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    • 3. 发明申请
    • APPARATUS AND METHOD FOR COATING A SUBSTRATE BY ROTARY TARGET ASSEMBLIES IN TWO COATING REGIONS
    • 用于通过两个涂层区域中的旋转靶组件涂覆基板的装置和方法
    • WO2015172835A1
    • 2015-11-19
    • PCT/EP2014/059975
    • 2014-05-15
    • APPLIED MATERIALS, INC.BENDER, MarcusPIERALISI, FabioSCHEER, EvelynSEVERIN, DanielGÄRTNER, HaraldLINDENBERG, Ralph
    • BENDER, MarcusPIERALISI, FabioSCHEER, EvelynSEVERIN, DanielGÄRTNER, HaraldLINDENBERG, Ralph
    • C23C14/22C23C14/35C23C14/56H01J37/34
    • C23C14/225C23C14/352C23C14/568H01J37/32733H01J37/3405H01J37/3417H01J37/3429H01J37/345H01J37/3452
    • According to an embodiment, a sputter deposition apparatus for coating a substrate is provided. The sputter deposition apparatus has two or more coating regions for coating the substrate. The sputter deposition apparatus includes a first substrate guiding system for guiding the substrate in a first coating region, wherein the first substrate guiding system defines a first substrate transport direction. The sputter deposition apparatus further includes a second substrate guiding system for guiding the substrate in a second coating region, the second substrate guiding system defining a second substrate transport direction. The second substrate transport direction is the same direction as the first substrate transport direction or is different from the first substrate transport direction. The sputter deposition apparatus further includes a first cathode assembly adapted for generating one or more plasma regions in the first coating region, a second cathode assembly adapted for generating one or more plasma regions in the first coating region, a third cathode assembly adapted for generating one or more plasma regions in the second coating region, and a fourth cathode assembly adapted for generating one or more plasma regions in the second coating region. The first cathode assembly includes: a first rotary target assembly adapted for rotating a target material around a first rotation axis; and a first magnet assembly fixedly positioned in the first rotary target assembly, the first magnet assembly having a first principal plane forming a first angle with a first reference plane which contains the first rotation axis and is perpendicular to the first substrate transport direction. The second cathode assembly includes: a second rotary target assembly adapted for rotating a target material around a second rotation axis; and a second magnet assembly fixedly positioned in the second rotary target assembly, the second magnet assembly having a second principal plane, the second principal plane being parallel to the first principal plane. The third cathode assembly includes: a third rotary target assembly adapted for rotating a target material around a third rotation axis; and a third magnet assembly fixedly positioned in the third rotary target assembly, the third magnet assembly having a third principal plane forming a second angle with a second reference plane which contains the third rotation axis and is perpendicular to the second substrate transport direction, wherein the second angle is different from the first angle. The fourth cathode assembly includes: a fourth rotary target assembly adapted for rotating a target material around a fourth rotation axis; and a fourth magnet assembly fixedly positioned in the fourth rotary target assembly, the fourth magnet assembly having a fourth principal plane, the fourth principal plane being parallel to the third principal plane.
    • 根据实施例,提供了一种用于涂覆基板的溅射沉积设备。 溅射沉积装置具有用于涂覆基板的两个或更多个涂覆区域。 溅射沉积设备包括用于在第一涂覆区域中引导衬底的第一衬底引导系统,其中第一衬底引导系统限定第一衬底输送方向。 溅射沉积设备还包括用于在第二涂覆区域中引导衬底的第二衬底引导系统,第二衬底引导系统限定第二衬底输送方向。 第二基板输送方向与第一基板输送方向相同,也可以不同于第一基板输送方向。 溅射沉积设备还包括适于在第一涂覆区域中产生一个或多个等离子体区域的第一阴极组件,适于在第一涂覆区域中产生一个或多个等离子体区域的第二阴极组件,适于产生一个 或更多的等离子体区域,以及适于在第二涂覆区域中产生一个或多个等离子体区域的第四阴极组件。 第一阴极组件包括:适于围绕第一旋转轴线旋转目标材料的第一旋转靶组件; 以及固定地定位在所述第一旋转靶组件中的第一磁体组件,所述第一磁体组件具有与包含所述第一旋转轴线且垂直于所述第一衬底输送方向的第一参考平面形成第一角度的第一主平面。 第二阴极组件包括:适于围绕第二旋转轴线转动目标材料的第二旋转靶组件; 以及固定地定位在所述第二旋转靶组件中的第二磁体组件,所述第二磁体组件具有第二主平面,所述第二主平面平行于所述第一主平面。 第三阴极组件包括:适于围绕第三旋转轴线转动目标材料的第三旋转靶组件; 以及固定地定位在所述第三旋转靶组件中的第三磁体组件,所述第三磁体组件具有第三主平面,所述第三主平面与包含所述第三旋转轴线且垂直于所述第二基板输送方向的第二参考平面形成第二角度,其中, 第二角度与第一角度不同。 第四阴极组件包括:适于围绕第四旋转轴线旋转目标材料的第四旋转靶组件; 以及固定地定位在所述第四旋转靶组件中的第四磁体组件,所述第四磁体组件具有第四主平面,所述第四主平面平行于所述第三主平面。