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1. 发明申请

WO2012116107A1 A NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE 审中-公开
标题翻译：用于在非导电基板的表面上创建连续导电电路的非绝缘技术
公开(公告)号：WO2012116107A1
公开(公告)日：2012-08-30
申请号：PCT/US2012/026182
申请日：2012-02-22
申请人： TAIWAN GREEN POINT ENTERPRISES CO., LTD. , JABIL CIRCUIT INC. , YI, Sheng-Hung , LIAO, Pen, Yi
发明人： YI, Sheng-Hung , LIAO, Pen, Yi
IPC分类号： H05K1/18 , H01L23/498
CPC分类号： H05K3/188 , C25D5/02 , C25D5/10 , H05K3/027 , H05K3/185 , H05K3/24 , H05K2203/107 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156
摘要： A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non- conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.
摘要翻译：在非导电衬底上制造连续导电电路的非有害方法可以开始于在非导电衬底的表面上施加金属基底层。可以基于电路设计在金属基底层内形成电路图案。包括电路图案的金属基层可以与非导电基底上的金属基底层的其余部分物理分离。包围电路图案的非导电性基板表面的区域可以称为电镀区域。非导电衬底表面的其余部分可以称为非电镀区域。可以在金属基底层上添加第一金属层。可以在电镀区域的第一金属层上添加第二金属层。第二金属层可以导电并限制在非电镀区域的第一金属层上的形成。

2. 发明申请

WO2008037811A1 METHOD FOR SENDING INFORMATION FROM BASE STATION TO RELAY STATION 审中-公开
标题翻译：从基站到中继站发送信息的方法
公开(公告)号：WO2008037811A1
公开(公告)日：2008-04-03
申请号：PCT/EP2007/060395
申请日：2007-10-01
申请人： NOKIA SIEMENS NETWORKS GMBH & CO. KG , LI, Hui , LI, Ping , XUE, Yi Sheng , ZIRWAS, Wolfgang
发明人： LI, Hui , LI, Ping , XUE, Yi Sheng , ZIRWAS, Wolfgang
IPC分类号： H04B7/15
CPC分类号： H04L27/3472 , H04B7/2606 , H04L27/3483 , H04L27/3488 , H04W16/26
摘要： The present invention provides a method for sending information from a base station to a relay station, comprising taking information from the base station to the relay station and information from the base station to a single-hop terminal as the additional message and the basic message respectively, superposing the additional message and the basic message together for modulating by using a hierarchical modulation mode; and sending the hierarchically modulated information by the base station to the relay station. By using the present invention, signaling information and/or delay sensitive operation data can be sent from the base station to the relay station in a timely manner, thus to improve system performance, and furthermore, by using the present invention it is possible not to employ additional system resources, so as to improve the utilization rate of system resources, namely, to improve the frequency spectrum efficiency.
摘要翻译：本发明提供了一种从基站向中继站发送信息的方法，包括从基站向中继站取信息，以及从基站到单跳终端的信息分别作为附加消息和基本信息，通过使用分级调制模式将附加消息和基本消息叠加在一起进行调制; 以及由所述基站向所述中继站发送所述分层调制信息。通过使用本发明，信令信息和/或延迟敏感操作数据可以及时地从基站发送到中继站，从而提高系统性能，此外，通过使用本发明，可以不使用采用额外的系统资源，提高系统资源的利用率，即提高频谱效率。

3. 发明申请

WO2006035321A3 STRUCTURALLY-ENHANCED INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE 审中-公开
标题翻译：结构化增强集成电路封装及其制造方法
公开(公告)号：WO2006035321A3
公开(公告)日：2006-07-20
申请号：PCT/IB2005003992
申请日：2005-05-05
申请人： UNITED TEST & ASSEMBLY CT LTD , KOLAN RAVI KANTH , TAN HIEN BOON , SUN YI-SHENG ANTHONY , KUAN LIM BENG , SHIVALINGAM KRISHNAMURTHY
发明人： KOLAN RAVI KANTH , TAN HIEN BOON , SUN YI-SHENG ANTHONY , KUAN LIM BENG , SHIVALINGAM KRISHNAMURTHY
IPC分类号： H01L23/31
CPC分类号： H01L21/566 , H01L23/3114 , H01L23/4334 , H01L2224/05573 , H01L2224/05647 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13147 , H01L2224/16 , H01L2224/73253 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/19041 , H01L2924/00014 , H01L2224/13099 , H01L2924/013
摘要： A chip scale integrated circuit package includes an integrated circuit chip which has a first face and a second face. A plurality of pillar bumps are formed on the first face of the integrated circuit chip. An encapsulant material encapsulates the sides and the first face of the integrated circuit chip, and the pillar bumps. Upper ends of the pillar bumps remain free form encapsulant material and a substantially planar surface is formed by an upper surface of the encapsulant material and the upper ends of the pillar bumps. A plurality of solder balls are mounted on the substantially planar surface in locations corresponding to the upper ends of the pillar bumps.
摘要翻译：芯片级集成电路封装包括具有第一面和第二面的集成电路芯片。在集成电路芯片的第一面上形成多个柱状凸块。封装材料封装集成电路芯片的侧面和第一面以及柱状凸块。柱状凸块的上端保持游离形式的密封剂材料，并且由密封剂材料的上表面和柱状凸块的上端形成基本平坦的表面。多个焊球安装在与柱状凸块的上端对应的位置上的基本平坦的表面上。

4. 发明申请

WO2004088727A8 MULTI-CHIP BALL GRID ARRAY PACKAGE AND METHOD OF MANUFACTURE 审中-公开
标题翻译：多芯球网阵列包装及其制造方法
公开(公告)号：WO2004088727A8
公开(公告)日：2004-12-29
申请号：PCT/IB2004001734
申请日：2004-04-02
申请人： UNITED TEST & ASSEMBLY CT LTD , INFINEON TECHNOLOGIES , CHEN FUNG LENG , KIM SEONG KWANG BRANDON , CHA WEE LIM , SUN YI-SHENG ANTHONY , HETZEL WOLFGANG , THOMAS JOCHEN
发明人： CHEN FUNG LENG , KIM SEONG KWANG BRANDON , CHA WEE LIM , SUN YI-SHENG ANTHONY , HETZEL WOLFGANG , THOMAS JOCHEN
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L25/10
CPC分类号： H01L24/32 , H01L23/13 , H01L23/3121 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2224/92147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01058 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A BGA package (500) is disclosed including a base IC structure (300) having a base substrate (302), with an opening (301c) running lengthwise therethrough. A first semiconductor chip (315) is mounted face-down on the base substrate (301) so that the bond pads (317) thereof are accessible through the opening (301c). The package (500) also includes a secondary IC structure (400) including a secondary substrate (401), having an opening (401c) running there through, and a second semiconductor chip (415). The second chip (415) is mounted face-down on the secondary substrate (401) so that the bond pads (417) thereof are accessible through the opening (401c) in the secondary substrate (401). An encapsulant (425) fills the opening (401c) in the secondary substrate (401) and forms a substantially planar surface (425a) over the underside of the secondary substrate (401). The substantially planar surface (425a) is mounted to the first chip (315) of the base IC structure (300) through an adhesive (504). Wires (521) connect a conductive portion (406) of the secondary IC structure (400) to a conductive portion (303) of the base IC structure (300).
摘要翻译：公开了一种BGA封装（500），其包括具有基底基板（302）的基底IC结构（300），其中纵向延伸穿过其中的开口（301c）。第一半导体芯片（315）正面朝下地安装在基底（301）上，使得其接合焊盘（317）可通过开口（301c）接近。封装（500）还包括具有第二衬底（401）的辅助IC结构（400），其具有在其上延伸的开口（401c）和第二半导体芯片（415）。第二芯片（415）正面朝下安装在辅助基板（401）上，使得其接合焊盘（417）可通过次级基板（401）中的开口（401c）接近。密封剂（425）填充次级衬底（401）中的开口（401c）并在次级衬底（401）的下侧上形成基本平坦的表面（425a）。基本平坦的表面（425a）通过粘合剂（504）安装到基座IC结构（300）的第一芯片（315）上。电线（521）将二次IC结构（400）的导电部（406）与基极IC结构（300）的导电部（303）连接。

5. 发明申请

WO2004070790A2 MOLDED HIGH DENSITY ELECTRONIC PACKAGING STRUCTURE FOR HIGH PERFORMANCE APPLICATIONS 审中-公开
标题翻译：模具高密度电子包装结构，用于高性能应用
公开(公告)号：WO2004070790A2
公开(公告)日：2004-08-19
申请号：PCT/US2004/002985
申请日：2004-02-03
申请人： UNITED TEST AND ASSEMBLY CENTER LTD. , XILINX INC. , GOH, Kim Yong , KAPOOR, Rahul , SUN, Anthony Yi-Sheng , CHONG, Desmond Yok Rue , HOANG, Lan H.
发明人： GOH, Kim Yong , KAPOOR, Rahul , SUN, Anthony Yi-Sheng , CHONG, Desmond Yok Rue , HOANG, Lan H.
IPC分类号： H01L
CPC分类号： H01L23/4334 , H01L23/04 , H01L23/3128 , H01L23/36 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L25/0655 , H01L2224/16 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/1659 , H01L2924/167 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00015 , H01L2224/05599 , H01L2224/0401 , H01L2924/00
摘要： A thermally enhanced ball grid array package is disclosed. The package includes a base layer element and a flip chip die mounted on the base layer element. The die has a first surface electrically coupled to the base layer element, a second surface opposite to the first surface, and lateral sides. A molding compound encapsulates the base layer element and the lateral sides of the die. A surface is formed of the second surface of the die and an upper surface of the molding compound. A material is disposed on the surface, and a heat spreader is mounted on the material.
摘要翻译：公开了一种热增强球栅阵列封装。封装包括安装在基底层元件上的基底元件和倒装芯片裸片。模具具有电耦合到基层元件的第一表面，与第一表面相对的第二表面和横向侧面。模制化合物封装基底层元件和模具的侧面。表面由模具的第二表面和模塑料的上表面形成。材料设置在表面上，散热器安装在材料上。

6. 发明申请

WO2008092908A2 METHOD, SYSTEM, RELAY STATION AND BASE STATION FOR TRANSMITTING DATA IN MOBILE COMMUNICATION 审中-公开
标题翻译：方法，系统，移动站和基站在移动通信中传输数据
公开(公告)号：WO2008092908A2
公开(公告)日：2008-08-07
申请号：PCT/EP2008051150
申请日：2008-01-30
申请人： NOKIA SIEMENS NETWORKS GMBH , LI HUI , LI PING , WANG XINGLIN , LIU TAO , XUE YI SHENG , YU DAN , ZIRWAS WOLFGANG
发明人： LI HUI , LI PING , WANG XINGLIN , LIU TAO , XUE YI SHENG , YU DAN , ZIRWAS WOLFGANG
IPC分类号： H04W16/26 , H04W16/32 , H04W36/22 , H04W48/12 , H04W72/04 , H04W72/08 , H04W74/08 , H04W84/04 , H04W88/08
CPC分类号： H04B7/2606 , H04B7/15557 , H04W16/26 , H04W24/02 , H04W72/0406 , H04W72/085 , H04W84/047
摘要： The present invention provides a data transmission method in mobile communication for a cell having one base station and more than one relay station, the method comprises switching the relay stations between at least two operating modes of signaling transmission under the control of the base station. The present invention also provides a system for transmitting data in mobile communication in a cell having one base station and more than one relay station, wherein when transmitting an uplink signaling or a downlink signaling, the relay stations switch between at least two operating modes under the control of the base station. The present invention also provides a relay station and a base station. By using the method, network, relay station, and base station of the present invention, the data transmission in multiple modes can be achieved, so as to achieve a flexible relay scheme.
摘要翻译：本发明提供了一种用于具有一个基站和多于一个中继站的小区的移动通信中的数据传输方法，该方法包括在基站的控制下在至少两个信令传输的操作模式之间切换中继站。本发明还提供了一种用于在具有一个基站和多于一个中继站的小区中发送移动通信中的数据的系统，其中当发送上行链路信令或下行链路信令时，中继站在至少两个操作模式之间切换，控制基站。本发明还提供一种中继站和基站。通过使用本发明的方法，网络，中继站和基站，可以实现多种模式的数据传输，从而实现灵活的中继方案。

7. 发明申请

WO2008049889A1 A METHOD AND APPARATUS OF USING A RELAY STATION TO ASSIST PROCESSING OF REQUESTS FROM USER ENDS 审中-公开
标题翻译：使用中继站协助用户端请求处理的方法和装置
公开(公告)号：WO2008049889A1
公开(公告)日：2008-05-02
申请号：PCT/EP2007/061483
申请日：2007-10-25
申请人： NOKIA SIEMENS NETWORKS GMBH & CO. KG , LI, Hui , LI, Ping , LIU, Tao , XUE, Yi Sheng , YU, Dan , ZIRWAS, Wolfgang
发明人： LI, Hui , LI, Ping , LIU, Tao , XUE, Yi Sheng , YU, Dan , ZIRWAS, Wolfgang
IPC分类号： H04Q7/32
CPC分类号： H04W28/08 , H04B7/2606 , H04W72/0406 , H04W84/047
摘要： The present invention provides a method of using a relay station to assist processing of requests from user ends (UEs), comprising: the relay station acquires and monitors channel resource information received from a base station; upon receiving a request from the UEs via the channel resource, the relay station sends the request received to the base station if it detects no response from the base station to the request. The present invention further provides an apparatus of using a relay station to assist processing of requests from UEs, comprising a channel resource acquisition unit for acquiring channel resource information from the base station; a user monitoring unit for monitoring the channel resource acquired by the channel resource acquisition unit and for receiving requests sent from the UEs; a base station monitoring unit for monitoring response from the base station to the requests upon receiving the requests sent from the UEs; a transmitting unit for sending the request to the base station when no response from the base station to the request is detected.
摘要翻译：本发明提供一种使用中继站来辅助来自用户端（UE）的请求的处理的方法，包括：所述中继站获取和监视从基站接收的信道资源信息; 在经由信道资源从UE接收到请求时，如果中继站检测到来自基站的请求没有响应，则将所接收的请求发送到基站。本发明还提供一种使用中继站来辅助来自UE的请求的处理的装置，包括：用于从基站获取信道资源信息的信道资源获取单元; 用户监视单元，用于监视由信道资源获取单元获取的信道资源，并用于接收从UE发送的请求; 基站监视单元，用于在接收到从UE发送的请求时监视从基站到请求的响应; 发送单元，用于当没有检测到基站对请求的响应时，向基站发送请求。

8. 发明申请

WO2008042949A2 DUAL-POLARITY MASS SPECTROMETER 审中-公开
标题翻译：双极性质谱分析仪
公开(公告)号：WO2008042949A2
公开(公告)日：2008-04-10
申请号：PCT/US2007080284
申请日：2007-10-03
申请人： ACADEMIA SINICA , WANG YI-SHENG , CHEN CHUNG-HSUAN , TSAI SHANG-TING , CHEN CHIU WEN
发明人： WANG YI-SHENG , CHEN CHUNG-HSUAN , TSAI SHANG-TING , CHEN CHIU WEN
IPC分类号： H01J49/00
CPC分类号： H01J49/40 , H01J49/0095
摘要： A dual-polarity mass spectrometer includes an ion source, a negative ion mass analyzer, and a positive ion mass analyzer to measure both the negative and positive ion spectra of a sample material simultaneously. The ion source includes a sample surface on which the sample material is positioned, the sample material providing positive ions and negative ions when excited by a laser beam or an energetic particle stream. A first extraction electrode is connected to a voltage higher than the sample surface to attract the negative ions from the sample electrode. A second extraction electrode is connected to a voltage lower than the sample surface to attract the positive ions from the sample electrode. The negative and positive ions are analyzed simultaneously by the negative ion mass analyzer and the positive ion mass analyzer, respectively.
摘要翻译：双极性质谱仪包括离子源，负离子质量分析仪和正离子质量分析仪，可同时测量样品材料的负离子和正离子谱。离子源包括其上放置样品材料的样品表面，样品材料在被激光束或高能粒子流激发时提供正离子和负离子。第一引出电极连接到高于样品表面的电压以吸引来自样品电极的负离子。第二引出电极连接到低于样品表面的电压以吸引来自样品电极的正离子。负离子质量分析仪和正离子质量分析仪分别同时分析负离子和正离子。

9. 发明申请

WO2008037814A1 CONNECTION IDENTITY ALLOCATION METHOD 审中-公开
标题翻译：连接身份分配方法
公开(公告)号：WO2008037814A1
公开(公告)日：2008-04-03
申请号：PCT/EP2007/060408
申请日：2007-10-01
申请人： NOKIA SIEMENS NETWORKS GMBH & CO. KG , LI, Hui , LI, Ping , XUE, Yi Sheng , ZIRWAS, Wolfgang
发明人： LI, Hui , LI, Ping , XUE, Yi Sheng , ZIRWAS, Wolfgang
IPC分类号： H04Q7/32
CPC分类号： H04W76/11 , H04B7/2606 , H04W8/26 , H04W16/26 , H04W84/047 , H04W88/04
摘要： This invention describes a type of connection identity allocation method, for use in Wimax, whereby the network allocates cells connected by an ownership relationship to the same relay station to association-cell-sets, and allocates a connection identity group to the aforementioned relay station, so that terminals may communicate with a cell within the association-cell-set using connection identities in the connection identity group, through the following steps: The network informs the target cell which has an ownership relationship with the relay station to reserve the aforementioned connection identity group, where the aforementioned target cell belongs to the aforementioned cell set; the transfer of relay station ownership occurs, and the original cell releases the connection identity with the terminal; the terminal then uses the reserved connection identity in the connection identity group to communicate with the aforementioned target cell. The use of this invention can avoid signal interchanges during the connection identity reallocation negotiation procedure, simplifies the relay station ownership transfer signal procedure, thus reducing time delays, improving service quality, and reducing line drop rates.
摘要翻译：本发明描述了一种在Wimax中使用的连接身份分配方法，其中网络将通过所有权关系连接的小区分配给相同的中继站以进行关联小区集合，并且向上述中继站分配连接身份组，使得终端可以通过以下步骤使用连接身份组中的连接身份与关联小区集合内的小区进行通信：网络通知与中继站具有所有权关系的目标小区以保留上述连接身份组，其中上述目标小区属于上述小区集合; 中继站所有权转移发生，原始信元与终端发布连接身份; 终端然后使用连接身份组中的预留连接身份与上述目标小区进行通信。本发明的使用可以避免连接身份重新分配协商过程中的信号交换，简化了中继站所有权转移信号的过程，从而减少了延时，提高了业务质量，降低了线路丢包率。

10. 发明申请

WO2008037733A1 PERFORMING CHANNEL AWARE RELAYS IN AN ENHANCED RELAY CLUSTER 审中-公开
标题翻译：在增强型继电器集群中执行通道识别继电器
公开(公告)号：WO2008037733A1
公开(公告)日：2008-04-03
申请号：PCT/EP2007/060202
申请日：2007-09-26
申请人： NOKIA SIEMENS NETWORKS GMBH & CO. KG , LI, Hui , LIU, Tao , WANG, Xinglin , XUE, Yi Sheng , ZIRWAS, Wolfgang
发明人： LI, Hui , LIU, Tao , WANG, Xinglin , XUE, Yi Sheng , ZIRWAS, Wolfgang
IPC分类号： H04L12/28
CPC分类号： H04W16/26 , H04B7/15542 , H04B7/2606 , H04W76/20 , H04W84/047
摘要： This invention provides a type of method used for providing channel aware relays in enhanced relay clusters. This method is based on the Centralized Cluster Relay Implementation Proposal, and is implemented by transferring MMR-BS channel information based functions to RS. Specifically, in this invention, RS receives authorization from the MMR-BS to receive the channel information from the MS or next single-hop RS point within its single-hop range, and, after performing applicable channel aware relays, reports the processing result to MMR-BS; MMR-BS configures the signal according to the processing result and joins RS to transmit the control signal to the cluster MS. Using the method provided by this invention can reduce the channel overhead between MMR-BS and RS, and at the same time ensure that the RS composition is simple, and the production costs are low.
摘要翻译：本发明提供了一种用于在增强型继电器集群中提供信道感知中继的方法。该方法基于集中式集群中继实施方案，通过将基于MMR-BS信道信息的功能转移给RS来实现。具体地说，在本发明中，RS接收来自MMR-BS的授权，从MS或其单跳范围内的下一个单跳RS点接收信道信息，在执行适用的信道识别中继之后，将处理结果报告给 MMR-BS; MMR-BS根据处理结果配置信号，并连接RS将控制信号发送到集群MS。使用本发明提供的方法可以降低MMR-BS和RS之间的信道开销，同时确保RS组合简单，生产成本低。

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