALS, INC. , LOPP, Andreas , BANGERT, Stefan
发明人： LOPP, Andreas , BANGERT, Stefan
IPC分类号： C23C14/24 , C23C14/16 , C23C14/56 , H01M4/04 , H01M4/38 , C23C14/243 , C23C14/562 , C23C14/564 , C23C14/568 , H01M4/0423 , H01M4/1395 , H01M4/382
摘要： A nozzle assembly for guiding an evaporated material to a substrate is described. The nozzles assembly includes a plurality of nozzles, one or more nozzles of the plurality of nozzles include: a first nozzle section having a first end and a second end, the first nozzle section comprising a vapor outlet at the second end, and an orifice at or adjacent to the vapor outlet having an orifice diameter.

7. 发明申请

WO2016091303A1 MASK ARRANGEMENT FOR MASKING A SUBSTRATE IN A PROCESSING CHAMBER 审中-公开
标题翻译：用于在加工室中掩埋基材的掩模布置
公开(公告)号：WO2016091303A1
公开(公告)日：2016-06-16
申请号：PCT/EP2014/077257
申请日：2014-12-10
申请人： APPLIED MATERIALS, INC. , BANGERT, Stefan , VERCESI, Tommaso , GISLON, Daniele , HEIMEL, Oliver , LOPP, Andreas , HAAS, Dieter
发明人： BANGERT, Stefan , VERCESI, Tommaso , GISLON, Daniele , HEIMEL, Oliver , LOPP, Andreas , HAAS, Dieter
IPC分类号： C23C14/04 , C23C16/04 , C23C16/458
CPC分类号： C23C14/042 , C23C16/042 , C23C16/4587
摘要： A mask arrangement (100) for masking a substrate (10) in a processing chamber is provided. The mask arrangement (100) includes a mask frame (110) having one or more frame elements (112, 114, 116, 118) and is configured to support a mask device (120), wherein the mask device (120) is connectable to the mask frame (110); and at least one actuator (130) connectable to at least one frame element (112) of the one or more frame elements (112, 114, 116, 118), wherein the at least one actuator (130) is configured to apply a force to the at least one frame element (112).
摘要翻译：提供了用于掩蔽处理室中的基板（10）的掩模布置（100）。掩模装置（100）包括具有一个或多个框架元件（112,114,116,118）的掩模框架（110），并且被配置为支撑掩模装置（120），其中所述掩模装置（120）可连接到面罩框架（110）; 以及可连接到所述一个或多个框架元件（112,114,116,118）的至少一个框架元件（112）的至少一个致动器（130），其中所述至少一个致动器（130）构造成施加力到所述至少一个框架元件（112）。

8. 发明申请

WO2015139777A1 EVAPORATION SOURCE FOR ORGANIC MATERIAL 审中-公开
标题翻译：有机材料蒸发源
公开(公告)号：WO2015139777A1
公开(公告)日：2015-09-24
申请号：PCT/EP2014/055744
申请日：2014-03-21
申请人： APPLIED MATERIALS, INC. , DIEGUEZ-CAMPO, Jose, Manuel , BANGERT, Stefan , LOPP, Andreas , SCHÜSSLER, Uwe
发明人： DIEGUEZ-CAMPO, Jose, Manuel , BANGERT, Stefan , LOPP, Andreas , SCHÜSSLER, Uwe
IPC分类号： C23C14/24 , C23C14/04 , C23C14/56
CPC分类号： C23C14/243 , C23C14/042 , C23C14/56 , H01L51/001 , H01L51/0011 , H01L51/56
摘要： An evaporation source array for depositing two or more organic materials on a substrate is described. The evaporation source array includes two or more evaporation crucibles, wherein the two or more evaporation crucibles are configured to evaporate the two or more organic materials, two or more distribution pipes with outlets provided along the length of the two or more distribution pipes, wherein a first distribution pipe of the two or more distribution pipes is in fluid communication with a first evaporation crucible of the two or more evaporation crucibles, two or more heat shields, which surround the first distribution pipe, a cooling shield arrangement provided at at least one side of the two or more distribution pipes, wherein the at least one side is the side at which the outlets are provided, and a cooling element provided at or in the cooling shield arrangement for active cooling of the cooling shield arrangement.
摘要翻译：描述了用于在衬底上沉积两种或更多种有机材料的蒸发源阵列。蒸发源阵列包括两个或更多个蒸发坩埚，其中两个或更多个蒸发坩埚被配置为蒸发两个或更多个有机材料，两个或更多个分配管，其具有沿着两个或更多个分配管的长度设置的出口，其中两个或更多个分配管的第一分配管与两个或更多个蒸发坩埚的第一蒸发坩埚，围绕第一分配管的两个或更多个隔热罩流体连通，设置在至少一个侧面上的冷却屏蔽装置的两个或更多个分配管，其中所述至少一个侧面是设置所述出口的一侧，以及设置在所述冷却屏蔽装置中或所述冷却屏蔽装置中的用于主动冷却所述冷却屏蔽装置的冷却元件。

9. 发明申请

WO2013119383A1 DYNAMIC LOAD LOCK WITH CELLULAR STRUCTURE FOR DISCRETE SUBSTRATES 审中-公开
标题翻译：动态负载锁定用于分离基板的细胞结构
公开(公告)号：WO2013119383A1
公开(公告)日：2013-08-15
申请号：PCT/US2013/022534
申请日：2013-01-22
申请人： APPLIED MATERIALS, INC. , BUSCHBECK, Wolfgang , HENRICH, Juergen , LOPP, Andreas , SCHLAEFER, Susanne
发明人： BUSCHBECK, Wolfgang , HENRICH, Juergen , LOPP, Andreas
IPC分类号： H01L21/677 , H01L31/18 , H01L21/02
CPC分类号： H01L21/67739 , H01L21/67201
摘要： A dynamic load lock chamber that includes a plurality of actuators positioned along its length to achieve a desired pressure gradient from an atmospheric pressure side to a processing pressure side of the chamber is provided. The chamber includes a transport belt continuously running through the chamber to transport substrates from the atmospheric pressure side to the processing pressure side of the chamber, if situated on an inlet side of a production line, and from the processing pressure side to the atmospheric pressure side of the chamber, if positioned on an outlet side of the production line. Separation mechanisms may be attached to the belt to separate discrete regions within the chamber into a plurality of discrete volumes. Substrates may be disposed between the separation mechanisms, such that separation between adjacent pressure regions within the chamber is maintained as the substrates are transported through the chamber.
摘要翻译：提供一种动态负载锁定室，其包括沿其长度定位的多个致动器，以实现从室的大气压侧到处理压力侧的期望的压力梯度。所述腔室包括连续运行通过所述腔室的输送带，以将衬底从所述大气压侧输送到所述腔室的处理压力侧，如果位于生产线的入口侧，并且从处理压力侧到大气压侧如果位于生产线的出口侧。分离机构可以附接到带上以将腔室内的离散区域分离成多个离散体积。衬底可以设置在分离机构之间，使得当衬底被输送通过腔室时，保持室内的相邻压力区域之间的间隔。

10. 发明申请

WO2013103609A1 ADVANCED PLATFORM FOR PASSIVATING CRYSTALLINE SILICON SOLAR CELLS 审中-公开
标题翻译：用于过滤晶体硅太阳能电池的先进平台
公开(公告)号：WO2013103609A1
公开(公告)日：2013-07-11
申请号：PCT/US2012/072272
申请日：2012-12-31
申请人： APPLIED MATERIALS, INC. , PONNEKANTI, Hari K. , POLYAK, Alexander S. , L'HEUREUX, James , COX, Michael S. , LANE, Christopher T. , HAMMOND, Edward P., IV , MUNGEKAR, Hemant P. , SCHLAEFER, Susanne , BUSCHBECK, Wolfgang , HENRICH, Juergen , LOPP, Andreas
发明人： PONNEKANTI, Hari K. , POLYAK, Alexander S. , L'HEUREUX, James , COX, Michael S. , LANE, Christopher T. , HAMMOND, Edward P., IV , MUNGEKAR, Hemant P. , SCHLAEFER, Susanne , BUSCHBECK, Wolfgang , HENRICH, Juergen , LOPP, Andreas
IPC分类号： H01L31/18 , H01L31/042 , H01L31/0216
CPC分类号： H01L31/18 , C23C14/568 , C23C16/54 , H01L21/67115 , H01L21/67173 , H01L21/6776
摘要： The present invention generally provides a high throughput substrate processing system that is used to form one or more regions of a solar cell device. In one configuration of a processing system, one or more solar cell passivating or dielectric layers are deposited and further processed within one or more processing chambers contained within the high throughput substrate processing system. The processing chambers may be, for example, plasma enhanced chemical vapor deposition (PECVD) chambers, low pressure chemical vapor deposition (LPCVD) chambers, atomic layer deposition (ALD) chambers, physical vapor deposition (PVD) or sputtering chambers, thermal processing chambers (e.g., RTA or RTO chambers), substrate reorientation chambers (e.g., flipping chambers) and/or other similar processing chambers.
摘要翻译：本发明通常提供用于形成太阳能电池器件的一个或多个区域的高通量衬底处理系统。在处理系统的一种配置中，一个或多个太阳能电池钝化或电介质层被沉积并在包含在高通量衬底处理系统内的一个或多个处理室内进一步处理。处理室可以是例如等离子体增强化学气相沉积（PECVD）室，低压化学气相沉积（LPCVD）室，原子层沉积（ALD）室，物理气相沉积（PVD）或溅射室，热处理室（例如，RTA或RTO室），基板重新定向室（例如，翻转室）和/或其它类似的处理室。

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