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1. 发明申请

WO2007001178A2 PRESS WITH PLATE-LIKE FRAME PARTS, AND METHOD FOR OPERATING SUCH A PLATE PRESS 审中-公开
标题翻译：按照类似框架部件的压力，以及操作这种板式压力的方法
公开(公告)号：WO2007001178A2
公开(公告)日：2007-01-04
申请号：PCT/NL2006/050100
申请日：2006-04-25
申请人： FICO B.V. , VENROOIJ, Johannes, Lambertus, Gerardus, Maria , VERKUIJLEN, Adrianus, Henricus, Ignatius, Maria
发明人： VENROOIJ, Johannes, Lambertus, Gerardus, Maria , VERKUIJLEN, Adrianus, Henricus, Ignatius, Maria
IPC分类号： B29C45/67 , B29C33/24 , B29C45/02 , B29C45/27
CPC分类号： B29C45/02 , B29C33/24 , B29C45/14655 , B29C45/2701 , B29C45/67 , B29C45/68
摘要： The present invention relates to a press for encapsulating electronic components, comprising: two displaceable mould parts, feed means for encapsulating material, and a drive mechanism provided with a fluid bed connecting onto the mould parts. The present invention also provides a press which is provided with a displacer whereby the encapsulating material fed between the mould parts by the feed means can be placed under an increased pressure. Furthermore, the present invention relates to methods for encapsulating electronic components with encapsulating material in such presses.
摘要翻译：本发明涉及一种用于封装电子部件的压力机，包括：两个可移位的模具部件，用于封装材料的进给装置，以及设置有连接到模具部件上的流体床的驱动机构。本发明还提供了一种具有置换器的压力机，由此通过进料装置在模具部件之间供给的密封材料可以放置在增加的压力下。此外，本发明涉及在这种压机中用封装材料密封电子部件的方法。

2. 发明申请

WO2005120799A1 METHOD AND DEVICE FOR CONTROLLABLE ENCAPSULATION OF ELECTRONIC COMPONENTS 审中-公开
标题翻译：用于电子元件可控制的方法和装置
公开(公告)号：WO2005120799A1
公开(公告)日：2005-12-22
申请号：PCT/NL2005/000421
申请日：2005-06-09
申请人： FICO B.V. , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
发明人： VENROOIJ, Johannes, Lambertus, Gerardus, Maria
IPC分类号： B29C45/02
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/462 , B29C45/73 , B29C2033/023 , B29C2045/7343
摘要： The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mould cavity, C) filling the mould cavity, and D) curing the encapsulating material in the mould cavity. Whereby the temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature barrier (15, 16). The invention also relates to a device for encapsulating electronic components mounted on a carrier.
摘要翻译：本发明涉及一种封装安装在载体上的电子部件的方法，包括以下处理步骤：A）加热封装材料，B）将封装材料置于模具腔中，C）填充模腔，D）固化封装材料在模腔中。由此，通过由至少一个温度屏障（15,16）产生至少部分地彼此热分离的不同温度区，在由封装材料覆盖的路径的单独部分期间进行封装材料的温度调节。本发明还涉及一种用于封装安装在载体上的电子部件的装置。

3. 发明申请

WO2003049177A2 METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS WHILE EXERTING FLUID PRESSURE 审中-公开
标题翻译：在流体压力下封装电子元件的方法和装置
公开(公告)号：WO2003049177A2
公开(公告)日：2003-06-12
申请号：PCT/NL2002/000797
申请日：2002-12-05
申请人： FICO B.V. , PETERS, Hendrikus, Johannes, Bernardus , GAL, Wilhelmus, Gerardus, Jozef , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
发明人： PETERS, Hendrikus, Johannes, Bernardus , GAL, Wilhelmus, Gerardus, Jozef , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
IPC分类号： H01L21/56
CPC分类号： B29C45/14655 , B29C45/1703 , H01L21/565 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to a method for encapsulating electronic components, in particular semiconductors, by receiving a component for encapsulating between two mould halves displaceable relative to each other and feeding a liquid encapsulating material under overpressure by means of a transfer mechanism to at least one mould cavity arranged for this purpose, characterized in that during feeding of liquid encapsulating material to the mould cavity the part of the mould cavity not yet filled with encapsulating material is filled with a gas under overpressure. The invention also relates to a device for encapsulating electronic components.
摘要翻译：本发明涉及一种用于封装电子元件，特别是半导体的方法，该方法是通过接收用于封装在相对于彼此可移位的两个半模之间的部件，并且借助于转移机构将液体封装材料输送到至少一个模腔为此目的设置，其特征在于，在将液体封装材料供给到模具腔的同时，还没有填充封装材料的模腔的一部分在超压下被填充气体。本发明还涉及一种用于封装电子部件的装置。

4. 发明申请

WO1991008095A2 SINGLE-STRIP MOULDING APPARATUS 审中-公开
标题翻译：单条造型设备
公开(公告)号：WO1991008095A2
公开(公告)日：1991-06-13
申请号：PCT/EP1990002032
申请日：1990-11-23
申请人： ASM FICO TOOLING B.V. , VENROOIJ, Johannes, Lambertus, Gerardus, Maria , VERWOERD, Wouter, Bastiaan , HARMSEN, Wilhelmus, Hendrikus, Johannes
发明人： ASM FICO TOOLING B.V.
IPC分类号： B29C33/72
CPC分类号： H01L21/67126 , B29C31/066 , B29C31/08 , B29C33/20 , B29C33/72 , B29C37/0007 , B29C43/02 , B29C43/32 , B29C43/34 , B29C45/021 , B29C45/14655 , B29C45/1753 , B29C45/42 , B29C45/661 , B29C45/6707 , B29C70/72 , B29C2043/3283 , B29C2043/3444 , B29C2043/5833 , B29C2045/662 , B29K2105/251 , B30B1/103 , B30B1/323 , B30B15/0082 , B30B15/148 , Y10S425/228
摘要： Electronic components, chips, are moulded in a single-strip moulding apparatus. The products to be moulded are placed in a mould consisting of two halves, one of the halves whereof displays recesses for receiving a component, which half is connected via a channel with a cavity for receiving a quantity of moulding material. After use the mould must be cleaned and the moulded product carried away. This is carried out by a cleaning-discharge unit combined into a unit.
摘要翻译：电子部件，芯片被模制在单条成型装置中。要成型的产品放置在由两个半部组成的模具中，其中一个半部显示用于接收部件的凹部，其中一半通过通道与用于接收一定量成型材料的空腔连接。使用后必须清洁模具，并将模制品带走。这是通过组合成一个单元的清洗 - 放电单元进行的。

5. 发明申请

WO2010008287A1 METHOD FOR ENCAPSULATING ELECTRONIC COMPONENTS WITH A CONTROLLABLE CLOSING FORCE 审中-公开
标题翻译：用可控制的封闭力封装电子元件的方法
公开(公告)号：WO2010008287A1
公开(公告)日：2010-01-21
申请号：PCT/NL2009/050437
申请日：2009-07-16
申请人： FICO B.V. , GAL, Wilhelmus Gerardus Jozef , VENROOIJ, Johannes Lambertus Gerardus , FIERKENS, Henricus Antonius Maria
发明人： GAL, Wilhelmus Gerardus Jozef , VENROOIJ, Johannes Lambertus Gerardus , FIERKENS, Henricus Antonius Maria
IPC分类号： B29C45/02 , B29C45/14 , B29C45/76 , H01L21/56
CPC分类号： B29C45/7653 , B29C45/02 , B29C45/14655 , B29C45/77 , B29C2945/76006 , B29C2945/76013 , B29C2945/76214 , B29C2945/7626 , B29C2945/76287 , B29C2945/76381 , B29C2945/76505 , B29C2945/76709 , B29C2945/76882 , B29C2945/76933 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: moving a number of mould parts (2, 3) toward each other with a closing force whereby the electronic component is enclosed by a mould cavity (5), exerting pressure on a liquid encapsulating material, filling the mould cavity (5) with encapsulating material, and curing the encapsulating material, wherein the pressure on the encapsulating material is measured, and the closing force of the mould parts and the exerted pressure are dependent on each other.
摘要翻译：本发明涉及一种封装安装在载体上的电子元件的方法，包括以下步骤：用一个闭合力将多个模具部件（2,3）彼此移动，由此电子部件被模腔封闭（ 5），对液体封装材料施加压力，用封装材料填充模腔（5）并固化封装材料，其中测量封装材料上的压力，并且模具部件的闭合力和施加的压力彼此依赖。

6. 发明申请

WO2008100146A2 METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS USING UNDERPRESSURE 审中-公开
标题翻译：使用欠压封装电子元件的方法和装置
公开(公告)号：WO2008100146A2
公开(公告)日：2008-08-21
申请号：PCT/NL2008/050088
申请日：2008-02-15
申请人： FICO B.V. , VENROOIJ, Johannes, Lambertus, Gerardus, Maria , GAL, Wilhelmus, Gerardus, Jozef , VAN HAREN, Lambertus, Franciscus, Wilhelmus
发明人： VENROOIJ, Johannes, Lambertus, Gerardus, Maria , GAL, Wilhelmus, Gerardus, Jozef , VAN HAREN, Lambertus, Franciscus, Wilhelmus
IPC分类号： H01L21/56 , B29C45/34 , B29C45/76
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/34 , B29C45/76 , B29C2945/76083 , B29C2945/762 , B29C2945/76381 , B29C2945/76498 , B29C2945/76735 , B29C2945/76859 , H01L21/56 , H01L21/565 , H01L23/3121 , H01L24/97 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to a method for encapsulating electronic components mounted on a carrier using underpressure, comprising the processing steps of: A) placing an electronic component in a mould cavity, B) heating encapsulating material, C) displacing the encapsulating material to the mould cavity, D) filling the mould cavity, and E) curing the encapsulating material in the mould cavity. The invention also relates to a device with which such a method can be performed.
摘要翻译：本发明涉及一种使用负压封装安装在载体上的电子部件的方法，包括以下处理步骤：A）将电子部件放置在模腔中，B）加热封装材料，C）将封装材料移动到模腔，D）填充模腔，和E）固化模腔中的封装材料。本发明还涉及可以执行这种方法的装置。

7. 发明申请

WO1997035701A1 PRESS FOR ENCAPSULATING ELECTRONIC COMPONENTS AND METHODS FOR USE OF THE PRESS 审中-公开
标题翻译：用于封装电子元件的压力和使用压力的方法
公开(公告)号：WO1997035701A1
公开(公告)日：1997-10-02
申请号：PCT/NL1997000142
申请日：1997-03-19
申请人： FICO B.V. , HARMSEN, Wilhelmus, Hendrikus, Johannes , VAN HAREN, Lambertus, Franciscus, Wilhelmus , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
发明人： FICO B.V.
IPC分类号： B29C33/22
CPC分类号： H01L21/67126 , B29C33/22 , B29C45/021 , B29C45/661
摘要： The invention relates to a device for encapsulating electronic components, mounted on so-called lead frames, in a mould assembled from two mould halves (2, 3) movable relative to each other and closable onto each other. The means for causing the mould halves to move and to close are formed by a rotatable eccentric which can be coupled to one of the mould halves with interposing of at least one connecting rod (11). The invention also relates to a method for driving such a device. Another aspect of the invention relates to an encapsulating device wherein a one mould half (3) is connectable to the means for causing the mould halves to move and close and the second mould half (2) is connectable to a counter-plate (21) which forms part of the device, which counter-plate is displaceable between two end positions. Yet another aspect of the invention relates to an encapsulating device with a counter-plate (21), which counter-plate comprises: a plurality of stacked, substantially plate-like parts (27, 28), between which parts at least one shaft (29, 30) is placed. Finally, a last aspect of the invention is formed by means for exerting pressure on encapsulating material comprising at least two screw spindles (32, 33, 34, 35).
摘要翻译：本发明涉及一种用于将安装在所谓的引线框架上的电子元件封装在由相对于彼此可相对移动并相互封闭的两个半模（2,3）组装的模具中的封装装置。用于使半模移动和关闭的装置由可旋转的偏心轮形成，其可以通过插入至少一个连杆（11）而联接到一个半模。本发明还涉及一种用于驱动这种装置的方法。本发明的另一方面涉及一种封装装置，其中一个半模（3）可连接到用于使半模移动和关闭的装置，并且第二半模（2）可连接到对置板（21）其形成装置的一部分，该对置板可在两个端部位置之间移位。本发明的另一方面涉及一种具有反平板（21）的封装装置，该对置板包括：多个堆叠的基本上板状的部件（27,28），其间至少有一个轴（ 29，30）。最后，本发明的最后一个方面是通过对包含至少两个螺杆心轴（32,33,34,35）的包封材料施加压力的方式形成的。

8. 发明申请

WO2013009180A1 DEVICE FOR CLEANING AN ENCAPSULATING DEVICE FOR ELECTRONIC COMPONENTS 审中-公开
标题翻译：用于清洁电子部件的封装装置的装置
公开(公告)号：WO2013009180A1
公开(公告)日：2013-01-17
申请号：PCT/NL2012/050500
申请日：2012-07-12
申请人： FICO B.V. , VENROOIJ, Johannes Lambertus Gerardus Maria , VAN DRIEL, Albertus Franciscus Gerardus
发明人： VENROOIJ, Johannes Lambertus Gerardus Maria , VAN DRIEL, Albertus Franciscus Gerardus
IPC分类号： B08B1/00 , B08B1/02 , B29C33/72 , A46B17/02
CPC分类号： B08B1/007 , A46B5/0004 , A46B17/02 , A46B2200/30 , B08B1/008 , B08B1/02 , B29C33/72
摘要： The invention relates to an assembly (2) for cleaning an encapsulating device (1) for electronic components which consists of a brush (13) with brush elements (14), a drive (16) for displacing the brush (13), a protruding contact element (10) and a suction device (12). The invention further also relates to an encapsulating device (1) for electronic components provided with such a cleaning assembly (2) and to a method for cleaning an encapsulating device (1) for electronic components.
摘要翻译：本发明涉及一种用于清洁电子部件的封装装置（1）的组件（2），该组件由具有刷子元件（14）的刷子（13），用于移动刷子（13）的驱动器（16）接触元件（10）和抽吸装置（12）。本发明还涉及一种用于具有这种清洁组件（2）的电子部件的封装装置（1）以及用于清洁电子部件的封装装置（1）的方法。

9. 发明申请

WO2008100146A3 METHOD AND DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS USING UNDERPRESSURE 审中-公开
标题翻译：用于使用无压缩来包封电子元件的方法和装置
公开(公告)号：WO2008100146A3
公开(公告)日：2008-11-27
申请号：PCT/NL2008050088
申请日：2008-02-15
申请人： FICO BV , VENROOIJ JOHANNES LAMBERTUS GERARDUS MARIA , GAL WILHELMUS GERARDUS JOZEF , VAN HAREN LAMBERTUS FRANCISCUS WILHELMUS
发明人： VENROOIJ JOHANNES LAMBERTUS GERARDUS MARIA , GAL WILHELMUS GERARDUS JOZEF , VAN HAREN LAMBERTUS FRANCISCUS WILHELMUS
IPC分类号： H01L21/56 , B29C45/34 , B29C45/76
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/34 , B29C45/76 , B29C2945/76083 , B29C2945/762 , B29C2945/76381 , B29C2945/76498 , B29C2945/76735 , B29C2945/76859 , H01L21/56 , H01L21/565 , H01L23/3121 , H01L24/97 , H01L2224/48091 , H01L2924/00014
摘要： The invention relates to a method for encapsulating electronic components mounted on a carrier using underpressure, comprising the processing steps of: A) placing an electronic component in a mould cavity, B) heating encapsulating material, C) displacing the encapsulating material to the mould cavity, D) filling the mould cavity, and E) curing the encapsulating material in the mould cavity. The invention also relates to a device with which such a method can be performed.
摘要翻译：本发明涉及一种使用负压封装安装在载体上的电子元件的方法，包括以下处理步骤：A）将电子元件放置在模腔中，B）加热封装材料，C）将封装材料移动到模腔，D）填充模腔，以及E）固化模腔中的封装材料。本发明还涉及一种可以执行这种方法的设备。

10. 发明申请

WO2007001179A3 METHOD AND DEVICE FOR SUPPLYING AND DISCHARGING CARRIERS WITH ELECTRONIC COMPONENTS 审中-公开
公开(公告)号：WO2007001179A3
公开(公告)日：2007-01-04
申请号：PCT/NL2006/050101
申请日：2006-04-25
申请人： FICO B.V. , VAN DRIEL, Albertus, Franciscus, Gerardus , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
发明人： VAN DRIEL, Albertus, Franciscus, Gerardus , VENROOIJ, Johannes, Lambertus, Gerardus, Maria
IPC分类号： H01L21/677 , H01L21/00 , H05K13/00 , B29C45/14
摘要： The invention relates to methods for displacing a carrier (2, 32) with electronic components from a supply container (1, 24, 35) to a processing station (20, 31) , methods for displacing a carrier (2, 32) with electronic components from a processing station(20, 31) to a supply container (3,45) , as well as to methods for supplying to a processing station(20, 31) and discharging from a processing station (20, 31) of carriers (2 , 32) with electronic components. The invention also relates to devices (30) for displacing a carrier (2, 32) with electronic components between a supply container (1, 3, 24, 35,45) and a processing station(20, 31) , and to an assembly of such devices (30) with a processing station (20, 31) for carriers (2, 32) with electronic components .

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